公开(公告)号：US20160130391A1

公开(公告)日：2016-05-12

申请号：US14897100

申请日：2014-02-06

Applicant: DIC CORPORATION

Inventor： Kazuo Arita ,  Etsuko Suzuki

IPC: C08G63/692 ,  C08G59/42

CPC classification number: C08G63/692 ,  C08G59/40 ,  C08G59/423 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0326

Abstract: The present invention provides an active ester resin containing a phosphorus atom capable of providing a cured product having all of flame retardancy, heat resistance, and dielectric characteristics, an epoxy resin composition containing the same as a curing agent, a cured product thereof, a prepreg, a circuit board, and a build-up film. The active ester resin containing a phosphorus atom has Structure (I) in which a structural unit (α) in which a plurality of aromatic nuclei (X) are connected through an alicyclic hydrocarbon group is connected with another structural unit (α) through an arylene dicarbonyloxy group, and, at least one of the aromatic nuclei (X) present in the resin has a structural site (Y) represented by any one of the following Structural Formulas (y1) to (y4) as a substituent on the aromatic nucleus.

Abstract translation: 本发明提供含有能够提供具有全部阻燃性，耐热性和介电特性的固化产物的磷原子的活性酯树脂，含有该固化产物的环氧树脂组合物，其固化产物，预浸料 ，电路板和积聚膜。 含有磷原子的活性酯树脂具有其中通过脂环族烃基连接多个芳香核（X）的结构单元（α）的结构（I）通过亚芳基与另一结构单元（α）连接 并且存在于树脂中的芳香族核（X）中的至少一种具有作为芳香核上的取代基的以下结构式（y1）〜（y4）中的任一个表示的结构部位（Y）。

公开(公告)号：US10981865B2

公开(公告)日：2021-04-20

申请号：US16304875

申请日：2017-06-01

Applicant: DIC Corporation

Inventor： Junji Yamaguchi ,  Tomohiro Shimono ,  Kazuo Arita ,  Masato Otsu

IPC: C07D207/452 ,  B32B15/08 ,  B32B27/34 ,  C08F22/40 ,  C08G59/50 ,  C08J5/24 ,  H01L23/29 ,  H01L23/31

Abstract: Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.

公开(公告)号：US10399312B2

公开(公告)日：2019-09-03

申请号：US15781869

申请日：2016-11-08

Applicant: DIC Corporation

Inventor： Masato Otsu ,  Tomohiro Shimono ,  Kazuo Arita ,  Junji Yamaguchi

IPC: C07D265/16 ,  C08F2/44 ,  C08F216/12 ,  C08G14/073 ,  H05K1/03 ,  H01L23/14 ,  H01L23/29 ,  H01L23/31 ,  B32B27/42 ,  C08L61/34 ,  C08L39/00 ,  H01L23/00 ,  H01L23/373 ,  C08K7/02

Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.

公开(公告)号：US20170320994A1

公开(公告)日：2017-11-09

申请号：US15512637

申请日：2015-09-24

Applicant: DIC CORPORATION

Inventor： Kazuo Arita ,  Tatsuya Okamoto ,  Kazuhisa Yamoto ,  Yutaka Sato

IPC: C08G14/10 ,  C09K5/14 ,  C09K21/14 ,  H01L23/29 ,  C08L63/04 ,  H05K1/03 ,  C08J5/24 ,  C08L61/28 ,  H05K3/18 ,  H05K3/00 ,  H05K3/42

CPC classification number: C08G14/10 ,  C08G59/62 ,  C08G59/64 ,  C08J5/24 ,  C08J2361/28 ,  C08J2363/04 ,  C08J2461/28 ,  C08J2461/34 ,  C08J2463/04 ,  C08L61/28 ,  C08L61/34 ,  C08L63/04 ,  C08L2201/02 ,  C08L2201/08 ,  C09K5/14 ,  C09K21/14 ,  H01L23/14 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K1/0346 ,  H05K3/005 ,  H05K3/18 ,  H05K3/42 ,  H01L2924/00 ,  C08L63/00

Abstract: A triazine ring-containing phenol resin obtained by reacting melamine, para-alkylphenol, and formalin is used to provide an epoxy resin composition capable of providing a cured product with excellent flame retardancy, excellent dielectric characteristics such as a low dielectric tangent and a low dielectric constant, and excellent thermal conductivity, a cured product thereof, and a prepreg, a circuit board, a build-up film, a build-up board, a semiconductor sealing material, a semiconductor device, a fiber reinforced composite material, and a formed article using the epoxy resin composition.

公开(公告)号：US20150118499A1

公开(公告)日：2015-04-30

申请号：US14386476

申请日：2013-03-19

Applicant: DIC Corporation

Inventor： Etsuko Suzuki ,  Kazuo Arita

IPC: C08G8/32 ,  H05K1/05 ,  H05K3/00 ,  C08L61/14

CPC classification number: C08G8/32 ,  C08G8/28 ,  C08G16/0243 ,  C08G16/04 ,  C08G2190/00 ,  C08J5/24 ,  C08L61/14 ,  C08L2201/02 ,  C08L2203/206 ,  H01L23/293 ,  H01L2924/0002 ,  H05K1/0353 ,  H05K1/056 ,  H05K3/0067 ,  H05K2201/012 ,  H05K2201/0145 ,  Y10T428/31529 ,  H01L2924/00

Abstract: A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.

