公开(公告)号：US20230298985A1

公开(公告)日：2023-09-21

申请号：US18201145

申请日：2023-05-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Cheng Yuan CHEN ,  Chun Chen CHEN ,  Jiming LI ,  Chien-Wen TU

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/66

CPC classification number: H01L23/49811 ,  H01L21/4889 ,  H01L23/66 ,  H01L2223/6605

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S 11 parameter of the connector is less than −20 dB.

公开(公告)号：US20230145588A1

公开(公告)日：2023-05-11

申请号：US18095513

申请日：2023-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng Yuan CHEN ,  Jiming LI ,  Chun Chen CHEN ,  Yuanhao YU

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L21/4853 ,  H01L23/66 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/526 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/3025

Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

公开(公告)号：US20220122950A1

公开(公告)日：2022-04-21

申请号：US17076480

申请日：2020-10-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Chun Chen CHEN ,  Shang Chien CHEN

IPC: H01L25/10 ,  H01L25/18

Abstract: The present disclosure provides a semiconductor structure including a first substrate having a first surface, a first semiconductor device package disposed on the first surface of the first substrate, and a second semiconductor device package disposed on the first surface of the first substrate. The first semiconductor device package and the second semiconductor device package have a first signal transmission path through the first substrate and a second signal transmission path insulated from the first substrate. The present disclosure also provides an electronic device.

公开(公告)号：US20220077837A1

公开(公告)日：2022-03-10

申请号：US17013333

申请日：2020-09-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Weifan WU ,  Tingyen CHANG ,  Mingjhih TSAI ,  Fengchuan TSAI

IPC: H03H7/38 ,  H01Q1/22 ,  H04R1/22 ,  H04R1/10

Abstract: A wearable device and method for operating the same are provided. The wearable device includes an antenna element, a first matching circuit, a second matching circuit, and a switch element. The first matching circuit has a first impedance value. The second matching circuit has a second impedance value different from the first impedance value. The switch element is configured to determine whether the antenna element is electrically connected with the first matching circuit or the second matching circuit.