BARRIER LAYER FOR PREVENTING ALUMINUM DIFFUSION

    公开(公告)号:US20230377879A1

    公开(公告)日:2023-11-23

    申请号:US17747978

    申请日:2022-05-18

    CPC classification number: H01L21/02362 H01L21/02153 H01L21/02181

    Abstract: Embodiments of the present disclosure are related to methods of preventing aluminum diffusion in a metal gate stack (e.g., high-κ metal gate (HKMG) stacks and nMOS FET metal gate stacks). Some embodiments relate to a barrier layer for preventing aluminum diffusion into high-κ metal oxide layers. The barrier layer described herein is configured to reduce threshold voltage (Vt) shift and reduce leakage in the metal gate stacks. Additional embodiments relate to methods of forming a metal gate stack having the barrier layer described herein. The barrier layer may include one or more of amorphous silicon (a-Si), titanium silicon nitride (TiSiN), tantalum nitride (TaN), or titanium tantalum nitride (TiTaN).

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