公开(公告)号：US20200117226A1

公开(公告)日：2020-04-16

申请号：US16159831

申请日：2018-10-15

Applicant: GLOBALFOUNDRIES INC.

Inventor： Arif A. Siddiqi ,  Juhan Kim ,  Mahbub Rashed

IPC: G05F3/20 ,  G11C5/14

Abstract: Embodiments of the disclosure provide a circuit structure for producing a full range biasing voltage including: a logic control node; first and second voltage generators, coupled to the logic control node, the first and second voltage generators configured to generate a positive voltage output at a positive voltage node and a negative voltage output at a negative voltage node; first and second multiplexer cells, coupled to the logic control node, configured to multiplex the positive voltage level received from the first or the second positive voltage node and the negative voltage level received from the first or the second negative voltage node to provide a multiplexed output; and an output node coupled to each of the first multiplexer cell and the second multiplexer cell configured to receive the multiplexed output to provide a biasing voltage range to at least one transistor having a back-gate terminal.

公开(公告)号：US10366954B1

公开(公告)日：2019-07-30

申请号：US15962065

申请日：2018-04-25

Applicant: GLOBALFOUNDRIES INC.

Inventor： Juhan Kim ,  Mahbub Rashed ,  Navneet Jain

IPC: H01L23/528 ,  H01L23/522 ,  G06F17/50 ,  H01L27/02 ,  H01L23/50

Abstract: In an exemplary structure, a first conductor connects a power source to integrated circuit devices. The first conductor includes a first axis defining a first side and a second side. A second conductor, perpendicular to the first conductor, is connected to the first conductor by first vias. A third conductor, parallel to the first conductor, is connected to the second conductor by second vias. The third conductor includes a second axis defining a third side and a fourth side. The first side and the third side are aligned in a first plane perpendicular to the conductors and the second side and the fourth side are aligned in a second plane perpendicular to the conductors. The first vias contact the first conductor in only the first side. The second vias contact the third conductor in only the third side. And the second conductor is outside the second plane.

公开(公告)号：US10242946B2

公开(公告)日：2019-03-26

申请号：US15418001

申请日：2017-01-27

Applicant: GLOBALFOUNDRIES INC.

Inventor： Irene Y. L. Lin ,  Lei Yuan ,  Mahbub Rashed

IPC: G06F17/50 ,  H01L27/02 ,  H01L23/522 ,  H01L23/528 ,  H01L27/118

Abstract: A multi-layer integrated circuit structure includes (among other components) a first layer having gate conductors, a second layer having M0 conductors, a third layer having M1 conductors, and a fourth layer having M2 conductors. The M0 and M2 conductors are perpendicular to the gate conductors, and parallel to each other. The M1 conductors connect the M0 conductors to the M2 conductors. The gate conductors are positioned in the first layer in the same locations in the horizontal direction. The M1 conductors are positioned in the third layer in a different location in the horizontal direction that is different from the locations of the gate conductors, so that the M1 conductors do not overlap any of the gate conductors, solving a substantial routing challenge for the input and output contacts.

公开(公告)号：US20170125403A1

公开(公告)日：2017-05-04

申请号：US15286196

申请日：2016-10-05

Applicant: GLOBALFOUNDRIES INC.

Inventor： Juhan Kim ,  Mahbub Rashed ,  Navneet Jain ,  Anurag Mittal ,  Sangmoon Kim

IPC: H01L27/06 ,  H01L29/66 ,  G06F17/50 ,  H01L27/11 ,  H01L27/02

CPC classification number: H01L27/0629 ,  G06F17/5072 ,  H01L27/0207 ,  H01L27/1104 ,  H01L27/1203 ,  H01L28/00 ,  H01L29/6609 ,  H01L29/8611

Abstract: At least one method, apparatus and system disclosed involves an antenna diode design for a semiconductor device. A first common diode operatively coupled to a ground node and to a p-well layer serving as an isolated p-well that is formed over a deep n-well that is adjacent to an n-well in a semiconductor device is provided. A first antenna diode formed on the isolated p-well operatively coupled to the p-well layer and operatively coupled to a first signal line of the semiconductor device is provided for discharging accumulated charges on the first signal line. A second antenna diode formed on the isolated p-well operatively coupled to the p-well layer and operatively coupled to a second signal line of semiconductor device is provided for discharging accumulated charges on the second signal line.

