公开(公告)号：US20170239778A1

公开(公告)日：2017-08-24

申请号：US15436559

申请日：2017-02-17

Applicant: Ebara Corporation

Inventor： Toru MARUYAMA ,  Hisanori MATSUO ,  Yasuyuki MOTOSHIMA ,  Yohei ETO ,  Mitsunori KOMATSU

IPC: B24B37/015 ,  B24B37/20

CPC classification number: B24B37/015 ,  B24B37/20

Abstract: There is disclosed an apparatus which can maintain a surface temperature of a polishing pad at a desired target temperature. The apparatus for regulating a surface temperature of a polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.

公开(公告)号：US20170092519A1

公开(公告)日：2017-03-30

申请号：US15311638

申请日：2015-04-06

Applicant: EBARA CORPORATION

Inventor： Suguru SAKUGAWA ,  Nobuyuki TAKAHASHI ,  Toru MARUYAMA

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/677 ,  H01L21/687 ,  B24B37/30 ,  H01L21/306

CPC classification number: H01L21/67253 ,  B24B37/005 ,  B24B37/30 ,  B24B49/08 ,  B24B49/16 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67219 ,  H01L21/67778 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68764

Abstract: The invention simplifies airbag calibration.A pressure calibration jig calibrates pressure to be applied to a plurality of airbags disposed inside a top ring for holding and pressing a wafer against a polishing pad. The pressure calibration jig includes a plurality of first passages capable of communicating with the plurality of airbags, respectively; a second passage which combines and connects the plurality of first passages to a pressure calibration sensor; and a flow control portion configured to allow a fluid to flow through the first passage of the plurality of first passages, which first passage corresponds to an airbag selected for pressure calibration, in a direction from the selected airbag toward the second passage, and also configured to prevent the fluid from flowing through the first passages other than the first passage corresponding to the selected airbag in a direction from the second passage toward the airbags.

公开(公告)号：US20150224621A1

公开(公告)日：2015-08-13

申请号：US14696908

申请日：2015-04-27

Applicant: EBARA CORPORATION

Inventor： Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Hisanori MATSUO

IPC: B24B37/015 ,  B24B49/14 ,  B24B53/017 ,  B24B37/34

CPC classification number: B24B37/015 ,  B24B37/34 ,  B24B49/14 ,  B24B53/017 ,  B24B55/02

Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

Abstract translation: 抛光装置通过将基板压靠在研磨台上的抛光垫上来抛光基板的表面。 抛光装置被配置为通过在抛光期间在抛光垫上吹入气体来控制抛光垫的抛光表面的温度。 抛光装置包括：衬垫温度控制机构，其具有至少一个气体喷射喷嘴，用于向抛光垫喷射气体，并且构造成将气体吹送到抛光垫上以控制抛光垫的温度;以及雾化器，其具有至少一个 用于喷射气体和液体的液体或混合流体的喷嘴，用于将液体或混合流体吹送到抛光垫上以去除抛光垫上的异物。 焊盘温度控制机构和雾化器形成为一体的单元。

公开(公告)号：US20190118334A1

公开(公告)日：2019-04-25

申请号：US16226497

申请日：2018-12-19

Applicant: EBARA CORPORATION

Inventor： Toru MARUYAMA ,  Hisanori MATSUO ,  Yasuyuki MOTOSHIMA

IPC: B24B37/015 ,  B24B55/02 ,  B24B49/14 ,  G01J5/02

CPC classification number: B24B37/015 ,  B24B49/14 ,  B24B55/02 ,  G01J5/025 ,  G01J2005/0085

Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

公开(公告)号：US20180222007A1

公开(公告)日：2018-08-09

申请号：US15946843

申请日：2018-04-06

Applicant: EBARA CORPORATION

Inventor： Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Hisanori MATSUO

IPC: B24B37/015 ,  B24B53/017 ,  B24B49/14 ,  B24B55/02 ,  B24B37/34

CPC classification number: B24B37/015 ,  B24B37/34 ,  B24B49/14 ,  B24B53/017 ,  B24B55/02

Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

公开(公告)号：US20160315002A1

公开(公告)日：2016-10-27

申请号：US15132928

申请日：2016-04-19

Applicant: EBARA CORPORATION

Inventor： Mitsunori KOMATSU ,  Toru MARUYAMA ,  Yoshinori ISONO ,  Hiroaki YANAGI

IPC: H01L21/67 ,  B24B37/005 ,  B24B37/34 ,  H01L21/66 ,  H01L21/687

CPC classification number: H01L21/67288 ,  B24B37/0053 ,  B24B37/345 ,  H01L21/67219 ,  H01L22/12

Abstract: A substrate processing apparatus having a detecting unit that can detect an abnormality of a substrate such as a crack of the substrate or chipping of the substrate is disclosed. The substrate processing apparatus includes a polishing unit configured to polish a substrate, a cleaning unit configured to clean the polished substrate, a substrate abnormality detection unit configured to detect an abnormality of the substrate, and a substrate transporting mechanism configured to transport the substrate in the order of the polishing unit, the substrate abnormality detection unit, and the cleaning unit. The substrate abnormality detection unit includes an imaging device configured to image the substrate, and an output monitoring unit configured to determine a status of the substrate by comparing a signal obtained from the imaging device with a predetermined threshold.

