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    Thermal management systems and methods for wafer processing systems
    11.
    发明授权
    Thermal management systems and methods for wafer processing systems 有权

    公开(公告)号：US10468276B2

    公开(公告)日：2019-11-05

    申请号：US15581589

    申请日：2017-04-28

    Applicant: Applied Materials, Inc.

    Inventor： David Benjaminson ,  Dmitry Lubomirsky

    IPC: H02G1/08 ,  H01L21/67 ,  H01L21/324 ,  H01L21/687 ,  H01L21/66

    Abstract: A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.

    BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS
    12.
    发明申请
    BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS 审中-公开

    公开(公告)号：US20190109025A1

    公开(公告)日：2019-04-11

    申请号：US16209581

    申请日：2018-12-04

    Applicant: Applied Materials, Inc.

    Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

    IPC: H01L21/67 ,  H01J37/32 ,  H01L21/687 ,  H01L21/324

    Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

    ELECTROSTATIC CHUCK WITH RADIO FREQUENCY ISOLATED HEATERS
    13.
    发明申请
    ELECTROSTATIC CHUCK WITH RADIO FREQUENCY ISOLATED HEATERS 审中-公开

    公开(公告)号：US20180213608A1

    公开(公告)日：2018-07-26

    申请号：US15411896

    申请日：2017-01-20

    Applicant: Applied Materials, Inc.

    Inventor： David Benjaminson ,  Ken Schatz ,  Dmitry Lubomirsky

    IPC: H05B3/34 ,  H01L21/67 ,  H01L21/683

    CPC classification number: H05B3/34 ,  H01L21/67103 ,  H01L21/6833 ,  H05B2203/013 ,  H05B2203/017

    Abstract: A heater assembly for a substrate support assembly includes a flexible body. The heater assembly further includes one or more resistive heating elements disposed in the flexible body. The heater assembly further includes a first metal layer disposed on the top surface of the flexible body and extending at least partially onto an outer sidewall of the flexible body. The heater assembly further includes a second metal layer disposed on a bottom surface of the flexible body and extending at least partially onto the outer sidewall of the flexible body, wherein the second metal layer is coupled to the first metal layer at the outer sidewall of the flexible body such that the first metal layer and the second metal layer enclose, and form a continuous electrically conductive path around, the outer sidewall of the flexible body.

    High temperature RF heater pedestals
    17.
    发明授权
    High temperature RF heater pedestals 有权

    公开(公告)号：US11062887B2

    公开(公告)日：2021-07-13

    申请号：US16132806

    申请日：2018-09-17

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Soonam Park ,  David Benjaminson ,  Xikun Wang ,  Dmitry Lubomirsky

    IPC: H01J37/32 ,  H01L21/687 ,  C23C16/458 ,  C23C16/455

    Abstract: Semiconductor processing systems are described, which may include a substrate support assembly having a substrate support surface. Exemplary substrate support assemblies may include a ceramic heater defining the substrate support surface. The assemblies may include a ground plate on which the ceramic heater is seated. The assemblies may include a stem with which the ground plate is coupled. The assemblies may include an electrode embedded within the ceramic heater at a depth from the substrate support surface. The chambers or systems may also include an RF match configured to provide an AC current and an RF power through the stem to the electrode. The RF match may be coupled with the substrate support assembly along the stem. The substrate support assembly and RF match may be vertically translatable within the semiconductor processing system.

    Bolted wafer chuck thermal management systems and methods for wafer processing systems
    19.
    发明授权
    Bolted wafer chuck thermal management systems and methods for wafer processing systems 有权

    公开(公告)号：US10607867B2

    公开(公告)日：2020-03-31

    申请号：US16209581

    申请日：2018-12-04

    Applicant: Applied Materials, Inc.

    Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

    IPC: H01L21/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/324 ,  H01J37/32

    Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

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