公开(公告)号：US20210009469A1

公开(公告)日：2021-01-14

申请号：US16903896

申请日：2020-06-17

Applicant: Apple Inc.

Inventor： Tyler A. Marshall ,  Christopher C. Bartlow

IPC: C03C17/30 ,  B44C1/00 ,  G01N21/21

Abstract: Methods for evaluating a chemically strengthened housing component for an electronic device are disclosed. These methods may allow non-destructive determination of whether the chemical strengthening of the component meets specifications. Systems suitable for use with the methods are also disclosed

公开(公告)号：US10800141B2

公开(公告)日：2020-10-13

申请号：US16262855

申请日：2019-01-30

Applicant: Apple Inc.

Inventor： Christopher C. Bartlow ,  Dale N. Memering ,  Tyler A. Marshall ,  Victor Luzzato

IPC: C03C21/00 ,  B32B17/00 ,  B32B17/06

Abstract: A component for an electronic device including an internal compressive stress region is disclosed herein. The internal compressive stress region may be created in a glass portion of the component or in a glass ceramic portion of the component. Electronic devices comprising the components and method for making the components are also disclosed.

公开(公告)号：US20240053194A1

公开(公告)日：2024-02-15

申请号：US18347942

申请日：2023-07-06

Applicant: Apple Inc.

Inventor： Tyler A. Marshall ,  Divakar Singamsetty ,  Jeremy C. Franklin ,  Jeffrey C. Olson ,  Matthew S. Rogers

IPC: G01J1/04 ,  G01J1/02

CPC classification number: G01J1/0407 ,  G01J1/0271

Abstract: A system may have a support structure and a glass layer that separate an exterior region surrounding the system from an interior region. Components may be mounted in the interior region. The components may include an optical component. The glass layer may have a first area that overlaps the optical component and that serves as an optical component window for the optical component. The glass layer may also have a second area that surrounds the first area and does not overlap the optical component. The first area may be selectively weakened relative to the second area to prevent excessive glass fracturing during a damage event from obscuring the optical component. Selective weakening may be provided with laser-induced-damage features, recesses from local thinning, and/or glass-weakening deposited thin films such as physical vapor deposition thin-film coatings of inorganic dielectric.

公开(公告)号：US20210361233A1

公开(公告)日：2021-11-25

申请号：US16879403

申请日：2020-05-20

Applicant: Apple Inc.

Inventor： James R. Wilson ,  Christopher D. Jones ,  Tyler A. Marshall

IPC: A61B5/00 ,  H05K5/00 ,  H05K5/03 ,  G01J1/42 ,  G01J1/04

Abstract: An electronic device including an optical component and an enclosure comprising a glass ceramic region is disclosed. The optical properties of the glass ceramic region and the positioning of the glass ceramic region with respect to the optical component can affect the performance of the optical component, the visual appearance of the optical component, or both.

公开(公告)号：US10766810B2

公开(公告)日：2020-09-08

申请号：US15890260

申请日：2018-02-06

Applicant: Apple Inc.

Inventor： Victor Luzzato ,  Tyler A. Marshall ,  Christopher C. Bartlow ,  Dale N. Memering

IPC: C03C21/00 ,  C03C15/00 ,  C03C19/00 ,  B28D1/18 ,  C03B23/03

Abstract: Components of an electronic device, such as glass articles, are susceptible to breakage, especially in regions where machining a glass article has created flaws. Chemical strengthening can be performed to create deeper compression layers at regions of a glass article that have been machined, include and/or are adjacent to an edge feature, have greater surface roughness, and/or have more or deeper cracks.

公开(公告)号：US20200095159A1

公开(公告)日：2020-03-26

申请号：US16396208

申请日：2019-04-26

Applicant: Apple Inc.

Inventor： Tyler A. Marshall ,  Christopher D. Jones

IPC: C03C10/00 ,  G02F1/055

Abstract: Electronic device components that include a glass portion and a ceramic or a glass ceramic portion are disclosed. The ceramic or glass ceramic portions of the component may be located to provide desired performance characteristics to the component, which may be an enclosure component. In addition, regions of compressive stress may be formed within the glass portion, the glass ceramic portion, or both to further adjust the performance characteristics of the component. Electronic devices including the components and methods for making the components are also provided.