Resin composition, cured product, laminate, and electronic member

    公开(公告)号:US11685807B2

    公开(公告)日:2023-06-27

    申请号:US17253106

    申请日:2019-07-30

    Abstract: The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.

    Oxazine compound, composition and cured product

    公开(公告)号:US11117872B2

    公开(公告)日:2021-09-14

    申请号:US15781818

    申请日:2016-11-24

    Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having the layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

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