公开(公告)号：US20170263593A1

公开(公告)日：2017-09-14

申请号：US15529612

申请日：2015-04-01

Applicant: Goertek.Inc

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0066

Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming a micro-LED on a laser-transparent original substrate; bringing the micro-LED into contact with a pad preset on a receiving substrate; and irradiating the original substrate with laser from the original substrate side to lift-off the micro-LED from the original substrate.