公开(公告)号：US20190166720A1

公开(公告)日：2019-05-30

申请号：US16171835

申请日：2018-10-26

Applicant: FUJITSU LIMITED

Inventor： Keizou Takemura ,  Jie Wei ,  Masumi Suzuki ,  Michimasa Aoki ,  Mitsutaka Yamada

IPC: H05K7/20

Abstract: A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.

公开(公告)号：US10014239B2

公开(公告)日：2018-07-03

申请号：US15607851

申请日：2017-05-30

Applicant: FUJITSU LIMITED

Inventor： Keizou Takemura ,  Jie Wei ,  Mitsutaka Yamada ,  Michimasa Aoki ,  Masumi Suzuki

IPC: H01L23/473 ,  H05K7/20 ,  H05K1/02 ,  G06F1/20

CPC classification number: H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/42 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/0203 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20509 ,  H05K7/20772

Abstract: An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.

公开(公告)号：USD742337S1

公开(公告)日：2015-11-03

申请号：US29481551

申请日：2014-02-06

Applicant: FUJITSU LIMITED

Designer： Masayuki Watanabe ,  Hideki Kimura ,  Kenji Sasabe ,  Fumihiro Tawa ,  Takeshi Nishiyama ,  Jie Wei ,  Masumi Suzuki ,  Michimasa Aoki

公开(公告)号：US09134070B2

公开(公告)日：2015-09-15

申请号：US13756964

申请日：2013-02-01

Applicant: FUJITSU LIMITED

Inventor： Michimasa Aoki ,  Masumi Suzuki ,  Yosuke Tsunoda

IPC: H05K7/20 ,  F28D1/047 ,  G06F1/20 ,  F28F9/02 ,  F28F9/26

CPC classification number: F28D1/0476 ,  F28F9/0202 ,  F28F9/262 ,  G06F1/20 ,  H05K7/20218 ,  H05K7/20781

Abstract: There is provided a radiator which includes a tank including first and second chambers that are separated from each other, the first and second chambers including first and second openings, respectively, a first tube including first and second ends, the first and second ends communicating with the first and second chambers, respectively, and a second tube being next to the first tube, the second tube including first and second ends communicating with the first and second chambers, respectively, wherein the first chamber includes first and second flow channels that communicate with the first opening, the first and second channels being split so as to sandwich at least part of the second chamber, and the first ends of the first and second tubes sandwich the second ends of the first and second tubes.

Abstract translation: 提供了一种散热器，其包括：包括彼此分离的第一和第二室的箱，分别包括第一和第二开口的第一和第二室，包括第一和第二端的第一管，第一和第二端与 所述第一和第二腔分别与第一管相邻，第二管分别包括与第一和第二腔室连通的第一和第二端，其中第一腔室包括第一和第二流动通道，其与 第一开口，第一和第二通道被分开以夹住第二室的至少一部分，并且第一和第二管的第一端夹着第一和第二管的第二端。

公开(公告)号：US09661780B2

公开(公告)日：2017-05-23

申请号：US14340739

申请日：2014-07-25

Applicant: FUJITSU LIMITED

Inventor： Michimasa Aoki ,  Masumi Suzuki ,  Jie Wei ,  Fumihiro Tawa ,  Kenji Sasabe

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/467 ,  H01L23/473

CPC classification number: H05K7/20 ,  H01L23/3675 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.

公开(公告)号：US09653380B2

公开(公告)日：2017-05-16

申请号：US15138329

申请日：2016-04-26

Applicant: FUJITSU LIMITED

Inventor： Makoto Suwada ,  Mitsutaka Yamada ,  Masumi Suzuki ,  Michimasa Aoki ,  Keizou Takemura ,  Shinichirou Okamoto ,  Kenji Katsumata ,  Jie Wei

IPC: H01L23/34 ,  H01L23/473 ,  H01L23/367 ,  H01L23/427 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/473 ,  H01L23/3675 ,  H01L23/427 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/15312 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A substrate is disclosed, which can remove heat from a stacked body of semiconductor elements through a phase change of a coolant. The substrate of the application includes: a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body.

