公开(公告)号：US11130281B2

公开(公告)日：2021-09-28

申请号：US16285477

申请日：2019-02-26

Applicant: Formlabs, Inc.

Inventor： Justin Keenan ,  Brendan Pratt ,  Maxim Lobovsky

IPC: B29C64/153 ,  B29C64/268 ,  B29C64/295 ,  B29C64/286 ,  B33Y30/00 ,  B33Y10/00

Abstract: Substantially equal amounts of thermal energy may be provided over a build area of an additive fabrication device using as few as one heat source by selectively attenuating thermal energy emitted by the heat source. The thermal energy may be selectively attenuated by a structure that blocks portions of the thermal energy from being directly incident upon the build area such that the heat is normalized over the build area. The heat distribution over the build area may, in some embodiments, approximate the heat distribution produced by a flat field heating element, yet may be produced at comparatively lower cost and with less complex engineering.

公开(公告)号：US20210239535A1

公开(公告)日：2021-08-05

申请号：US17168132

申请日：2021-02-04

Applicant: Formlabs, Inc.

Inventor： Justin Keenan

IPC: G01J5/02 ,  G01J5/08

Abstract: Techniques for preventing contamination of an electronic component via gas flow are described. According to some aspects, an electronic component module is configured to provide gas flow past and away from an electronic component such that thermal and material exchange is limited between the electronic component module and a coupled system. In some embodiments, the coupled system may be a portion of an additive fabrication device. As a result, a reduced number of contaminants may adhere to the electronic component, extending its lifespan and reducing maintenance.

公开(公告)号：US20200282657A1

公开(公告)日：2020-09-10

申请号：US16811567

申请日：2020-03-06

Applicant: Formlabs, Inc.

Inventor： Shane Wighton ,  Andrew M. Goldman ,  Henry Whitney ,  Justin Keenan

IPC: B29C64/393 ,  B29C64/129 ,  B29C64/286 ,  B29C64/268 ,  B29C64/245 ,  B29C64/236

Abstract: According to some aspects, techniques are provided for identifying contamination in additive fabrication devices by measuring light interacting with the contamination using one or more light sensors. Contamination located between a light source and a target of a light source can affect the uniformity and intensity of the light source when incident upon the target. For instance, in an inverse stereolithography device, contamination located between a light source and a liquid photopolymer resin that is to be cured can affect the quality of the fabricated object when the light is scattered or blocked by the contamination. Identifying the presence of contamination between the light source and the liquid photopolymer resin and alerting the user prior to initiating a fabrication process may increase the quality of the resulting fabricated object and improve the user experience by saving time and photocurable liquid.

公开(公告)号：US20190210289A1

公开(公告)日：2019-07-11

申请号：US15865421

申请日：2018-01-09

Applicant: Formlabs, Inc.

Inventor： Benjamin FrantzDale ,  Justin Keenan

IPC: B29C64/393 ,  G01B11/00 ,  B33Y50/02

CPC classification number: B29C64/393 ,  B29C64/135 ,  B29C64/153 ,  B33Y10/00 ,  B33Y50/02 ,  G01B11/002

Abstract: Techniques of optically sensing fiducial targets, such as calibration patterns, within an additive fabrication device are provided. In some embodiments, fiducial targets may be disposed on a structure configured to contact source material of the additive fabrication device, the source material being a material from which the device is configured to fabricate solid objects. Indirect sensing means may be employed such that light emitted from a light source of the additive fabrication device scatters from the surface of a fiducial target. At least some of this scattered light can be measured by a sensor and used to determine a position of the fiducial target. In some embodiments, the fiducial target may be configured to move relative to the light source and/or sensor to provide additional information on the target's position via the light scattered from its surface.