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公开(公告)号：US12066338B2
公开(公告)日：2024-08-20
申请号：US17739946
申请日：2022-05-09
Applicant: UltraSense Systems, Inc.
Inventor： Sina Akhbari , Ching-hsun Wei , Shao-Hsiang Lo , Hao-Yen Tang
CPC classification number: G01L1/16 , B81B3/0021 , H10N30/302 , H10N30/87 , H10N30/88 , B81B2201/0292
Abstract: A force-measuring device (FMD) assembly for a portable electronic apparatus includes a mid-frame including a base portion, a sidewall portion, and a transition region between the base portion and the sidewall portion, and force-measuring devices coupled to the inner surface of the sidewall portion. The sidewall portion and the transition region are elongate along a longitudinal axis. FMDs are coupled to the inner surface at respective contact regions of the sidewall portion and are separated from each other along the longitudinal axis. Each of the FMDs includes strain-sensing element(s). Each of the FMDs corresponds to a respective sense region of the sidewall portion. The transition region includes a respective elongate slit or trough for each of the sense regions. The respective elongate slit or trough is elongate along the longitudinal axis. Adjacent elongate slits or troughs are separated by a respective rib.
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公开(公告)号：US11800297B2
公开(公告)日：2023-10-24
申请号：US17494120
申请日：2021-10-05
Applicant: INVENSENSE, INC.
Inventor： Roberto Brioschi , Kazunori Hayata , JR-Cheng Yeh , Dinesh Kumar Solanki
CPC classification number: H04R19/04 , B81B7/0064 , B81C1/00333 , H04R1/04 , H04R3/00 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/0292 , B81B2203/0127 , B81B2207/015 , B81C2203/0109 , H04R2201/003
Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
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公开(公告)号：US11772958B2
公开(公告)日：2023-10-03
申请号：US17475294
申请日：2021-09-14
Applicant: APPLIED MATERIALS, INC.
Inventor： Nir Merry , Paul Wirth , Ming Xu , Sushant Koshti , Raechel Chu-Hui Tan
CPC classification number: B81B3/0018 , G01F1/6845 , G01F1/72 , G01F1/86 , G05D7/0623 , G05D7/0647 , B81B2201/0292 , B81B2203/01 , B81B2203/0315 , B81B2203/0338 , B81B2207/11
Abstract: Disclosed herein are embodiments of a mass flow control apparatus, systems incorporating the same, and methods using the same. In one embodiment, a mass flow control apparatus comprises a flow modulating valve configured to modulate gas flow in a gas flow channel, a sensor device, such as a micro-electromechanical (MEMS) device, configured to generate a signal responsive to a condition of the gas flow, and a processing device operatively coupled to the flow modulating valve and the sensor device to control the flow modulating valve based on a signal received from the sensor device.
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公开(公告)号：US11673795B2
公开(公告)日：2023-06-13
申请号：US17095655
申请日：2020-11-11
Applicant: Beijing Voyager Technology Co., Ltd.
Inventor： Anan Pan , Youmin Wang
IPC: B81B7/00 , G01S17/931 , G01S7/481 , B81C1/00
CPC classification number: B81B7/0058 , B81B7/0038 , B81C1/00285 , B81C1/00317 , G01S7/4813 , G01S17/931 , B81B2201/0292 , B81B2201/042
Abstract: A MEMS chip package is provided with a removable cover to allow non-destructive testing. The MEMS package has a container (with walls and a bottom) and a cover. The cover has a glass pane, and is secured to the MEMS package with an elastomeric gasket mounted between the walls of the MEMS package and the cover. A number of attachment mechanisms secure the cover to the MEMS package.
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公开(公告)号：US11661333B2
公开(公告)日：2023-05-30
申请号：US17070341
申请日：2020-10-14
Inventor： Wei-Jhih Mao , Shang-Ying Tsai , Kuei-Sung Chang , Chun-Wen Cheng
CPC classification number: B81B3/0021 , B81C1/00166 , B81C1/00825 , B81B2201/0228 , B81B2201/0292 , B81B2201/038 , B81B2203/04
Abstract: A semiconductor structure includes a substrate; a sensing device disposed over the substrate and including a plurality of protruding members protruded from the sensing device; a sensing structure disposed adjacent to the sensing device and including a plurality of sensing electrodes protruded from the sensing structure towards the sensing device; and an actuating structure disposed adjacent to the sensing device and configured to provide an electrostatic force on the sensing device based on a feedback from the sensing structure. Further, a method of manufacturing the semiconductor structure is also disclosed.
