公开(公告)号：US10069051B2

公开(公告)日：2018-09-04

申请号：US15403057

申请日：2017-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: H01L33/58 ,  H01L21/56 ,  H01L33/56 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L33/00 ,  H01L25/16

Abstract: A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier.

公开(公告)号：US11276806B2

公开(公告)日：2022-03-15

申请号：US16734046

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen Chiang ,  Kuang-Hsiung Chen ,  Lu-Ming Lai ,  Hsun-Wei Chan ,  Hsin-Ying Ho ,  Shih-Chieh Tang

IPC: H01L33/54 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62 ,  H01L31/0232

Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.

公开(公告)号：US10862014B2

公开(公告)日：2020-12-08

申请号：US14939331

申请日：2015-11-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Shih-Chieh Tang

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/46 ,  H01L33/48 ,  H01L33/62

Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.

公开(公告)号：US10436635B2

公开(公告)日：2019-10-08

申请号：US15267028

申请日：2016-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen Chiang ,  Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: G01J1/04 ,  H01L31/0203 ,  H01L33/54 ,  H01L33/58 ,  H01L31/0232 ,  H01L25/16 ,  G01J1/42

Abstract: An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.

公开(公告)号：US10424566B2

公开(公告)日：2019-09-24

申请号：US15396079

申请日：2016-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung-Wei Hsu ,  Hsin-Ying Ho ,  Hsun-Wei Chan

IPC: H01L25/16 ,  H01L31/0216 ,  G01S17/06 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/167

Abstract: An electronic device comprises a carrier, an emitter, a detector, a separation wall and a light shielding layer. The emitter is disposed on a first portion of the top surface of the carrier. The detector is disposed on a second portion of the top surface of the carrier. The separation wall is disposed on the top surface of the carrier between the emitter and the detector. The light shielding layer disposed adjacent to the top surface of the carrier and extends from the separation wall to the second portion of the carrier.

公开(公告)号：US09911877B2

公开(公告)日：2018-03-06

申请号：US15347664

申请日：2016-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Chia Yun Hsu ,  Tsung-Yu Lin

IPC: H01L31/0232 ,  F21V8/00 ,  G01J1/02 ,  G01J1/04 ,  H01L31/12 ,  H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/02327 ,  G01J1/0209 ,  G01J1/0425 ,  G02B6/0028 ,  G06K9/00046 ,  H01L31/0203 ,  H01L31/125 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.