Abstract:
A carrier assembly (10) for a circuit board includes a copper insert (12) pressed into an aluminum carrier (14). The copper insert has an undercut recess (36). As the insert (12) is pressed into the carrier (14), a portion of the carrier material is flowed into the undercut recess (36) to provide a firm interlocking of the insert (12) with the carrier (14).
Abstract:
A signal (S) has a value at every point in time. The values may change in time and may lie within or outside a predetermined basic value range (BVMIN, BVMAX). The signal (S) is processed so that control steps associated with the values of the signal (S) are carried out when certain values of the signal (S) occur outside the basic value range (BVMIN, BVMAX). It may then occur that the carrying out of the control steps may be triggered in an undesirable manner because of implausible values of the signal (S). Such an implausible signal behavior must be recognized rapidly and the undesirable effects of the implausible signal behavior must be decreased or totally prevented at an early moment. For this purpose a value of the signal (S) occurring with relative frequency is determined as a dominant value (DV) as well as a frequency value (FV), which indicates frequency of occurrence of values of the signal (S) situated in the vicinity of the dominant value (DV). The execution of the control steps associated with the given values of signal (S) is then in addition rendered dependent on the magnitude of the deviation of the dominant value (DV) from the basic value range (BVMIN, BVMAX) when the frequency value (FV) reaches at least a predetermined magnitude (F1, F2). A preferred area of application of the invention is electronic control and regulating systems in vehicles.
Abstract:
The substrate (10) has a first side (12) and a second side (14) and includes an insert material (16) having a first thermal conductivity (24) in a first direction (25) and having a second thermal conductivity (26) in a second direction (27). A plurality of vias (30) are formed in the second direction through the insert material and an encapsulant material (18) surrounds the insert material. When an electronic component (22) is disposed on the first side, heat (25) from the electronic component is conducted in the first direction by the insert material and is conducted in the second direction through the plurality of vias.