公开(公告)号：US20170113922A1

公开(公告)日：2017-04-27

申请号：US14923602

申请日：2015-10-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ching-Han HUANG ,  Hsun-Wei CHAN ,  Yu-Hsuan TSAI

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0067 ,  B81B2201/0292 ,  B81C1/00317 ,  B81C2203/0109 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: A semiconductor device package includes a carrier, a sensor element disposed on or within the carrier, a cover and a filter. The cover includes a base substrate and a periphery barrier. The base substrate includes an inner sidewall. The inner sidewall of the base substrate defines a penetrating hole extending from a top surface of the base substrate to a bottom surface of the base substrate; at least a portion of the inner sidewall of the base substrate is tilted. The periphery barrier is coupled to the bottom surface of the base substrate and contacts a top surface of the carrier. The filter is disposed on the top surface of the base substrate and covers the penetrating hole.