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公开(公告)号：US20170265283A1
公开(公告)日：2017-09-14
申请号：US15453872
申请日：2017-03-08
Applicant: Gooee Limited
Inventor： Simon Coombes , Jonathan Couch , Andrew Johnson , Shmuel Silverman
CPC classification number: H05B37/0263 , H04L12/66 , H04L67/12 , H05B33/0854 , H05B33/0866 , H05B33/0869 , H05B33/0872 , H05B33/0884 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05B37/0254 , H05B37/0272 , Y02B20/46 , Y02B20/48
Abstract: A system and method for discovering at least one dimming control protocol installed in a plurality of lighting devices and for controlling a plurality of dimming levels of the plurality of lighting devices are disclosed. The system may include at least one gateway that connects to at least one plurality of luminaires and/or LED's, at least one sensor subsystem and at least one power meter. The system and method may exchange information between a plurality of light devices and a self-organized, self-discovering gateway device. The gateway may use one or more known control protocols as an input and is able to handle multiple light devices that support different control protocols. This ability makes the gateway a universal lighting control gateway.
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公开(公告)号：US10174930B2
公开(公告)日：2019-01-08
申请号：US15900397
申请日：2018-02-20
Applicant: Gooee Limited
Inventor： Andrew Johnson
IPC: F21V29/77 , F21V3/06 , F21V5/04 , F21V23/00 , F21V29/507 , F21V29/89 , F21K9/233 , F21S8/02 , F21V21/26 , F21V25/12 , F21V19/00 , F21V29/71 , F21V29/83 , F21Y115/10 , H05B33/08 , H05B37/02
Abstract: Lighting modules and systems including a heat sink are generally disclosed. The exemplary embodiments include a lighting module having a light emitting diode (LED) board including at least one LED, a heat sink in thermal communication with the LED board for dissipating heat generated by at least the LED board, and a separate component board that is thermally insulated from the LED board and may include, for example, an LED driver, a power management component, a power conversion component, an LED control component, and a dimming component. At least one of the LED board and component board may be a printed circuit board (PCB).
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公开(公告)号：USD831237S1
公开(公告)日：2018-10-16
申请号：US29585592
申请日：2016-11-28
Applicant: Gooee Limited
Designer： Andrew Johnson
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公开(公告)号：US20180003561A1
公开(公告)日：2018-01-04
申请号：US15586745
申请日：2017-05-04
Applicant: Gooee Limited
Inventor： Simon Coombes , Jonathan Couch , Shmuel Silverman , Andrew Johnson
CPC classification number: G01J3/505 , G01J1/0271 , G01J1/0403 , G01J1/06 , G01J3/0291 , G01J3/46 , G01J3/51 , H05B33/089
Abstract: The present system provides a sensor clip system that can be clipped to luminaires of a plurality of shapes and sizes and method of using the sensor clip. Some of the sensors are upward looking (into the luminaire) while others are downward looking (away from the luminaire); and thus face in substantially opposite directions. The sensor clip is adjustable in one, two or three dimensions to be able to easily fit with different sized and shaped luminaires, such that the upward looking sensors may face the incoming light and downward looking sensors face away from the light. The sensor clip system may also provide attenuation of the luminous intensity of the emitted light coming out of the luminaires and extends the longevity and usability of the embedded sensor.
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公开(公告)号：US20170045214A1
公开(公告)日：2017-02-16
申请号：US15306733
申请日：2015-04-26
Applicant: Gooee Limited
Inventor： Andrew Johnson
CPC classification number: F21V29/77 , F21K9/233 , F21S8/026 , F21V3/061 , F21V5/04 , F21V19/003 , F21V21/26 , F21V23/005 , F21V23/006 , F21V23/009 , F21V25/12 , F21V29/507 , F21V29/713 , F21V29/773 , F21V29/83 , F21V29/89 , F21Y2115/10 , H05B33/0845 , H05B37/0272
Abstract: An LED downlight lighting module is provided including an LED module having one or more single LEDs on a first printed circuit board, a heat sink, and a second printed circuit board. In an embodiment, the first printed circuit board is in good thermal contact with the heat sink such that heat from the LEDs is dissipated through the heat sink. In an embodiment, the second printed circuit board is adapted to accommodate a power and control circuitry for the LEDs, and is thermally insulated from the heat sink and from the first printed circuit board, and thus from the LED module. According to an aspect, the LEDs serve as the principal heat generating component on the printed circuit board, thus helping to increase the light output from the LEDs and/or increase the lifespan of the LED downlight lighting module.
