公开(公告)号：US20240075579A1

公开(公告)日：2024-03-07

申请号：US18272941

申请日：2022-01-05

Applicant: EBARA CORPORATION

Inventor： Kohei OHSHIMA ,  Hisanori MATSUO ,  Toshifumi KIMBA ,  Nobuyuki TAKADA

IPC: B24B37/005

CPC classification number: B24B37/005

Abstract: The present invention relates to a surface property measuring apparatus for a polishing pad used for polishing a substrate, such as a semiconductor wafer, a surface property measuring method for a polishing pad, and a surface property judging mehod for a polishing pad. The surface property measuring apparatus (30) includes: a light-emitting structure (32) configured to irradiate the polishing pad (2) with light from a plurality of directions as viewed from a polishing surface (2a) of the polishing pad (2); and a light-receiving structure (32) configured to receive reflected light traveling in a plurality of directions from the surface of the polishing pad (2).

公开(公告)号：US20150283669A1

公开(公告)日：2015-10-08

申请号：US14645372

申请日：2015-03-11

Applicant: EBARA CORPORATION ,  Kyushu Institute of Technology

Inventor： Hisanori MATSUO ,  Yoshihiro MOCHIZUKI ,  Keisuke SUZUKI ,  Takahiro TAJIRI ,  Souichirou ICHIOKA

IPC: B24B49/12 ,  H01L21/67 ,  H01L21/306 ,  B24B53/017

CPC classification number: B24B49/12 ,  B24B53/017 ,  H01L21/3212

Abstract: A polishing apparatus having a polishing pad surface property measuring device that is capable of measuring surface properties of a polishing pad in a state where a liquid film exists on the polishing pad is disclosed. The polishing apparatus includes a dam configured to dam a liquid on the polishing pad to form a liquid film having a thickness equal to or greater than a prescribed value in at least part of an area on the polishing pad, a light emitter having a light emission end disposed in the liquid film formed by the dam and configured to emit a laser beam onto the polishing pad, a light receiver disposed in the liquid film formed by the dam and configured to receive light scattered by and bounced off the polishing pad at a plurality of angles due to surface properties of the polishing pad after the laser beam is emitted from the light emitter, and a processor configured to perform Fourier transform on the light received by the light receiver into a predetermined wavelength corresponding to a reflection intensity distribution and to determine a feature quantity of the surface properties of the pad.

Abstract translation: 公开了一种抛光装置，其具有能够在抛光垫上存在液膜的状态下测量抛光垫的表面特性的抛光垫表面性质测量装置。 抛光装置包括：阻挡件，其构造成阻挡抛光垫上的液体，以在抛光垫的至少一部分区域中形成厚度等于或大于规定值的液膜，具有发光的发光体 端部设置在由坝形成的液膜中，并被配置为将激光束发射到抛光垫上;光接收器，设置在由坝形成的液膜中，并被配置为接收多个抛光垫散射并从其抛出的光 由激光束从光发射器发射之后由于抛光垫的表面特性而产生的角度;以及处理器，被配置为对由光接收器接收的光执行对应于反射强度分布的预定波长的傅里叶变换，并且确定 垫的表面特性的特征量。

公开(公告)号：US20210283746A1

公开(公告)日：2021-09-16

申请号：US17193049

申请日：2021-03-05

Applicant: EBARA CORPORATION

Inventor： Takuya MORIURA ,  Hiroshi SOTOZAKI ,  Tadakazu SONE ,  Masayoshi ITO ,  Itsuki KOBATA ,  Hisanori MATSUO ,  Tetsuya TERADA

IPC: B24B57/02 ,  B24B37/04

Abstract: There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.

