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    Coupling in and to RFID smart cards
    12.
    发明授权
    Coupling in and to RFID smart cards 有权
    耦合到RFID智能卡

    公开(公告)号：US08991712B2

    公开(公告)日：2015-03-31

    申请号：US13600140

    申请日：2012-08-30

    Applicant: David Finn ,  Klaus Ummenhofer

    Inventor： David Finn ,  Klaus Ummenhofer

    IPC: G06K19/06 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01F38/14

    CPC classification number: G06K19/07794 ,  G06K19/0775 ,  H01F38/14 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  Y10T29/49018

    Abstract: A data carrier such as a smart card comprising an antenna module (AM) and a booster antenna (BA). The booster antenna (BA) has an outer winding (OW) and an inner winding (IW), each of which has an inner end (IE) and an outer end (OE). A coupler coil (CC) is provided, connecting the outer end (OE, b) of the outer winding (OW) and the inner end (IE, e) of the inner winding (IW). The inner end (IE, a) of the outer winding (OW) and the outer end (OE, f) of the inner winding (IW) are left un-connected (free floating). The coupler coil (CC) may have a clockwise (CW) or counter-clockwise (CCW) sense which is the same as or opposite to the sense (CW or CCW) of the outer and inner windings. Various configurations of booster antennas (BA) are disclosed.

    Abstract translation: 诸如智能卡的数据载体，包括天线模块（AM）和增强天线（BA）。 增强天线（BA）具有外绕组（OW）和内绕组（IW），每个具有内端（IE）和外端（OE）。 提供耦合线圈（CC），连接外绕组（OW）的外端（OE，b）和内绕组（IW）的内端（IE，e）。 外绕组（OW）的内端（IE，a）和内绕组（IW）的外端（OE，f）保持不连接（自由浮动）。 耦合线圈（CC）可以具有与外绕组和内绕组的感测（CW或CCW）相同或相反的顺时针（CW）或逆时针（CCW）感测。 公开了各种配置的增强天线（BA）。

    PLASTIC CARDS WITH HIGH DENSITY PARTICLES
    13.
    发明申请
    PLASTIC CARDS WITH HIGH DENSITY PARTICLES 有权
    具有高密度颗粒的塑料卡

    公开(公告)号：US20150041546A1

    公开(公告)日：2015-02-12

    申请号：US13962925

    申请日：2013-08-08

    Applicant: JOHN HERSLOW ,  Bradley A. Paulson ,  David Finn

    Inventor： JOHN HERSLOW ,  Bradley A. Paulson ,  David Finn

    IPC: G06K19/02 ,  G06K19/08

    CPC classification number: G06K19/02 ,  B32B27/08 ,  B32B27/20 ,  B32B27/302 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/40 ,  B32B2264/105 ,  B32B2307/41 ,  B32B2307/702 ,  B32B2307/704 ,  B32B2307/75 ,  B32B2425/00 ,  B42D25/305 ,  B42D25/36 ,  B42D25/373 ,  G06K19/07722 ,  G06K19/07749 ,  G06K19/07794 ,  G06K19/083 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/268

    Abstract: High density metal or mineral particles, sized to be less than 10 microns, are compounded into a base plastic layer to form a compounded composite layer used to form the core layer of the card, any layer of the card or the entire card. The amount of high density particles compounded into the plastic layer is controlled so the card: (a) is at least twice as heavy as any standard PVC card; (b) can be manufactured using standard current plastic card equipment and tooling. (c) is not brittle; and (d) is electrically non-conductive whereby it is not subject to electrostatic discharge properties. The card can include RFID functionality integrated into the card body. The compounded composite layer does not interfere with the integrity of the data communication between an RFID chip packaged in an antenna module and coupled with an embedded booster antenna, and a contactless reader or terminal.

    Abstract translation: 尺寸小于10微米的高密度金属或矿物颗粒被复合到基础塑料层中以形成用于形成卡的芯层，卡的任何层或整个卡的复合复合层。 混合到塑料层中的高密度颗粒的量被控制，使得卡（a）至少是任何标准PVC卡的两倍; （b）可以使用标准的当前塑料卡设备和工具制造。 （c）不脆; 和（d）不导电，由此不受静电放电性能的影响。 该卡可以包括集成到卡体内的RFID功能。 复合复合层不会干扰封装在天线模块中的RFID芯片与嵌入式增强天线耦合的数字通信的完整性以及非接触读取器或终端。

    COUPLING IN AND TO RFID SMART CARDS
    18.
    发明申请
    COUPLING IN AND TO RFID SMART CARDS 有权
    耦合到RFID智能卡

    公开(公告)号：US20130075477A1

    公开(公告)日：2013-03-28

    申请号：US13600140

    申请日：2012-08-30

    Applicant: David Finn ,  Klaus Ummenhofer

    Inventor： David Finn ,  Klaus Ummenhofer

    IPC: G06K19/077

    CPC classification number: G06K19/07794 ,  G06K19/0775 ,  H01F38/14 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  Y10T29/49018

    Abstract: A data carrier such as a smart card comprising an antenna module (AM) and a booster antenna (BA). The booster antenna (BA) has an outer winding (OW) and an inner winding (IW), each of which has an inner end (IE) and an outer end (OE). A coupler coil (CC) is provided, connecting the outer end (OE, b) of the outer winding (OW) and the inner end (IE, e) of the inner winding (IW). The inner end (IE, a) of the outer winding (OW) and the outer end (OE, f) of the inner winding (IW) are left un-connected (free floating). The coupler coil (CC) may have a clockwise (CW) or counter-clockwise (CCW) sense which is the same as or opposite to the sense (CW or CCW) of the outer and inner windings. Various configurations of booster antennas (BA) are disclosed.