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Patent Agency Ranking
公开(公告)号：US20190162578A1
公开(公告)日：2019-05-30
申请号：US15824258
申请日：2017-11-28
Applicant: International Business Machines Corporation
Inventor： Jonathan Fry , Daniel Piper , Jang Sim , Yongchun Xin
CPC classification number: G01F23/703 , B81B2201/0292 , B81C2201/0101 , B81C2203/05 , G01F23/241 , G01F23/76
Abstract: A self-cleaning sensor to determine a level of a liquid includes a tube with an interior coating and a plurality of horizontally aligned, electrically isolated, electrical contacts. The self-cleaning sensor includes the plurality of horizontally aligned, electrically isolated, electrical contacts that each terminate in an outer surface of an interior wall of the tube and are electrically connected to one or more electrical devices in a cap residing on the tube. Additionally, the self-cleaning sensor includes a float that is composed of a low density, low dielectric constant material buoyant in one or more liquids to be measured where each horizontal dimension of the float corresponds to each horizontal dimension of the tube.
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公开(公告)号：US20180251369A1
公开(公告)日：2018-09-06
申请号：US15934267
申请日：2018-03-23
Applicant: Amkor Technology, Inc.
Inventor： Lawrence Prestousa Natan , Adrian Arcedera , Roveluz Lledo-Reyes , Sarah Christine-Sanchez Torrefranca
CPC classification number: B81B7/0074 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0278 , B81B2201/0292 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81B2207/07 , B81B2207/097 , B81C1/00333 , B81C2203/019 , B81C2203/0792 , G01P15/00
Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.
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公开(公告)号：US20180179050A1
公开(公告)日：2018-06-28
申请号：US15904631
申请日：2018-02-26
Applicant: NextInput, Inc.
Inventor： Amnon Brosh , Ryan Diestelhorst , Steven Nasiri
CPC classification number: B81B3/0056 , B81B2201/0264 , B81B2201/0292 , B81C1/00626 , G01L1/18 , G01L1/205 , G01L9/0047 , G01L9/0048
Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.
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公开(公告)号：US09758364B2
公开(公告)日：2017-09-12
申请号：US15162027
申请日：2016-05-23
Applicant: Honeywell International Inc.
Inventor： Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
CPC classification number: B81B3/0021 , B81B2201/0292 , B81B2203/0118 , B81B2207/015 , B81B2207/07 , B81C1/0015 , B81C2201/013 , B81C2201/0197
Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
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10.发明授权公开(公告)号：US09650237B2
公开(公告)日：2017-05-16
申请号：US14778514
申请日：2014-04-17
Applicant: Agency for Science, Technology and Research
Inventor： Ilker E. Ocak , Julius Ming Lin Tsai , Navab Singh
IPC: B81B7/00 , H01L25/00 , G01C19/56 , G01R33/00 , G01R33/028 , G01P15/08 , G01P15/125 , B81C1/00
CPC classification number: B81B7/0048 , B81B2201/0235 , B81B2201/0242 , B81B2201/0271 , B81B2201/0292 , B81B2203/04 , B81B2207/07 , B81C1/00285 , B81C2203/0118 , B81C2203/0172 , G01C19/56 , G01P15/0802 , G01P15/125 , G01P2015/0814 , G01P2015/0828 , G01R33/00 , G01R33/0052 , G01R33/0286 , H01L25/00 , H01L2924/0002 , H01L2924/00
Abstract: An electromechanical device and method of fabrication thereof comprising: providing a first wafer with a circuit arrangement on a first surface thereof and a first electrode on a second surface thereof; forming first and second via structures from the first surface to the second surface of the first wafer, said first via electrically connecting the first electrode with the circuit arrangement; providing a second wafer with a suspended structure on a first surface thereof; forming a second electrode on the suspended structure; forming an interconnect structure on the first surface of the second wafer that electrically connects with the second electrode; bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, with the second via structure electrically connecting the circuit arrangement to the interconnect structure, and the first and second electrodes forming a capacitive structure.
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