公开(公告)号：US08942268B2

公开(公告)日：2015-01-27

申请号：US14270255

申请日：2014-05-05

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01S3/04 ,  H01S5/024

CPC classification number: H01S5/02423 ,  H01S3/025 ,  H01S3/0407 ,  H01S3/042 ,  H01S3/0604 ,  H01S3/0606 ,  H01S5/024

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for a gain medium of a laser system are provided. In one aspect, a silicon-based thermal energy transfer apparatus includes silicon-based first and second manifolds each having internal coolant flow channels therein. When the first and second manifolds are coupled together, a first groove on the first manifold and a second groove on the second manifold form a through hole configured to receive the gain medium therein. The through hole has a polygonal cross section when viewed along a longitudinal axis of the gain medium.

Abstract translation: 提供了一种用于激光系统的增益介质的硅基热能转移装置的实施例。 一方面，硅基热能转移装置包括硅基第一和第二歧管，每个歧管在其中具有内部冷却剂流动通道。 当第一和第二歧管联接在一起时，第一歧管上的第一凹槽和第二歧管上的第二凹槽形成用于在其中接纳增益介质的通孔。 当沿着增益介质的纵向轴线观察时，通孔具有多边形横截面。

公开(公告)号：US20140321489A1

公开(公告)日：2014-10-30

申请号：US14324225

申请日：2014-07-06

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H01L33/64 ,  H01S5/024

CPC classification number: H01L33/641 ,  H01L33/483 ,  H01S5/02407 ,  H01S5/02469 ,  H01S5/02476 ,  H01S5/18388 ,  H01S5/423

Abstract: Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a non-metal base plate and a silicon-based cover element disposed on the base plate. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the one or more light-emitting devices between the base plate and the cover element with at least a portion of a light-emitting surface of each of the one or more light-emitting devices exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate.

Abstract translation: 描述了从发光装置中去除热能的热能传递装置的各种实施例。 一方面，一种装置包括非金属基板和设置在基板上的硅基覆盖元件。 基板涂覆有形成第一电极的第一导电图案。 基板进一步涂覆有与第一导电图案电隔离的第二导电图案。 覆盖元件将一个或多个发光器件保持在基板和盖元件之间，其中一个或多个发光器件中的每一个的发光表面的至少一部分被暴露。 当覆盖元件设置在基板上时，覆盖元件涂覆有与第二导电图案接触的第三导电图案，以形成第二电极。

公开(公告)号：US20130308279A1

公开(公告)日：2013-11-21

申请号：US13890202

申请日：2013-05-08

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H01L23/373 ,  H01L23/4275 ,  H01L2924/0002 ,  H05K7/2029 ,  H01L2924/00

Abstract: A thermal energy storage apparatus that absorbs thermal energy from a heat-generating device is described. In one aspect, the thermal energy storage apparatus comprises a non-metal container and a phase-change material. The non-metal container is configured to receive the heat-generating device thereon. The phase-change material is contained in the non-metal container and configured to absorb at least a portion of heat from the heat-generating device through the non-metal container.

Abstract translation: 描述了从发热装置吸收热能的热能储存装置。 一方面，热能储存装置包括非金属容器和相变材料。 非金属容器构造成在其上容纳发热装置。 相变材料容纳在非金属容器中，并且构造成通过非金属容器从发热装置吸收至少一部分热量。

公开(公告)号：US20130299135A1

公开(公告)日：2013-11-14

申请号：US13942711

申请日：2013-07-16

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: F28F1/00

CPC classification number: F28F1/00 ,  F28F1/12 ,  H01S3/0407 ,  H01S3/042 ,  H01S3/0604

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds.

公开(公告)号：US20240252704A1

公开(公告)日：2024-08-01

申请号：US18104464

申请日：2023-02-01

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: A61L2/24 ,  A61L2/10

CPC classification number: A61L2/24 ,  A61L2/10 ,  A61L2202/11 ,  A61L2202/14 ,  A61L2202/16

Abstract: A portable ultraviolet-C (UVC) disinfection device includes a printed circuit board (PCB) module, a heatsink, a fan, a switch, a control circuit, a display screen, and a battery. The PCB board module includes a housing, a UVC array module, a UVC power sensor, a distance measurement sensor, a collimating lens and a PCB that are mounted on the housing and configured to emit a UVC light on a target surface to disinfect the target surface with a disinfection UVC dosage based on a calculated exposure time.

公开(公告)号：US20220037249A1

公开(公告)日：2022-02-03

申请号：US17374185

申请日：2021-07-13

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01L23/498 ,  H01L23/367

Abstract: An interface device includes a double-trench structure configured to bond to a flip-chip device electrically and thermally. The double-trench structure is at least partially metalized and configured to allow a soldering material to flow along each of at least two trenches of the double-trench structure. The two trenches are closely located adjacent to each other to minimize an electrical separation gap between a cathode and an anode of the flip-chip device while providing electrical isolation therebetween.

公开(公告)号：US20210225726A1

公开(公告)日：2021-07-22

申请号：US17128748

申请日：2020-12-21

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01L23/367 ,  H01L23/051 ,  H01L23/043 ,  H01L31/0203 ,  H01L31/0232 ,  H01L21/48 ,  H01L23/373 ,  H01S5/024

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

公开(公告)号：US10903134B2

公开(公告)日：2021-01-26

申请号：US16226268

申请日：2018-12-19

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01L23/367 ,  H01L23/051 ,  H01L31/0203 ,  H01L21/48 ,  H01L23/043 ,  H01L31/0232 ,  H01L23/373 ,  H01S5/024 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H01L31/024 ,  H01L33/48 ,  H01L33/58 ,  H01L33/64

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

公开(公告)号：US20200338220A1

公开(公告)日：2020-10-29

申请号：US16859814

申请日：2020-04-27

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: A61L2/10 ,  B60S1/64 ,  B60H1/00 ,  A61L2/24

Abstract: An ultraviolet C (UV-C) illumination system includes a central disinfection unit (CDU), a heating, ventilation and air conditioning (HVAC) illuminator unit (HIU), and a beam scanning device. The CDU includes a fiber-coupled UV-C unit (FCU) configured to provide a UV-C light, a microcontroller, and a smart control unit (SCU) that controls each of the one or more FCUs by adjusting UV-C illumination by each of the one or more FCUs. The SMU communicates to the microcontroller to adjust energy consumption based on environmental data. The HIU includes fused silica rod to uniformly scatter the UV-C light to disinfect a surrounding area, with a light intensity controlled by the SCU of the CDU. The beam scanning device is coupled to the one or more FCUs. The beam scanning device includes a fiber and a lens disposed at a fiber tip of the fiber and configured to collimate the UV-C light.

公开(公告)号：US20200093028A1

公开(公告)日：2020-03-19

申请号：US16691394

申请日：2019-11-21

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H05K7/20 ,  H05K5/04 ,  H05K5/03 ,  F28F3/04 ,  H05K1/02 ,  H01L29/06 ,  H01L23/467 ,  H01L23/427 ,  H01L23/367

Abstract: Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.