    Abstract translation: 诸如智能卡的数据载体，包括天线模块（AM）和增强天线（BA）。 增强天线（BA）具有外绕组（OW）和内绕组（IW），每个具有内端（IE）和外端（OE）。 提供耦合线圈（CC），连接外绕组（OW）的外端（OE，b）和内绕组（IW）的内端（IE，e）。 外绕组（OW）的内端（IE，a）和内绕组（IW）的外端（OE，f）保持不连接（自由浮动）。 耦合线圈（CC）可以具有与外绕组和内绕组的感测（CW或CCW）相同或相反的顺时针（CW）或逆时针（CCW）感测。 公开了各种配置的增强天线（BA）。

    COUPLING IN AND TO RFID SMART CARDS
    19.
    发明申请
    COUPLING IN AND TO RFID SMART CARDS 有权
    耦合到RFID智能卡

    公开(公告)号：US20120074233A1

    公开(公告)日：2012-03-29

    申请号：US13310718

    申请日：2011-12-03

    Applicant: David Finn ,  Klaus Ummenhofer

    Inventor： David Finn ,  Klaus Ummenhofer

    IPC: G06K19/077

    CPC classification number: G06K19/077 ,  G06K19/07747 ,  G06K19/07756 ,  G06K19/07769 ,  H01F38/14 ,  H01L2224/45015 ,  H01L2924/181 ,  H01L2924/20758 ,  H01L2924/00012

    Abstract: A dual interface (DI) smart card (100) comprising a chip module (CM), a module antenna (MA), a card body (CB) and a card antenna (CA) having two windings (D,E) connected with reverse phase as a “quasi-dipole”. Capacitive stubs (B,C) connected with an antenna structure (A) of the module antenna (MA). The module antenna (MA) overlaps only one of the windings (D or E) of the card antenna (CA). The card antenna (CA) may be formed from one continuous wire. Ferrite (156) shielding the module antenna (MA) from contact pads (CP) and for enhancing coupling between the module antenna (MA) and the card antenna (CA).

    Abstract translation: 一种双接口（DI）智能卡（100），包括芯片模块（CM），模块天线（MA），卡体（CB）和具有两个绕组（D，E）的反向连接的卡片天线 相作为“准偶极子”。 与模块天线（MA）的天线结构（A）连接的电容性短截线（B，C）。 模块天线（MA）仅与卡天线（CA）的绕组（D或E）中的一个重叠。 卡片天线（CA）可以由一根连续的线形成。 铁氧体（156）屏蔽模块天线（MA）与接触焊盘（CP），并增强模块天线（MA）和卡片天线（CA）之间的耦合。

    FORMING CHANNELS FOR AN ANTENNA WIRE OF A TRANSPONDER
    20.
    发明申请
    FORMING CHANNELS FOR AN ANTENNA WIRE OF A TRANSPONDER 审中-公开
    交通工具的天线布线通道

    公开(公告)号：US20110247197A1

    公开(公告)日：2011-10-13

    申请号：US12901590

    申请日：2010-10-11

    Applicant: David Finn

    Inventor： David Finn

    IPC: H01P11/00

    CPC classification number: G06K19/0775 ,  G06K19/07749 ,  G06K19/07798 ,  H01L2224/78301 ,  H01Q1/2225 ,  Y10T29/49016 ,  H01L2924/00014

    Abstract: Channels may be formed in the inlay substrate of a transponder, such as by laser ablation, and the antenna wire may subsequently be laid in the channels. Laying the wire in a channel ensures that it substantially fully embedded in the substrate, thereby eliminating a need for pressing the wire into the substrate. The channels may be tapered, or profiled, to enhance adhesion of a self-bonding wire. A recess for the chip module can also be formed using laser ablation, and insulation may be removed from end portions of the antenna wire using laser ablation. Laser ablation may also be used to create various mechanical and security features.

    Abstract translation: 通道可以形成在应答器的嵌入式衬底中，例如通过激光烧蚀，并且天线可以随后放置在通道中。 将导线放置在通道中确保其基本上完全嵌入基板中，从而不需要将线压入基板。 通道可以是锥形的或成型的，以增强自粘合线的粘附。 还可以使用激光烧蚀来形成用于芯片模块的凹部，并且可以使用激光烧蚀从绝缘天线的端部去除绝缘。 也可以使用激光烧蚀来产生各种机械和安全特征。

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