Electronic devices with chemically strengthened coherent fiber bundles

    公开(公告)号:US11573450B1

    公开(公告)日:2023-02-07

    申请号:US17408294

    申请日:2021-08-20

    Applicant: Apple Inc.

    Abstract: An electronic device may have a display and other optical components such as optical sensors. The display and other components may be overlapped by chemically strengthened glass coherent fiber bundles. The surfaces of a coherent fiber bundle may include ion-exchanged glass that places theses surfaces under compressive stress. In some configurations, the coherent fiber bundle is symmetrically stressed and has equal amounts of compressive stress on opposing surfaces. In other configurations, the coherent fiber bundle is asymmetrically stressed and has more compressive stress on one surface than the other. The coherent fiber bundle may have areas with curved cross-sectional profiles, planar areas, and/or areas with compound curvature. Sensor windows may be formed in the coherent fiber bundle that are surrounded by an opaque area. When overlapping a display, the coherent fiber bundle may serve as a display cover glass layer.

    Localized control of bulk material properties

    公开(公告)号:US11420900B2

    公开(公告)日:2022-08-23

    申请号:US16396208

    申请日:2019-04-26

    Applicant: Apple Inc.

    Abstract: Electronic device components that include a glass portion and a ceramic or a glass ceramic portion are disclosed. The ceramic or glass ceramic portions of the component may be located to provide desired performance characteristics to the component, which may be an enclosure component. In addition, regions of compressive stress may be formed within the glass portion, the glass ceramic portion, or both to further adjust the performance characteristics of the component. Electronic devices including the components and methods for making the components are also provided.

    Spiral Grain Coatings for Glass Structures in Electronic Devices

    公开(公告)号:US20200181007A1

    公开(公告)日:2020-06-11

    申请号:US16457389

    申请日:2019-06-28

    Applicant: Apple Inc.

    Abstract: An electronic device may include electrical components mounted within a housing. The device may have a display on a front face of the device that is covered with a glass structure and may have a glass structure that forms part of the housing on a rear face of the device. The housing may also have a sidewall formed from glass, metal, or other materials. The glass structures of the electronic device may have a surface that is covered with an antiscratch layer, an antireflection layer, or other coating. A spiral grain polycrystalline material may form a coating on the surface of the glass structures to help avoid fracturing of the glass structures when the electronic device is dropped or otherwise subjected to stress.

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