Abstract:
Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.
Abstract:
Provided is an optical OFDM receiver. The optical OFDM receiver receives an optical signal dependent on the nonlinearity of a transmitter. The optical OFDM receives includes an optical down converter, a nonlinearity compensator, and an OFDM demodulator. The optical down converter converts the optical signal into an electrical signal. The nonlinearity compensator filters the electrical signal, for compensating distortion which is added to the optical signal when the transmitter performs optical modulation. The OFDM demodulator demodulates the distortion-compensated electrical signal in an OFDM scheme.