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公开(公告)号:US20230232558A1
公开(公告)日:2023-07-20
申请号:US17986959
申请日:2022-11-15
Applicant: Apple Inc.
Inventor: Christopher C. Bartlow , Dale N. Memering , Tyler A. Marshall
CPC classification number: H05K5/03 , C03C21/002 , H05K5/0086 , H05K5/0018
Abstract: Differentially strengthened cover members for electronic devices are disclosed. The differentially strengthened cover members include at least one chemically strengthened zone that improves the resistance of the cover member to cracking. One or more of the chemically strengthened zones may cover or at least partially surround a portion of the cover member to be protected from damage.
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公开(公告)号:US20210016547A1
公开(公告)日:2021-01-21
申请号:US17033022
申请日:2020-09-25
Applicant: Apple Inc.
Inventor: Christopher C. Bartlow , Dale N. Memering , Tyler A. Marshall , Victor Luzzato
Abstract: A component for an electronic device including an internal compressive stress region is disclosed herein. The internal compressive stress region may be created in a glass portion of the component or in a glass ceramic portion of the component. Electronic devices comprising the components and method for making the components are also disclosed.
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公开(公告)号:US11573450B1
公开(公告)日:2023-02-07
申请号:US17408294
申请日:2021-08-20
Applicant: Apple Inc.
Inventor: Christopher D. Jones , Dale N. Memering , Daniel J. Barrett , Erik G. de Jong , Sameer Pandya , Tyler A. Marshall
IPC: G02F1/1335 , G02B6/08 , F21V8/00 , G02F1/1333 , G02B6/02 , G06F1/16
Abstract: An electronic device may have a display and other optical components such as optical sensors. The display and other components may be overlapped by chemically strengthened glass coherent fiber bundles. The surfaces of a coherent fiber bundle may include ion-exchanged glass that places theses surfaces under compressive stress. In some configurations, the coherent fiber bundle is symmetrically stressed and has equal amounts of compressive stress on opposing surfaces. In other configurations, the coherent fiber bundle is asymmetrically stressed and has more compressive stress on one surface than the other. The coherent fiber bundle may have areas with curved cross-sectional profiles, planar areas, and/or areas with compound curvature. Sensor windows may be formed in the coherent fiber bundle that are surrounded by an opaque area. When overlapping a display, the coherent fiber bundle may serve as a display cover glass layer.
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公开(公告)号:US11420900B2
公开(公告)日:2022-08-23
申请号:US16396208
申请日:2019-04-26
Applicant: Apple Inc.
Inventor: Tyler A. Marshall , Christopher D. Jones
Abstract: Electronic device components that include a glass portion and a ceramic or a glass ceramic portion are disclosed. The ceramic or glass ceramic portions of the component may be located to provide desired performance characteristics to the component, which may be an enclosure component. In addition, regions of compressive stress may be formed within the glass portion, the glass ceramic portion, or both to further adjust the performance characteristics of the component. Electronic devices including the components and methods for making the components are also provided.
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5.
公开(公告)号:US20190160787A1
公开(公告)日:2019-05-30
申请号:US16262855
申请日:2019-01-30
Applicant: Apple Inc.
Inventor: Christopher C. Bartlow , Dale N. Memering , Tyler A. Marshall , Victor Luzzato
CPC classification number: B32B17/00 , B32B17/06 , B32B2250/03 , B32B2307/558 , B32B2457/208 , C03C21/002
Abstract: A component for an electronic device including an internal compressive stress region is disclosed herein. The internal compressive stress region may be created in a glass portion of the component or in a glass ceramic portion of the component. Electronic devices comprising the components and method for making the components are also disclosed.
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6.
公开(公告)号:US20240075713A1
公开(公告)日:2024-03-07
申请号:US18388519
申请日:2023-11-09
Applicant: Apple Inc.
Inventor: Christopher C. Bartlow , Dale N. Memering , Tyler A. Marshall , Victor Luzzato
CPC classification number: B32B17/00 , B32B17/06 , C03C21/002 , B32B2250/03 , B32B2307/558 , B32B2457/208
Abstract: A component for an electronic device including an internal compressive stress region is disclosed herein. The internal compressive stress region may be created in a glass portion of the component or in a glass ceramic portion of the component. Electronic devices comprising the components and method for making the components are also disclosed.
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公开(公告)号:US11666273B2
公开(公告)日:2023-06-06
申请号:US16879403
申请日:2020-05-20
Applicant: Apple Inc.
Inventor: James R. Wilson , Christopher D. Jones , Tyler A. Marshall
IPC: A61B5/00 , H05K5/00 , H05K5/03 , G01J1/42 , G01J1/04 , G06F1/16 , A61B5/024 , A61B5/1455 , G01J1/02 , G06F3/041 , H04N23/57
CPC classification number: A61B5/6802 , A61B5/0075 , A61B5/0077 , A61B5/02433 , A61B5/14552 , A61B5/681 , A61B5/6898 , A61B5/742 , A61B5/7475 , G01J1/0204 , G01J1/0214 , G01J1/0407 , G01J1/0474 , G01J1/0488 , G01J1/42 , H05K5/0017 , H05K5/03 , A61B2562/0238 , G06F1/163 , G06F1/1616 , G06F3/041 , H04N23/57
Abstract: An electronic device including an optical component and an enclosure comprising a glass ceramic region is disclosed. The optical properties of the glass ceramic region and the positioning of the glass ceramic region with respect to the optical component can affect the performance of the optical component, the visual appearance of the optical component, or both.
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公开(公告)号:US20200181007A1
公开(公告)日:2020-06-11
申请号:US16457389
申请日:2019-06-28
Applicant: Apple Inc.
Inventor: Tyler A. Marshall , Martin Melcher , Matthew S. Rogers
Abstract: An electronic device may include electrical components mounted within a housing. The device may have a display on a front face of the device that is covered with a glass structure and may have a glass structure that forms part of the housing on a rear face of the device. The housing may also have a sidewall formed from glass, metal, or other materials. The glass structures of the electronic device may have a surface that is covered with an antiscratch layer, an antireflection layer, or other coating. A spiral grain polycrystalline material may form a coating on the surface of the glass structures to help avoid fracturing of the glass structures when the electronic device is dropped or otherwise subjected to stress.
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公开(公告)号:US11850822B2
公开(公告)日:2023-12-26
申请号:US17033022
申请日:2020-09-25
Applicant: Apple Inc.
Inventor: Christopher C. Bartlow , Dale N. Memering , Tyler A. Marshall , Victor Luzzato
CPC classification number: B32B17/00 , B32B17/06 , C03C21/002 , B32B2250/03 , B32B2307/558 , B32B2457/208
Abstract: A component for an electronic device including an internal compressive stress region is disclosed herein. The internal compressive stress region may be created in a glass portion of the component or in a glass ceramic portion of the component. Electronic devices comprising the components and method for making the components are also disclosed.
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公开(公告)号:US11680010B2
公开(公告)日:2023-06-20
申请号:US16903896
申请日:2020-06-17
Applicant: Apple Inc.
Inventor: Tyler A. Marshall , Christopher C. Bartlow
Abstract: Methods for evaluating a chemically strengthened housing component for an electronic device are disclosed. These methods may allow non-destructive determination of whether the chemical strengthening of the component meets specifications. Systems suitable for use with the methods are also disclosed.
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