公开(公告)号：US20240174908A1

公开(公告)日：2024-05-30

申请号：US18283482

申请日：2022-03-22

Applicant: DENKA COMPANY LIMITED

Inventor： Yusuke SASAKI ,  Kenji MIYATA ,  Kei KUBOBUCHI ,  Tomonari MIYAZAKI

IPC: C09K5/14 ,  C01B21/064 ,  C08K3/38

CPC classification number: C09K5/14 ,  C01B21/0646 ,  C08K3/38 ,  C01P2004/03 ,  C01P2004/50 ,  C01P2004/54 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/16 ,  C01P2006/21 ,  C01P2006/32 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005

Abstract: A boron nitride powder that is an aggregate of boron nitride particles, wherein the boron nitride powder has a BET specific surface area of 4.6 m2/g or more, and an average pore diameter of 0.65 μm or less. A resin composition containing: the boron nitride powder, and a resin.

公开(公告)号：US20240010817A1

公开(公告)日：2024-01-11

申请号：US18041851

申请日：2021-08-19

Applicant: Denka Company Limited

Inventor： Yusuke SASAKI ,  Kenji MIYATA ,  Michiharu NAKASHIMA

IPC: C08K7/24 ,  C08J5/18

CPC classification number: C08K7/24 ,  C08J5/18 ,  C08K2201/004 ,  C08K2003/385

Abstract: A sheet containing a resin and boron nitride particles each having a hollow part, in which the resin is filled into the hollow part of the boron nitride particles.

公开(公告)号：US20230323090A1

公开(公告)日：2023-10-12

申请号：US18041901

申请日：2021-08-19

Applicant: Denka Company Limited

Inventor： Yusuke SASAKI ,  Kenji MIYATA ,  Michiharu NAKASHIMA

IPC: C08K7/24 ,  C01B21/064 ,  C09C3/04

CPC classification number: C08K7/24 ,  C01B21/064 ,  C09C3/041 ,  C01P2004/03 ,  C01P2004/84 ,  C01P2002/72 ,  C01P2004/133

Abstract: A boron nitride particle having a shell part formed of boron nitride and a hollow part surrounded by the shell part, in which a density of the boron nitride on an inside of the shell part is higher than a density of the boron nitride on an outside of the shell part. A resin composition containing the boron nitride particle and a resin. A method for producing a resin composition including a step of preparing the boron nitride particle and a step of mixing the boron nitride particle with a resin.

公开(公告)号：US20250066197A1

公开(公告)日：2025-02-27

申请号：US18723859

申请日：2022-12-23

Applicant: Denka Company Limited

Inventor： Yusuke SASAKI ,  Kenji MIYATA ,  Michiharu NAKASHIMA

IPC: C01B21/064 ,  C08K3/38

Abstract: The boron nitride particle of the present invention in cross section includes a streaky void. The heat dissipation sheet of the present invention is obtained by forming a thermally conductive resin composition including the boron nitride particle of the present invention and a resin. According to the present invention, a boron nitride particle having a small porosity and a heat dissipation sheet including the boron nitride particle can be provided.