Abstract translation: 公开了一种具有检测单元的基板处理装置，该检测单元可以检测基板的异常，例如基板的裂纹或基板的碎裂。 基板处理装置包括：抛光单元，被配置为对基板进行抛光;清洁单元，被配置为清洁抛光的基板;基板异常检测单元，被配置为检测基板的异常;以及基板输送机构， 抛光单元，基板异常检测单元和清洁单元的顺序。 基板异常检测单元包括被配置为对基板进行成像的成像装置和输出监视单元，其被配置为通过将从成像装置获得的信号与预定阈值进行比较来确定基板的状态。

公开(公告)号：US20140364040A1

公开(公告)日：2014-12-11

申请号：US14468675

申请日：2014-08-26

Applicant: EBARA CORPORATION

Inventor： Tadakazu SONE ,  Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Katsutoshi ONO ,  Yoichi SHIOKAWA

IPC: B24B37/015 ,  B24B37/04

CPC classification number: B24B37/015 ,  B24B37/042 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02

Abstract: An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

Abstract translation: 用于抛光基板的装置包括：支撑抛光垫的可旋转的抛光台;衬底保持器，其构造成保持基板，并将基板压靠在旋转的抛光台上的抛光垫的抛光表面上，以便抛光基板;以及 衬垫温度检测器，被配置为测量抛光垫的抛光表面的温度。 该装置还包括：衬垫温度调节器，其被配置为接触抛光表面以调节抛光表面的温度;以及温度控制器，其被配置为通过基于关于温度的信息控制焊盘温度调节器来控制抛光表面的温度 由焊盘温度检测器检测到的抛光表面。

公开(公告)号：US20220305617A1

公开(公告)日：2022-09-29

申请号：US17692038

申请日：2022-03-10

Applicant: EBARA CORPORATION

Inventor： Keisuke KAMIKI ,  Toru MARUYAMA ,  Yasuyuki MOTOSHIMA

IPC: B24B55/02 ,  B24B37/04 ,  B24B37/015 ,  B24B37/34

Abstract: A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.

公开(公告)号：US20190126428A1

公开(公告)日：2019-05-02

申请号：US16173937

申请日：2018-10-29

Applicant: EBARA CORPORATION

Inventor： Toru MARUYAMA ,  Yasuyuki MOTOSHIMA ,  Hisanori MATSUO ,  Masashi KABASAWA

IPC: B24B37/015 ,  B24B37/04 ,  H01L21/306 ,  F28F19/04 ,  F28G1/16

Abstract: A heat exchanger capable of preventing sticking of slurry is disclosed. The heat exchanger includes: a flow passage structure having a heating flow passage and a cooling flow passage formed therein; and a water-repellent material covering a side surface of the flow passage structure. A side surface of the heat exchanger is constituted by the water-repellent material.

公开(公告)号：US20170117165A1

公开(公告)日：2017-04-27

申请号：US15128309

申请日：2015-03-17

Applicant: EBARA CORPORATION

Inventor： Junji KUNISAWA ,  Toru MARUYAMA ,  Masayoshi IMAI ,  Koji MAEDA ,  Mitsuru MIYAZAKI ,  Teruaki HOMBO ,  Fujihiko TOYOMASU

IPC: H01L21/67 ,  B08B9/027 ,  B08B3/08 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B9/027 ,  H01L21/02052 ,  H01L21/67046 ,  H01L21/68728

Abstract: The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, while supplying a cleaning liquid (e.g. pure water and a liquid chemical) to the substrate, and also relates to a pipe cleaning method for the substrate processing apparatus. The substrate processing apparatus includes: a first cleaning lane including first cleaning units (52), (54) each for cleaning a substrate while supplying pure water to the substrate; a second cleaning lane including second cleaning units (60), (62) each for cleaning a substrate while supplying pure water to the substrate; a first pure-water supply pipe (120) for supplying the pure water to the first cleaning lane; and a second pure-water supply pipe (180) for supplying the pure water to the second cleaning lane.