Abstract translation: 固化产物具有良好的耐热性和阻燃性以及低介电常数和低损耗角正切。 通过在核上具有烷氧基作为取代基的芳香醛（a1）与具有P-H基或P-OH基的有机磷化合物（a2）之间的反应获得的含磷化合物（i） 使分子结构与酚类物质（a3）反应，得到含磷酚类物质（A1）。 然后将含磷酚类物质（A1）与芳族二羧酸或芳族二羧酸或C2-6饱和二羧酸的酸酐或二卤化物或C2-6饱和二羧酸的二卤化物（A2 ）使得酚类物质（A1）的全部或部分羟基形成酯键。

公开(公告)号：US11104788B2

公开(公告)日：2021-08-31

申请号：US16470420

申请日：2017-12-14

Applicant: DIC Corporation

Inventor： Masato Otsu ,  Kazuo Arita ,  Etsuko Suzuki ,  Junji Yamaguchi ,  Tomohiro Shimono

IPC: C08L35/00 ,  C08F222/40 ,  C08J5/24 ,  H01L23/29 ,  H05K1/03

Abstract: An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.

公开(公告)号：US11028059B2

公开(公告)日：2021-06-08

申请号：US15781801

申请日：2016-11-24

Applicant: DIC Corporation

Inventor： Tomohiro Shimono ,  Junji Yamaguchi ,  Masato Otsu ,  Kazuo Arita

IPC: C07D265/16 ,  C08G61/12 ,  C08J5/24 ,  H01L23/29 ,  H05K1/03 ,  H01L23/31 ,  B32B15/08 ,  C08K3/013 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  B32B27/42 ,  H01L23/14 ,  H01L23/373 ,  H05K1/02

Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

公开(公告)号：US20180362477A1

公开(公告)日：2018-12-20

申请号：US15781801

申请日：2016-11-24

Applicant: DIC Corporation

Inventor： Tomohiro Shimono ,  Junji Yamaguchi ,  Masato Otsu ,  Kazuo Arita

IPC: C07D265/16 ,  C08G61/12 ,  C08K3/013 ,  C08J5/24 ,  H05K1/03 ,  H05K1/02 ,  H01L23/373 ,  H01L23/14 ,  B32B5/02 ,  B32B15/14 ,  B32B27/42 ,  B32B15/20

Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

公开(公告)号：US20180333941A1

公开(公告)日：2018-11-22

申请号：US15781869

申请日：2016-11-08

Applicant: DIC Corporation

Inventor： Masato Otsu ,  Tomohiro Shimono ,  Kazuo Arita ,  Junji Yamaguchi

IPC: B32B27/42 ,  C07D265/16 ,  C08L39/00

CPC classification number: B32B27/42 ,  B32B2457/08 ,  C07D265/16 ,  C08K7/02 ,  C08L39/00 ,  C08L61/34 ,  H01L23/14 ,  H01L23/293 ,  H01L23/31 ,  H01L23/3737 ,  H01L24/26 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373

Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.

公开(公告)号：US09441069B2

公开(公告)日：2016-09-13

申请号：US14389068

申请日：2013-03-19

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Hajime Watanabe

IPC: B32B27/38 ,  C08G59/22 ,  C08L63/00 ,  C08G59/14 ,  C08G59/24 ,  H05K1/03 ,  C08J7/04 ,  H05K1/02 ,  C08J5/24 ,  C08K3/22 ,  H05K3/46 ,  C08K7/18

CPC classification number: C08G59/22 ,  C08G59/1494 ,  C08G59/245 ,  C08J5/24 ,  C08J7/047 ,  C08J2363/00 ,  C08K3/013 ,  C08K3/22 ,  C08K7/18 ,  C08K2003/2227 ,  H05K1/0209 ,  H05K1/0326 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/31529 ,  C08L63/00 ,  C08K3/0033

Abstract: The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.

Abstract translation: 本发明提供一种具有低熔点，低熔体粘度，优异溶剂溶解性和优异加工性能的环氧树脂。 此外，本发明提供具有优异的流动性，加工性，柔韧性，粘附性和导热性的环氧树脂组合物及其固化产物。 环氧树脂由下述通式（I）表示（Q：具有C1-C9直链部分的亚烷基链，侧链中可具有C1-C18烷基或具有二价键之间的醚键的连接链） A：亚烷基链中连续的亚甲基; A：其中2至4个亚苯基直接键合或通过连接链或亚萘基单元n：0至10键合的亚苯基单元。 环氧树脂组合物含有环氧树脂和固化剂。 该组合物包括环氧树脂。