公开(公告)号：US20180021917A1

公开(公告)日：2018-01-25

申请号：US15697047

申请日：2017-09-06

Applicant: EBARA CORPORATION

Inventor： Toru MARUYAMA ,  Hisanori MATSUO ,  Yasuyuki MOTOSHIMA

IPC: B24B37/015 ,  B24B49/14 ,  G01J5/02 ,  G01J5/00

CPC classification number: B24B37/015 ,  B24B49/14 ,  B24B55/02 ,  G01J5/025 ,  G01J2005/0085

Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

公开(公告)号：US20150056891A1

公开(公告)日：2015-02-26

申请号：US14463214

申请日：2014-08-19

Applicant: EBARA CORPORATION

Inventor： Hisanori MATSUO

IPC: B24B49/12 ,  B24B53/017 ,  G01B11/30 ,  B24B37/005

CPC classification number: B24B49/12 ,  B24B37/005 ,  B24B53/017 ,  G01B11/303

Abstract: There is disclosed a measuring method of a surface roughness of a polishing pad which can measure a surface roughness index of the polishing pad showing a strong relationship with polishing performance. A method for measuring a surface roughness of a polishing pad includes acquiring an image of a surface of a polishing pad by using a laser microscope, selecting only a region which has a height larger than an average height from the acquired image, and calculating a surface roughness from only the selected region.

Abstract translation: 公开了一种可以测量抛光垫的表面粗糙度指数与抛光性能有很强关系的抛光垫表面粗糙度的测量方法。 用于测量抛光垫的表面粗糙度的方法包括：通过使用激光显微镜获取抛光垫的表面的图像，从所获取的图像中仅选择具有高于平均高度的高度的区域，并且计算表面 仅从所选区域的粗糙度。

公开(公告)号：US20140273753A1

公开(公告)日：2014-09-18

申请号：US14203494

申请日：2014-03-10

Applicant: EBARA CORPORATION

Inventor： Hisanori MATSUO ,  Yoshihiro MOCHIZUKI ,  Chikako TAKATOH ,  Tadashi OBO

IPC: B24B37/005 ,  B24B49/12 ,  B24B57/02 ,  B24B37/04

CPC classification number: B24B37/005 ,  B24B49/12 ,  B24B57/02

Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus includes a polishing liquid supply nozzle for supplying a polishing liquid onto the polishing pad, a polishing liquid storage mechanism disposed on the polishing pad for storing the polishing liquid on the polishing pad by damming the polishing liquid, and a polishing liquid sensor for measuring a physical quantity representing the freshness of the polishing liquid stored by the polishing liquid storage mechanism. The polishing apparatus further includes a freshness measuring instrument for calculating the freshness of the stored polishing liquid from the physical quantity measured by the polishing liquid sensor, and a freshness controller for controlling supply conditions of the polishing liquid or storage state of the polishing liquid, based on the freshness of the polishing liquid that is determined by the freshness measuring instrument.

Abstract translation: 抛光装置通过将基板压靠在研磨台上的抛光垫上来抛光基板的表面。 抛光装置包括：抛光液供给喷嘴，用于将抛光液体提供到抛光垫上;抛光液体存储机构，设置在抛光垫上，用于通过阻止抛光液将抛光液储存在抛光垫上;抛光液体传感器， 测量表示由研磨液储存机构储存的研磨液的新鲜度的物理量。 抛光装置还包括：新鲜度测量装置，用于根据由抛光液体传感器测量的物理量计算储存的抛光液的新鲜度;以及新鲜度控制器，用于控制抛光液的供应条件或抛光液的储存状态 在由新鲜度测量仪器确定的抛光液的新鲜度上。

公开(公告)号：US20240308018A1

公开(公告)日：2024-09-19

申请号：US18570406

申请日：2022-05-24

Applicant: EBARA CORPORATION

Inventor： Yuta SUZUKI ,  Hiroki TAKAHASHI ,  Akira NAKAMURA ,  Katsuhide WATANABE ,  Hisanori MATSUO ,  Takahito KAGOSHIMA

IPC: B24B37/005 ,  H01L21/67

CPC classification number: B24B37/005 ,  H01L21/67253 ,  H01L21/67288

Abstract: Included are: at least one sensor that detects a physical quantity of an object during polishing and/or during cleaning and/or during drying of a substrate; a conversion section that converts a sensor value during polishing and/or during cleaning and/or during drying detected by the sensor into a feature amount for each processing step with respect to a trained machine learning model; and an inference section that outputs at least one predicted value of a number of defects, a size of a defect, and a position of a defect in a target substrate by inputting target data including the feature amount to the trained machine learning model.