公开(公告)号：US09519745B2

公开(公告)日：2016-12-13

申请号：US14523558

申请日：2014-10-24

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Lei Yuan ,  Irene Lin ,  Jongwook Kye ,  Mahbub Rashed

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G06F17/5077 ,  Y02T10/82

Abstract: A method and apparatus for an assisted metal routing is disclosed. Embodiments may include: determining an initial block mask having a first inner vertex for forming a metal routing layer of an integrated circuit (IC); adding an assistant metal portion within the metal routing layer; and determining a modified block mask based on the assistant metal portion for forming the metal routing layer.

Abstract translation: 公开了一种用于辅助金属布线的方法和装置。 实施例可以包括：确定具有用于形成集成电路（IC）的金属布线层的第一内部顶点的初始块掩码; 在所述金属布线层内添加辅助金属部分; 以及基于用于形成金属布线层的辅助金属部分确定修改的块掩模。

公开(公告)号：US09292647B2

公开(公告)日：2016-03-22

申请号：US14163511

申请日：2014-01-24

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Lei Yuan ,  Mahbub Rashed ,  Jongwook Kye

IPC: G06F17/50

CPC classification number: G06F17/5077 ,  Y02T10/82

Abstract: A methodology for a modified cell architecture and the resulting devices are disclosed. Embodiments may include determining a first vertical track spacing for a plurality of first routes for an integrated circuit (IC) design, each of the plurality of first routes having a first width, determining a second vertical track spacing for a second route for the IC design, the second route having a second width, and designating a cell vertical dimension for the IC design based on the first and second vertical track spacings.

Abstract translation: 公开了修改的小区体系结构的方法以及所得到的设备。 实施例可以包括确定用于集成电路（IC）设计的多个第一路由的第一垂直轨道间隔，所述多个第一路线中的​​每一条路径具有第一宽度，确定用于IC设计的第二路线的第二垂直轨道间距 所述第二路径具有第二宽度，并且基于所述第一和第二垂直轨道间隔指定所述IC设计的单元垂直尺寸。

公开(公告)号：US09026977B2

公开(公告)日：2015-05-05

申请号：US13968850

申请日：2013-08-16

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Marc Tarabbia ,  Norman Chen ,  Jian Liu ,  Nader Magdy Hindawy ,  Tuhin Guha Neogi ,  Mahbub Rashed ,  Anurag Mittal

IPC: G06F9/455 ,  G06F17/50

CPC classification number: G06F17/5077 ,  G06F2217/06 ,  G06F2217/78

Abstract: A method includes electrically connecting a plurality of cells of a standard cell library to a power rail. A contact area is deposited to connect a first active area and a second active area of a cell of a plurality cells. The first area and the second area are located on opposite sides of the rail and electrically connected to different drains. The contact area is electrically connected to the power rail using a via. The contact area is masked to remove a portion of the contact area to electrically separate the first active are from the second active area.

Abstract translation: 一种方法包括将标准单元库的多个单元电连接到电源轨。 沉积接触区以连接多个单元的单元的第一有源区和第二有源区。 第一区域和第二区域位于轨道的相对侧并且电连接到不同的排水沟。 接触区域使用通孔电连接到电源轨。 接触区域被屏蔽以去除接触区域的一部分以将第一活性物质与第二活性区域电分离。

公开(公告)号：US08975712B2

公开(公告)日：2015-03-10

申请号：US13893524

申请日：2013-05-14

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Mahbub Rashed ,  Juhan Kim ,  Yunfei Deng ,  Suresh Venkatesan

