公开(公告)号：US11880000B2

公开(公告)日：2024-01-23

申请号：US17889202

申请日：2022-08-16

Applicant: Aurora Operations, Inc.

Inventor： Amir Hosseini ,  Sen Lin ,  Andrew Steil Michaels

IPC: G01S7/481 ,  G01S17/931 ,  G01S7/491

CPC classification number: G01S7/4818 ,  G01S7/4811 ,  G01S7/491 ,  G01S17/931

Abstract: A LIDAR transceiver includes a source input, coherent cells, and an optical switch. The optical switch is configured to switchably couple the source input to the coherent cells. At least one of the coherent cells includes an input port, an optical antenna, and a splitter. The input port is coupled to the optical switch and the splitter is coupled between the input port and the optical antenna. The splitter is configured to split a received portion of a laser signal into a local oscillator signal and a transmit signal, where the transmit signal is emitted through the optical antenna. A reflection of the transmit signal is received through the optical antenna as a reflected signal, where the splitter is further configured to output a return signal that is a portion of the reflected signal.

公开(公告)号：US11835765B2

公开(公告)日：2023-12-05

申请号：US18051337

申请日：2022-10-31

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G02B6/12 ,  G02B6/136 ,  G01S7/481

CPC classification number: G02B6/136 ,  G01S7/4816 ,  G02B2006/12061 ,  G02B2006/12107

Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

公开(公告)号：US12259477B2

公开(公告)日：2025-03-25

申请号：US18160817

申请日：2023-01-27

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G01S17/931 ,  G01S7/484 ,  G01S7/4863

Abstract: A light detection and ranging (LIDAR) sensor system includes a plurality of LIDAR pixels and a local oscillator module. The local oscillator module is coupled to the plurality of LIDAR pixels. The local oscillator module includes a first local oscillator input configured to receive a first local oscillator signal and a second local oscillator input configured to receive a second local oscillator signal. The local oscillator module is configured to provide the first local oscillator signal or the second local oscillator signal to a first LIDAR pixel of the plurality of LIDAR pixels.

公开(公告)号：US12222447B1

公开(公告)日：2025-02-11

申请号：US18516646

申请日：2023-11-21

Applicant: Aurora Operations, Inc.

Inventor： Ashish Bhardwaj ,  Sen Lin ,  Dong Liu ,  Xue Liu ,  Andrew Steil Michaels

IPC: G01S7/00 ,  G01S7/481 ,  G01S17/42 ,  G01S17/89

Abstract: A light detection and ranging (LIDAR) system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices formed on the substrate, the two or more semiconductor devices configured to receive the beam from the light source and modify the beam and at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object in an environment of the vehicle.

公开(公告)号：US20240111053A1

公开(公告)日：2024-04-04

申请号：US18538717

申请日：2023-12-13

Applicant: Aurora Operations, Inc.

Inventor： Edward Joseph Angus ,  Zeb William Barber ,  Andrew Steil Michaels ,  Evan Rogers

IPC: G01S17/88 ,  B60W60/00 ,  G01S7/499

CPC classification number: G01S17/88 ,  B60W60/001 ,  G01S7/499 ,  B60W2420/408

Abstract: A light detection and ranging (LIDAR) sensor system for a vehicle includes a transmitter, a receiver, and a scanner. The transmitter is configured to output a transmit beam. The transmitter includes a first grating coupler. The receiver includes a plurality of second grating couplers spaced apart from the first grating coupler.

公开(公告)号：US11874376B1

公开(公告)日：2024-01-16

申请号：US17890881

申请日：2022-08-18

Applicant: Aurora Operations, Inc.

Inventor： Edward Joseph Angus ,  Zeb William Barber ,  Andrew Steil Michaels ,  Evan Rogers

IPC: G01S17/88 ,  G01S7/499 ,  B60W60/00

CPC classification number: G01S17/88 ,  B60W60/001 ,  G01S7/499 ,  B60W2420/52

Abstract: A light detection and ranging (LIDAR) sensor system for a vehicle includes a transmitter, a receiver, and a scanner. The transmitter is configured to output a transmit beam. The transmitter includes a first grating coupler. The receiver includes a plurality of second grating couplers spaced apart from the first grating coupler.

公开(公告)号：US20230161105A1

公开(公告)日：2023-05-25

申请号：US18051337

申请日：2022-10-31

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G02B6/136 ,  G01S7/481

CPC classification number: G02B6/136 ,  G01S7/4816 ,  G02B2006/12107

Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

公开(公告)号：US20230161006A1

公开(公告)日：2023-05-25

申请号：US17853674

申请日：2022-06-29

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G01S7/481 ,  G01S17/931

CPC classification number: G01S7/4813 ,  G01S17/931

Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

公开(公告)号：US12276762B2

公开(公告)日：2025-04-15

申请号：US18427016

申请日：2024-01-30

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G01S7/499 ,  G01S7/481 ,  G01S7/4863 ,  G01S17/931

Abstract: A light detection and ranging (LIDAR) sensor system includes a dual-polarization optical antenna, a single-polarization optical antenna, a first receiver, and a second receiver. The dual-polarization optical antenna is configured to (i) emit a transmit beam with a first polarization orientation and (ii) and detect a return beam having a second polarization orientation. The single-polarization optical antenna is configured to detect the return beam having the second polarization orientation.

公开(公告)号：US20250118948A1

公开(公告)日：2025-04-10

申请号：US18985629

申请日：2024-12-18

Applicant: Aurora Operations, Inc.

Inventor： Andrew Steil Michaels ,  Lei Wang ,  Sen Lin

IPC: G01S7/481 ,  G01S17/32 ,  G01S17/931 ,  H01S5/40

Abstract: A photonic integrated circuit (PIC) assembly comprising a semiconductor optical amplifier (SOA) array and a U-turn chip. The SOA array includes an input SOA and a plurality of SOAs. The input SOA and the plurality of SOAs are arranged parallel to one another. The U-turn chip includes an optical splitter and a waveguide assembly. The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into beams. The waveguide assembly guides the beams to a corresponding SOA of the plurality of SOAs, and adjusts a direction of prorogation of each of the guided beams to be substantially parallel to a second direction that is substantially opposite the first direction.