Abstract:
The invention provides an epoxy compound A represented by the following formula (1):
in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R3 to R8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R3 to R8 is a glycidyl ether group or a 2-methylglycidyl ether group; R9 to R12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p1, p2, and q are average values of repetition, m is 0.5 to 10, p1 and p2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).
Abstract:
The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.
Abstract:
The present invention provides a curable resin composition having excellent fluidity and giving a cured product having excellent physical properties such as heat resistance, moisture resistance/solder resistance, flame retardance, and dielectric characteristics. The curable resin composition contains a resin (A) which has a benzoxazine structure represented by structural formula (A1) below and an epoxy resin (B) at such a ratio that when the total number of moles of the benzoxazine structure of the structural formula (A1) is α, and the number of moles of epoxy groups in the epoxy resin (B) is β, a ratio [β/α] is 0.1 to 0.5.
Abstract:
A task is to provide a method for producing a polycyclic aromatic aminophenol compound through a reduced number of steps at a low cost with high safety. The method for producing a polycyclic aromatic aminophenol compound includes the step of reacting a compound represented by the general formula (1) below and an aromatic amino compound with each other: Wherein n represents an integer of 1 to 8, Ar represents a benzene ring optionally having a substituent, or a naphthalene ring optionally having a substituent, each of R1 and R2 independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms and optionally having a substituent, or an aromatic group optionally having a substituent, and R3 represents a hydroxyl group, a methoxy group, or a halogen atom.
Abstract:
The present invention provides an active ester resin containing a phosphorus atom capable of providing a cured product having all of flame retardancy, heat resistance, and dielectric characteristics, an epoxy resin composition containing the same as a curing agent, a cured product thereof, a prepreg, a circuit board, and a build-up film. The active ester resin containing a phosphorus atom has Structure (I) in which a structural unit (α) in which a plurality of aromatic nuclei (X) are connected through an alicyclic hydrocarbon group is connected with another structural unit (α) through an arylene dicarbonyloxy group, and, at least one of the aromatic nuclei (X) present in the resin has a structural site (Y) represented by any one of the following Structural Formulas (y1) to (y4) as a substituent on the aromatic nucleus.
Abstract:
The present invention provides a curable resin composition having excellent fluidity and giving a cured product having excellent physical properties such as heat resistance, moisture resistance/solder resistance, flame retardance, and dielectric characteristics. The curable resin composition contains a resin (A) which has a benzoxazine structure represented by structural formula (A1) below and an epoxy resin (B) at such a ratio that when the total number of moles of the benzoxazine structure of the structural formula (A1) is α, and the number of moles of epoxy groups in the epoxy resin (B) is β, a ratio [β/α] is 0.1 to 0.5.
Abstract:
A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.
Abstract:
An epoxy resin composition used as a structural bonding agent is provided. Specifically, used is an epoxy resin composition containing an epoxy resin (A) having an epoxy equivalent of 500 to 10,000 g/eq represented by the formula (1) below:
wherein, Ar is an aromatic ring, X is a structural unit having an alkylene chain, Y is a structural unit having a polyether chain, R11 and R12 are a glycidyl ether group or a 2-methylglycidyl ether group, R13 and R14 are a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R15 and R16 are a hydrogen atom or a methyl group, m1 and m2 are 0 to 25, and m1+m2≥1, p1 and p2 are 0 to 5, and q is 0.5 to 5, an epoxy resin (B) having an epoxy equivalent of 100 to 300 g/eq, and thermally expandable particles (C).
Abstract:
The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.
Abstract:
The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having the layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.