IPC: H01L27/092 ,  H01L21/336 ,  H01L27/088 ,  H01L21/8234 ,  H01L21/84 ,  H01L21/338 ,  H01L21/8238 ,  G06F17/50

CPC classification number: H01L29/0696 ,  G06F17/5072 ,  H01L21/823431 ,  H01L21/823821 ,  H01L21/845 ,  H01L27/0886 ,  H01L27/0924 ,  H01L27/1211 ,  H01L29/6681 ,  H01L29/785

Abstract: One method disclosed herein includes forming first and second transistor devices in and above adjacent active regions that are separated by an isolation region, wherein the transistors comprise a source/drain region and a shared gate structure, forming a continuous conductive line that spans across the isolation region and contacts the source/drain regions of the transistors and etching the continuous conductive line to form separated first and second unitary conductive source/drain contact structures that contact the source/drain regions of the first and second transistors, respectively. A device disclosed herein includes a gate structure, source/drain regions, first and second unitary conductive source/drain contact structures, each of which contacts one of the source/drain regions, and first and second conductive vias that contact the first and second unitary conductive source/drain contact structures, respectively.

Abstract translation: 本文公开的一种方法包括在由隔离区域分隔的相邻有源区域中和上方形成第一和第二晶体管器件，其中晶体管包括源极/漏极区域和共享栅极结构，形成跨越隔离的连续导电线 区域并与晶体管的源极/漏极区域接触并蚀刻连续导电线以形成分别与第一和第二晶体管的源极/漏极区域接触的分离的第一和第二整体导电源极/漏极接触结构。 本文公开的器件包括栅极结构，源极/漏极区域，第一和第二整体导电源极/漏极接触结构，其每一个接触源极/漏极区域之一，以及接触第一和第二整体的第一和第二导电通孔 导电源极/漏极接触结构。

公开(公告)号：US20140327146A1

公开(公告)日：2014-11-06

申请号：US13874803

申请日：2013-05-01

Applicant: Globalfoundries Inc

Inventor： Yunfei Deng ,  Lei Yuan ,  Hidekazu Yoshida ,  Juhan Kim ,  Mahbub Rashed ,  Jongwook Kye

IPC: G06F17/50 ,  H01L23/48

CPC classification number: G06F17/5077 ,  G06F17/5072 ,  H01L27/0207 ,  H01L27/11807 ,  H01L2027/11831 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A design methodology for routing for an integrated circuit is disclosed. The method includes placement of cells having double diffusion breaks, which create an extended intercell region. Metal layer prohibit zones are defined to prohibit any M1 structures in the prohibit zones. Metal layer allow zones are placed adjacent to outer metal lines, and jogs are formed in the metal layer allow zones. Vias and viabars may then be applied on the jogs.

Abstract translation: 公开了用于集成电路布线的设计方法。 该方法包括放置具有双扩散断裂的电池，这产生扩展的电池间​​区域。 金属层禁止区被定义为禁止禁区内的任何M1结构。 金属层允许区域邻近外部金属线放置，并且在金属层中形成点动允许区域。 然后将通风口和viabars应用于慢跑。

公开(公告)号：US20190333853A1

公开(公告)日：2019-10-31

申请号：US16411237

申请日：2019-05-14

Applicant: GLOBALFOUNDRIES INC.

Inventor： Juhan Kim ,  Mahbub Rashed ,  Navneet Jain

IPC: H01L23/528 ,  H01L23/50 ,  G06F17/50 ,  H01L23/522 ,  H01L27/02

Abstract: In an exemplary structure, a first conductor connects a power source to integrated circuit devices. The first conductor includes a first axis defining a first side and a second side. A second conductor, perpendicular to the first conductor, is connected to the first conductor by first vias. A third conductor, parallel to the first conductor, is connected to the second conductor by second vias. The third conductor includes a second axis defining a third side and a fourth side. The first side and the third side are aligned in a first plane perpendicular to the conductors and the second side and the fourth side are aligned in a second plane perpendicular to the conductors. The first vias contact the first conductor in only the first side. The second vias contact the third conductor in only the third side. And the second conductor is outside the second plane.