公开(公告)号：US09101079B2

公开(公告)日：2015-08-04

申请号：US13969061

申请日：2013-08-16

Applicant: FUJITSU LIMITED

Inventor： Nobumitsu Aoki ,  Takeshi Nishiyama ,  Takashi Urai ,  Masumi Suzuki ,  Michimasa Aoki ,  Jie Wei ,  Fumihiro Tawa ,  Yoshinori Uzuka

IPC: H05K7/20 ,  F28D15/00 ,  H01L23/34 ,  H01L23/467 ,  H01L23/473 ,  F28F7/00

CPC classification number: H05K7/20263 ,  F28D15/00 ,  F28F7/00 ,  H01L23/34 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20272 ,  H05K7/20772 ,  H01L2924/00

Abstract: A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably.

Abstract translation: 冷却单元包括散热器，连接到散热器的刚性供应管和由散热器进行空气冷却的制冷剂流动;多个打开的喷嘴，设置在供应管上，以对应于多个发热部件 多个热接收单元，其安装在相应的多个发热部件上并连接到各个开口喷嘴，并且允许从所述开口喷嘴供给的制冷剂流过内部通道;以及多个回流管， 为每个受热单元设置并接合到热接收单元，并且将从热接收单元排出的制冷剂返回到散热器，其中各个热接收单元连接到供应管以相对位移，以及 相应的回流管道彼此串联连接并相对移动。

公开(公告)号：US11178790B2

公开(公告)日：2021-11-16

申请号：US16845127

申请日：2020-04-10

Applicant: FUJITSU LIMITED

Inventor： Michimasa Aoki ,  Masumi Suzuki ,  Mitsutaka Yamada

IPC: H05K7/20 ,  F28D20/02

Abstract: An immersion tank includes a tank main body that includes a storage unit that stores a cooling liquid in which an electronic device is immersed, an upper part of the storage unit having an opening, a lid body that includes a top wall portion and a side wall portion, and is paired with the tank main body, and a gas-phase heat exchanger that cools a space between the storage unit and the top wall portion.

公开(公告)号：US10083938B2

公开(公告)日：2018-09-25

申请号：US15381857

申请日：2016-12-16

Applicant: FUJITSU LIMITED

Inventor： Mitsutaka Yamada ,  Masumi Suzuki ,  Michimasa Aoki ,  Jie Wei

IPC: H01L23/46 ,  H01L25/065 ,  H01L25/16 ,  H01L23/04 ,  H01L23/44

CPC classification number: H01L25/0657 ,  H01L23/04 ,  H01L23/44 ,  H01L23/46 ,  H01L25/165 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589

Abstract: A semiconductor module includes: a container through which a refrigerant flows; a semiconductor device installed within the container and having an internal path through which the refrigerant flows; and a guide member installed within the container to adjust a first flow rate of the refrigerant flowing through the internal path, and a second flow rate of the refrigerant flowing outside the semiconductor device.

公开(公告)号：US09924614B2

公开(公告)日：2018-03-20

申请号：US15424320

申请日：2017-02-03

Applicant: FUJITSU LIMITED

Inventor： Masumi Suzuki ,  Michimasa Aoki ,  Jie Wei

IPC: H05K7/20 ,  F04D13/12 ,  F04B23/04 ,  F04B9/117

CPC classification number: H05K7/20272 ,  F04B9/117 ,  F04B23/04 ,  F04D13/12 ,  H05K7/202 ,  H05K7/20263 ,  H05K7/20636 ,  Y10T137/86163 ,  Y10T137/87265

Abstract: A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant to the plurality of pumps, a plurality of flow merging ports through which the coolant from the plurality of pumps merges, and a coolant outlet port; and a separating wall that is provided inside the casing and that separates the inside of the casing into a distribution chamber that is in communication with the inlet port and the branch ports, and a flow merging chamber that is in communication with the flow merging ports and the outlet port.