公开(公告)号：US20210114164A1

公开(公告)日：2021-04-22

申请号：US17065787

申请日：2020-10-08

Applicant: EBARA CORPORATION

Inventor： Masashi KABASAWA ,  Yasuyuki MOTOSHIMA ,  Hisanori MATSUO ,  Keisuke KAMIKI

IPC: B24B37/015 ,  B24B37/013 ,  B24B37/20

Abstract: There is disclosed a polishing apparatus which can regulate a surface temperature of the polishing pad without causing a defect such as a scratch on a substrate such as a wafer. The polishing apparatus includes: a non-contact type pad-temperature regulating device; a pad-temperature measuring device. The pad-temperature measuring device is arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of a polishing table.

公开(公告)号：US20190126428A1

公开(公告)日：2019-05-02

申请号：US16173937

申请日：2018-10-29

Applicant: EBARA CORPORATION

Inventor： Toru MARUYAMA ,  Yasuyuki MOTOSHIMA ,  Hisanori MATSUO ,  Masashi KABASAWA

IPC: B24B37/015 ,  B24B37/04 ,  H01L21/306 ,  F28F19/04 ,  F28G1/16

Abstract: A heat exchanger capable of preventing sticking of slurry is disclosed. The heat exchanger includes: a flow passage structure having a heating flow passage and a cooling flow passage formed therein; and a water-repellent material covering a side surface of the flow passage structure. A side surface of the heat exchanger is constituted by the water-repellent material.

公开(公告)号：US20150346088A1

公开(公告)日：2015-12-03

申请号：US14725322

申请日：2015-05-29

Applicant: EBARA CORPORATION

Inventor： Chikako TAKATOH ,  Yumiko NAKAMURA ,  Tadashi OBO ,  Hisanori MATSUO

IPC: G01N21/33 ,  G01N27/26 ,  B24B49/12 ,  G01N30/74 ,  B24B37/005

CPC classification number: G01N21/33 ,  B24B37/0056 ,  B24B49/12 ,  G01N21/31 ,  G01N2021/3155 ,  G01N2030/8809

Abstract: A method for judging polishing performance of a polishing liquid, which can judge freshness of a slurry by measuring a component concentration or a physical quantity corresponding to the component concentration of the slurry after polishing and by evaluating an accelerator component and an inhibitor component of the slurry is disclosed. The polishing performance judging method of a polishing liquid judges polishing performance of a polishing liquid containing an accelerator for promoting dissolution of an object to be polished and an inhibitor for inhibiting dissolution of the object to be polished. The method includes analyzing a polishing waste liquid by spectroscopy, selecting a plurality of wavelengths from wavelengths which can distinguish the accelerator, the inhibitor, and a complex compound of the accelerator and a metal to be polished, and measuring absorbance at the selected plurality of wavelengths to thereby judge the polishing performance of the polishing liquid.

Abstract translation: 一种用于判断研磨液的抛光性能的方法，其可以通过测量与研磨后的浆料的成分浓度相对应的成分浓度或物理量，并通过评价浆料的促进剂成分和抑制剂成分来判断浆料的新鲜度 被披露。 抛光液的抛光性能判断方法判断含有促进被研磨物的溶解的促进剂的研磨液的研磨性能和抑制被研磨物的溶解的抑制剂。 该方法包括通过光谱法分析抛光废液，从可区分加速剂，抑制剂和加速剂与待抛光金属的复合化合物的波长选择多个波长，并测量所选择的多个波长处的吸光度 从而判断研磨液的研磨性能。