RESIN COMPOSITION AND RESIN MOLDED ARTICLE
    11.
    发明申请

    公开(公告)号:US20180179381A1

    公开(公告)日:2018-06-28

    申请号:US15683874

    申请日:2017-08-23

    Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond that includes a first resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the first resin and the thermoplastic resin is from 0° C. to 90° C. and a second resin containing at least one of an amide bond and an imide bond and having a melting temperature which is higher than that of the thermoplastic resin and that of the first resin, and a compatibilizer.

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