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公开(公告)号：US20240219566A1
公开(公告)日：2024-07-04
申请号：US18149008
申请日：2022-12-30
Applicant: Aurora Operations, Inc.
Inventor： Ashish Bhardwaj , Amir Hosseini
CPC classification number: G01S17/58 , H01S5/02461 , H01S5/343 , H01S5/0656
Abstract: A LIDAR system comprising a laser configured to output a beam, a modulator configured to receive the beam and modulate the beam to generate a modulated beam, a photonic integrated circuit having an amplifier coupled to receive the modulated beam from the modulator and generate an amplified beam, the amplifier having an active layer and an alternating or periodic or a super lattice structure configured to dissipate heat; and a transceiver chip coupled to the photonic integrated circuit, the transceiver chip configured to emit the amplified beam and receive a reflected beam from a target.
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公开(公告)号：US20240369709A1
公开(公告)日：2024-11-07
申请号：US18774717
申请日：2024-07-16
Applicant: Aurora Operations, Inc.
Inventor： Ashish Bhardwaj , Amir Hosseini
IPC: G01S17/58 , G01S17/931 , H01S5/024 , H01S5/065 , H01S5/343
Abstract: A LIDAR system comprising a seed laser configured to output a beam, a modulator coupled to receive the beam and modulate the beam to create a modulated beam, a photonics integrated circuit having an amplifier coupled to receive the modulated beam from the modulator and generate an amplified beam, the amplifier having an active layer for high power and a super lattice structure for thermal dissipation; and a transceiver chip coupled to the photonics integrated circuit, the transceiver chip configured to emit the amplified beam and receive a reflected beam from a target.
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Patent Agency Ranking
公开(公告)号：US12222447B1
公开(公告)日：2025-02-11
申请号：US18516646
申请日：2023-11-21
Applicant: Aurora Operations, Inc.
Inventor： Ashish Bhardwaj , Sen Lin , Dong Liu , Xue Liu , Andrew Steil Michaels
Abstract: A light detection and ranging (LIDAR) system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices formed on the substrate, the two or more semiconductor devices configured to receive the beam from the light source and modify the beam and at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object in an environment of the vehicle.
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公开(公告)号：US20240219534A1
公开(公告)日：2024-07-04
申请号：US18356518
申请日：2023-07-21
Applicant: Aurora Operations, Inc.
Inventor： Ashish Bhardwaj , Colin Delaney , Stefan Heinemann , Amir Hosseini , Pruthvi Jujjavarapu , Parth Panchal , Zhizhong Tang
IPC: G01S7/4911 , G01S7/481 , G01S7/4912
CPC classification number: G01S7/4911 , G01S7/4814 , G01S7/4917
Abstract: A modular LIDAR system comprising a seed laser configured to output a beam, a modular modulator coupled to receive the beam output the seed laser and modulate the beam to create a modulated beam, a modular amplifier coupled to receive the modulated beam from the modular modulator and generate an amplified beam, and a modular transceiver chip coupled to the modular modulator and the modular amplifier, the transceiver chip configured to emit the beam perpendicularly from a first surface of the transceiver chip through an optical window; and receive a reflected beam from a target through the optical window.
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公开(公告)号：US11754687B1
公开(公告)日：2023-09-12
申请号：US18148897
申请日：2022-12-30
Applicant: Aurora Operations, Inc.
Inventor： Ashish Bhardwaj , Colin Delaney , Stefan Heinemann , Amir Hosseini , Pruthvi Jujjavarapu , Parth Panchai , Zhizhong Tang
IPC: G01C3/08 , G01S7/4911 , G01S7/481 , G01S7/4912
CPC classification number: G01S7/4911 , G01S7/4814 , G01S7/4917
Abstract: A modular LIDAR system comprising a seed laser configured to output a beam, a modular modulator coupled to receive the beam output the seed laser and modulate the beam to create a modulated beam, a modular amplifier coupled to receive the modulated beam from the modular modulator and generate an amplified beam, and a modular transceiver chip coupled to the modular modulator and the modular amplifier, the transceiver chip configured to emit the beam perpendicularly from a first surface of the transceiver chip through an optical window; and receive a reflected beam from a target through the optical window.
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公开(公告)号：US12222448B1
公开(公告)日：2025-02-11
申请号：US18516671
申请日：2023-11-21
Applicant: Aurora Operations, Inc.
Inventor： Ashish Bhardwaj , Sen Lin , Dong Liu , Xue Liu , Andrew Steil Michaels
IPC: G01S7/481 , G01S17/931 , H01L31/0352
Abstract: A light detection and ranging (LIDAR) sensor system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die including a substrate having two or more semiconductor stacks respectively associated with two or more semiconductor devices formed on the substrate, the two or more semiconductor devices respectively configured to receive the beam from the light source and modify one or more features of the beam; a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object.
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公开(公告)号：US12066537B2
公开(公告)日：2024-08-20
申请号：US18149008
申请日：2022-12-30
Applicant: Aurora Operations, Inc.
Inventor： Ashish Bhardwaj , Amir Hosseini
IPC: G01S17/58 , G01S17/931 , H01S5/024 , H01S5/343 , H01S5/065
CPC classification number: G01S17/58 , H01S5/02461 , H01S5/343 , G01S17/931 , H01S5/0656
Abstract: A LIDAR system comprising a laser configured to output a beam, a modulator configured to receive the beam and modulate the beam to generate a modulated beam, a photonic integrated circuit having an amplifier coupled to receive the modulated beam from the modulator and generate an amplified beam, the amplifier having an active layer and an alternating or periodic or a super lattice structure configured to dissipate heat; and a transceiver chip coupled to the photonic integrated circuit, the transceiver chip configured to emit the amplified beam and receive a reflected beam from a target.
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