公开(公告)号：US11158527B2

公开(公告)日：2021-10-26

申请号：US16673296

申请日：2019-11-04

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/687 ,  H01L21/66

Abstract: A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.

公开(公告)号：US09691645B2

公开(公告)日：2017-06-27

申请号：US14820422

申请日：2015-08-06

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/324

CPC classification number: H01L21/67103 ,  H01J37/32082 ,  H01J37/32357 ,  H01J37/32724 ,  H01L21/324 ,  H01L21/68742 ,  H01L21/68785

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

公开(公告)号：US20170096740A1

公开(公告)日：2017-04-06

申请号：US15383556

申请日：2016-12-19

Applicant: Applied Materials, Inc.

Inventor： Benjamin Schmiege ,  Nitin K. Ingle ,  Srinivas D. Nemani ,  Jeffrey W. Anthis ,  Xikun Wang ,  Jie Liu ,  David Benjaminson

IPC: C23F1/12 ,  H01J37/32

CPC classification number: C23F1/12 ,  C23F4/00 ,  C30B33/12 ,  H01J37/32009 ,  H01J2237/334

Abstract: Provided are methods for etching films comprising transition metals which help to minimize higher etch rates at the grain boundaries of polycrystalline materials. Certain methods pertain to amorphization of the polycrystalline material, other pertain to plasma treatments, and yet other pertain to the use of small doses of halide transfer agents in the etch process.

公开(公告)号：US20170040191A1

公开(公告)日：2017-02-09

申请号：US14820422

申请日：2015-08-06

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/687

CPC classification number: H01L21/67103 ,  H01J37/32082 ,  H01J37/32357 ,  H01J37/32724 ,  H01L21/324 ,  H01L21/68742 ,  H01L21/68785

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

Abstract translation: 工件保持器包括与圆盘相应的内部和外部部分热连通的圆盘，第一和第二加热装置以及与该冰球热连通的散热器。 第一和第二加热装置是可独立控制的，并且第一和第二加热装置与冰球的热连通比热盘与冰球热传递更大。 一种控制工件温度分布的方法包括使热交换流体流过散热器，以建立对圆盘的参考温度，将圆盘的径向内部和外部部分的温度升高到高于参考温度的第一和第二温度， 通过激活被设置成与圆盘的径向内部和外部热连通的相应的第一和第二加热装置，并将工件放置在冰球上。

公开(公告)号：US11217462B2

公开(公告)日：2022-01-04

申请号：US16834109

申请日：2020-03-30

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/324

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.

公开(公告)号：US20200066556A1

公开(公告)日：2020-02-27

申请号：US16673296

申请日：2019-11-04

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/687 ,  H01L21/66

Abstract: A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.

公开(公告)号：US09741593B2

公开(公告)日：2017-08-22

申请号：US14820365

申请日：2015-08-06

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky

IPC: H02G1/08 ,  H01L21/67 ,  H01L21/324 ,  H01L21/687

CPC classification number: H01L21/67103 ,  H01L21/3247 ,  H01L21/68785 ,  H01L22/12

Abstract: A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.

公开(公告)号：US20250125181A1

公开(公告)日：2025-04-17

申请号：US18486072

申请日：2023-10-12

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Onkara Swamy Kora Siddaramaiah ,  David Benjaminson ,  Ryan Pakulski ,  Anh N. Nguyen ,  Son T. Nguyen ,  Prashanth Rao

IPC: H01L21/683 ,  H01L21/67

Abstract: Exemplary semiconductor processing chambers may include a chamber body. The chambers may include a showerhead positioned atop the body. The chambers may include an electrostatic chuck assembly disposed within the body. The assembly may include a puck that may include a first plate including an electrically insulating material and that defines a substrate support surface. The puck may include a multi-zone heating assembly thermally coupled with the first plate. The puck may include bipolar electrodes. The puck may include a second plate that defines cooling channels. The assembly may include an insulator beneath the second plate. The assembly may include a base plate beneath the insulator. The assembly may include a shaft that may include a heater rod coupled with the heating assembly. The shaft may include a cooling fluid lumen fluidly coupled with the cooling channels. The shaft may include a power rod electrically coupled with a bipolar electrode.

公开(公告)号：US11776822B2

公开(公告)日：2023-10-03

申请号：US17051071

申请日：2019-05-02

Applicant: Applied Materials, Inc.

Inventor： Tuochuan Huang ,  Gang Peng ,  David W. Groechel ,  Vijay D. Parkhe ,  Shinnosuke Kawaguchi ,  David Benjaminson

IPC: H01L21/67 ,  B08B3/12 ,  H01L21/683

CPC classification number: H01L21/67028 ,  B08B3/12 ,  H01L21/6831

Abstract: Embodiments described herein relate a cleaning fixture and method to prevent chemical solutions from contacting the various substrate supporting member features and penetrating into the holes and the metal plate of the substrate supporting surface. The cleaning fixture includes a mounting plate having a plurality of thru-holes arranged on a bolt circle and configured to align with a plurality of thread holes disposed in an electrostatic chuck, a recess formed in the mounting plate, and a gas port formed through the mounting plate. A sealed plenum is formed between the recess of the mounting plate and a lower surface of the electrostatic chuck when the electrostatic chuck is coupled to the mounting plate. The gas port is fluidly coupled to the sealed plenum.

公开(公告)号：US20200273728A1

公开(公告)日：2020-08-27

申请号：US16834109

申请日：2020-03-30

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Dmitry Lubomirsky ,  Ananda Seelavanth Math ,  Saravanakumar Natarajan ,  Shubham Chourey

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/324 ,  H01J37/32

Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.