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公开(公告)号：US11590532B2
公开(公告)日：2023-02-28
申请号：US16296476
申请日：2019-03-08
Applicant: BFLY OPERATIONS, INC.
Inventor： Keith G. Fife , Jianwei Liu
Abstract: Aspects of the technology described herein relate to ultrasound transducer devices including capacitive micromachined ultrasonic transducers (CMUTs) and methods for forming CMUTs in ultrasound transducer devices. Some embodiments include forming a cavity of a CMUT by forming a first layer of insulating material on a first substrate, forming a second layer of insulating material on the first layer of insulating material, and then etching a cavity in the second insulating material. A second substrate may be bonded to the first substrate to seal the cavity. The first layer of insulating material may include, for example, aluminum oxide. The first substrate may include integrated circuitry. Some embodiments include forming through-silicon vias (TSVs) in the first substrate prior to forming the first and second insulating layers (TSV-Middle process) or subsequent to bonding the first and second substrates (TSV-Last process).
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公开(公告)号：US20230017034A1
公开(公告)日：2023-01-19
申请号：US17953155
申请日：2022-09-26
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Jianwei Liu
Abstract: An ultrasound transducer device includes an electrode, a membrane, and vias. The membrane is separated from the electrode by a cavity between the membrane and the electrode. The vias electrically connect the electrode to a substrate disposed on an opposite side of the electrode from a side facing the membrane. The vias are disposed in the ultrasound transducer device such that greater than 50% of the vias overlap with the cavity in a plan view.
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公开(公告)号：US12269061B2
公开(公告)日：2025-04-08
申请号：US18376598
申请日：2023-10-04
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Jianwei Liu
Abstract: An ultrasound transducer device includes an electrode, a membrane separated from the electrode by a cavity between the membrane and the electrode, a patterned membrane support layer that defines a size and shape of the cavity and that is disposed between the electrode and the membrane, and vias that electrically connect the electrode to a substrate. The vias are disposed in the ultrasound transducer device such that less than 50% of the vias overlap with a support surface of the patterned membrane support layer, in a plan view.
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公开(公告)号：US11676874B2
公开(公告)日：2023-06-13
申请号：US17191829
申请日：2021-03-04
Applicant: BFLY Operations, Inc.
Inventor： Jianwei Liu , Keith G. Fife
IPC: H01L23/31 , H01L23/498 , H01L21/56 , H01L23/00 , A61B8/00
CPC classification number: H01L23/3128 , A61B8/44 , H01L21/568 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/32 , H01L24/83 , H01L24/16 , H01L24/73 , H01L2224/16235 , H01L2224/32225 , H01L2224/73253 , H01L2224/8384
Abstract: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.
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公开(公告)号：US11571711B2
公开(公告)日：2023-02-07
申请号：US16683652
申请日：2019-11-14
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
Abstract: A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating layer such that the conformal layer also has the topographic features; defining a cavity in a support layer formed over the anti-stiction layer; and bonding a membrane to the support layer.
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Patent Agency Ranking
公开(公告)号：US11354926B2
公开(公告)日：2022-06-07
申请号：US16705504
申请日：2019-12-06
Applicant: BFLY Operations, Inc.
Inventor： Jianwei Liu , Keith G. Fife , Sarp Satir
Abstract: Aspects of the technology described herein relate to sensing a fingerprint of a subject via an ultrasound fingerprint sensor. Certain aspects relate to transmitting and receiving ultrasound data at multiple different frequencies to provide sensing data from different depths within the skin of the subject. Since different ultrasound frequencies are expected to penetrate a subject's skin to different degrees, sensing a finger at multiple ultrasound frequencies may provide information on different physical aspects of the finger. For instance, sound ultrasound frequencies may sense a surface of the skin, whereas other ultrasound frequencies may penetrate through one or more of the epidermal, dermal or subcutaneous layers. The ultrasound fingerprint apparatus may have utility in various applications, including but not limited to mobile electronic devices, such as mobile phones or tablet computers, a laptop computer or biometric access equipment.
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公开(公告)号：US20250090138A1
公开(公告)日：2025-03-20
申请号：US18793062
申请日：2024-08-02
Applicant: BFLY Operations, Inc
Inventor： Keith G. Fife , Jianwei Liu , Jungwook Yang , Joseph Lutsky
Abstract: Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.
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公开(公告)号：US11988640B2
公开(公告)日：2024-05-21
申请号：US17198174
申请日：2021-03-10
Applicant: BFLY OPERATIONS, INC.
Inventor： Jianwei Liu , Lingyun Miao , Victor L. Pushparaj
CPC classification number: G01N29/2406 , A61B8/4483 , B06B1/0292 , B81B7/007 , B81C1/00166
Abstract: An ultrasonic transducer device includes a bottom electrode layer of a transducer cavity disposed over a substrate. The bottom electrode layer includes a bottom layer of a first type metal; a top layer of the first type metal; a second type metal disposed between the bottom layer and the top layer; and at least one intermediate layer of the first type metal disposed between the bottom layer and the top layer, the at least one intermediate layer configured so as to define at least two discrete layers of the second type metal.
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公开(公告)号：US11684951B2
公开(公告)日：2023-06-27
申请号：US16988125
申请日：2020-08-07
Applicant: BFLY OPERATIONS, INC.
Inventor： Jianwei Liu , Lingyun Miao , Sarp Satir
CPC classification number: B06B1/0292 , A61B8/4494 , H04R31/006 , B06B1/0629
Abstract: An ultrasonic transducer device is provided. In some embodiments, the ultrasonic transducer device includes a substrate having a membrane support layer formed on a bottom cavity layer, and an opening in the membrane support layer so as to form a transducer cavity. In some embodiments, the opening comprises a truncated circle shape.
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20.发明授权公开(公告)号：US11655141B2
公开(公告)日：2023-05-23
申请号：US16585283
申请日：2019-09-27
Applicant: BFLY OPERATIONS, INC.
Inventor： Jianwei Liu , Keith G. Fife , Joseph Lutsky , Lingyun Miao
CPC classification number: B81B7/0038 , A61B8/4483 , B81C1/00158 , G10K13/00 , H04R31/003 , B81B2201/0271 , G10K11/28
Abstract: A method of forming an ultrasound transducer device includes bonding a membrane to a substrate so as to form a sealed cavity between the membrane and the substrate. An exposed surface located within the sealed cavity includes a getter material that is electrically isolated from a bottom electrode of the cavity.
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