公开(公告)号：US20210147979A1

公开(公告)日：2021-05-20

申请号：US17159526

申请日：2021-01-27

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: C23C16/44 ,  C23C16/455

Abstract: A method for forming a coating film on a powder includes: a dispersion step of setting a container having contained the powder P in a main body of a dispersion device, and dispersing the powder in the container by the main body of the dispersion device; and an ALD step for forming the coating film on a surface of the powder, by setting the container having been removed from the main body of the dispersion device in a main body of an ALD apparatus in such a state that gas can be introduced and be exhausted, introducing a gas for performing an ALD cycle into the container, filling the container with the gas, and then exhausting the gas.

公开(公告)号：US20230405548A1

公开(公告)日：2023-12-21

申请号：US18241824

申请日：2023-09-01

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: B01J20/18 ,  B01J20/28 ,  B01J20/32 ,  B01D53/04

CPC classification number: B01J20/183 ,  B01J20/28016 ,  B01J20/28054 ,  B01J20/3204 ,  B01J20/3217 ,  B01J20/3238 ,  B01J20/3293 ,  B01D53/04 ,  B01J2220/4812 ,  B01D2253/108 ,  B01D2253/25

Abstract: A method for forming a zeolite membrane by performing an ALD cycle, the ALD cycle including a silicon oxide film forming step and an aluminum oxide film forming step. In the silicon oxide film forming step, an organic Si compound is used as a first raw material gas and OH radicals are used as a reaction gas; in the aluminum oxide film forming step, an organic Al compound is used as a second raw material gas and OH radicals are used as a reaction gas; and the silicon oxide films and the aluminum oxide films are alternately formed in forward or reverse order to form the zeolite membrane.

公开(公告)号：US20230183865A1

公开(公告)日：2023-06-15

申请号：US18109178

申请日：2023-02-13

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: C23C16/455 ,  C23C16/40 ,  C23C16/18

CPC classification number: C23C16/45553 ,  C23C16/45536 ,  C23C16/408 ,  C23C16/18

Abstract: An ALD device includes a first precursor generator that is connected to a processing gas source and generates a first precursor to be supplied to a reactor vessel, and a second precursor generator that is connected to a reducing gas source and the reactor vessel and generates a second precursor to be supplied to the reactor vessel. The first precursor generator etches a target by a first plasma excited by a first plasma generator and supplies a compound gas containing a metallic component as the first precursor. The second precursor generator supplies radicals of a reducing gas component in a second plasma excited by a second plasma generator as the second precursor.

公开(公告)号：US20220415578A1

公开(公告)日：2022-12-29

申请号：US17903936

申请日：2022-09-06

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: H01G4/252

Abstract: An electronic component manufacturing method comprising: a first step of moving an electronic component body in a first direction relative to a dip layer of a conductive paste to immerse the electronic component body in the dip layer; a second step of moving the electronic component body relative to the dip layer in a second direction that is opposite to the first direction, thereby separating the electronic component body from the dip layer; a third step of forcibly cutting a connection between the conductive paste coated on the end portions of the electronic component body and the dip layer, using a contact with a solid or fluid cutter; and a fourth step of removing excess paste from the conductive paste coated on the end portions of the electronic component body. The third and fourth steps may be conducted simultaneously by cutting and removing the paste with the paste removal member.

公开(公告)号：US20200147639A1

公开(公告)日：2020-05-14

申请号：US16738374

申请日：2020-01-09

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: B05D1/18 ,  B05C13/02 ,  H01C17/28 ,  H01G13/00 ,  H01G4/005 ,  H05K1/18 ,  H01G2/06

Abstract: An electronic component manufacturing apparatus has a holding member for holding an electronic component body, a surface plate, a moving unit that causes the holding member and the surface plate to relatively move, and a control unit that controls the moving unit. The control unit causes the moving unit to simultaneously perform a distance changing movement for changing, by shortening or extending, the distance between an end face of each electronic component body and a surface of the surface plate, and a position changing movement for changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction in which the two-dimensional position moves in parallel with the surface of the surface plate successively varies (for example, along a circular path).

公开(公告)号：US20200016624A1

公开(公告)日：2020-01-16

申请号：US16503288

申请日：2019-07-03

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: B05D1/18 ,  B05C3/09 ,  B05C13/02

Abstract: An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).