Abstract translation: 提供了一种LED筒灯照明模块，其包括在第一印刷电路板，散热器和第二印刷电路板上具有一个或多个单个LED的LED模块。 在一个实施例中，第一印刷电路板与散热器良好地热接触，使得来自LED的热量通过散热器消散。 在一个实施例中，第二印刷电路板适于容纳用于LED的功率和控制电路，并且与散热器和第一印刷电路板，并且因此从LED模块热绝缘。 根据一方面，LED用作印刷电路板上的主要发热部件，从而有助于增加来自LED的光输出和/或增加LED筒灯照明模块的寿命。
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Patent Agency Ranking
16.发明申请公开(公告)号：US20190191522A1
公开(公告)日：2019-06-20
申请号：US16218068
申请日：2018-12-12
Applicant: Gooee Limited
Inventor： Andrew Johnson , Simon Coombes , Shmuel Silverman
CPC classification number: H05B33/0854 , H04B10/1149 , H05B33/0842 , H05B37/0218 , H05B37/0245 , H05B37/0272
Abstract: According to some embodiments a system may control connected modules within a lighting fixture. The system may comprise a power supply that includes a first input to receive AC power, a second input to receive a control signal, and an output to transmit DC power. A light emitting diode (LED) array may receive DC power from the power supply. A master control unit may receive DC power from the power supply. The master control unit may comprise a first control line to send a control signal to the power supply to control the LED array and a second control line to control one or more modules. The system may further comprises one or more connectors mounted to a circuit board where at least one of the one or more connectors is electrically coupled to the output of the power supply and the second control line.
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公开(公告)号：USD831236S1
公开(公告)日：2018-10-16
申请号：US29585444
申请日：2016-11-23
Applicant: Gooee Limited
Designer： Andrew Johnson
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公开(公告)号：US20180242427A1
公开(公告)日：2018-08-23
申请号：US15890706
申请日：2018-02-07
Applicant: Gooee Limited
Inventor： Andrew Johnson , Jame Xie
CPC classification number: H05B37/0227 , F21V5/04 , F21V23/0442 , F21V23/0457 , F21V23/0464 , F21V23/0471 , F21V33/0052 , G02B27/0955 , H05B33/0845 , H05B33/0857 , H05B37/0218
Abstract: A luminaire component for use in a luminaire is described. The component may include a printed circuit board (PCB) having a front face, and an LED module on the front face. The component may further include a sensor arrangement comprising one or more sensors, and an optical system/lens for focusing light emitted by the LED module. The optical lens may include an outwardly extending flange. The sensor arrangement may be located between the LED module and the outwardly extending flange such that at least one of the sensors is a forward facing sensor that\views the environment through the flange. Luminaires, such as downlight luminaires, including a luminaire component is described.
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公开(公告)号：US09989239B2
公开(公告)日：2018-06-05
申请号：US15678958
申请日：2017-08-16
Applicant: Gooee Limited
Inventor： Andrew Johnson
IPC: F21V29/77 , F21V23/00 , F21V25/12 , F21S8/02 , F21V3/04 , F21V29/89 , F21V29/507 , F21V5/04 , F21K9/233 , F21V21/26 , H05B37/02 , H05B33/08 , F21V29/83 , F21V29/71 , F21V19/00 , F21Y115/10
CPC classification number: F21V29/77 , F21K9/233 , F21S8/026 , F21V3/061 , F21V5/04 , F21V19/003 , F21V21/26 , F21V23/005 , F21V23/006 , F21V23/009 , F21V25/12 , F21V29/507 , F21V29/713 , F21V29/773 , F21V29/83 , F21V29/89 , F21Y2115/10 , H05B33/0845 , H05B37/0272
Abstract: An LED downlight lighting module is provided including an LED module having one or more single LEDs on a first printed circuit board, a heat sink, and a second printed circuit board. In an embodiment, the first printed circuit board is in good thermal contact with the heat sink such that heat from the LEDs is dissipated through the heat sink. In an embodiment, the second printed circuit board is adapted to accommodate a power and control circuitry for the LEDs, and is thermally insulated from the heat sink and from the first printed circuit board, and thus from the LED module. According to an aspect, the LEDs serve as the principal heat generating component on the printed circuit board, thus helping to increase the light output from the LEDs and/or increase the lifespan of the LED downlight lighting module.
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公开(公告)号：US20180100766A1
公开(公告)日：2018-04-12
申请号：US15836046
申请日：2017-12-08
Applicant: Gooee Limited
Inventor： Simon Coombes , Jonathan Couch , Andrew Johnson , Shmuel Silverman
CPC classification number: G01J3/505 , G01J1/0271 , G01J1/0403 , G01J1/06 , G01J3/0291 , G01J3/46 , G01J3/51 , H05B33/089
Abstract: The present system provides a sensor clip system that can be clipped to luminaires of a plurality of shapes and sizes and method of using the sensor clip. Some of the sensors are upward looking (into the luminaire) while others are downward looking (away from the luminaire); and thus face in substantially opposite directions. The sensor clip is adjustable in one, two or three dimensions to be able to easily fit with different sized and shaped luminaires, such that the upward looking sensors may face the incoming light and downward looking sensors face away from the light. The sensor clip system may also provide attenuation of the luminous intensity of the emitted light coming out of the luminaires and extends the longevity and usability of the embedded sensor.
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