中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

11 records (took 0.019 seconds)

    MEMS DEVICE WITH A VALVE MECHANISM
    1.
    发明申请
    MEMS DEVICE WITH A VALVE MECHANISM 审中-公开

    公开(公告)号：US20170280218A1

    公开(公告)日：2017-09-28

    申请号：US15505001

    申请日：2014-08-27

    Applicant: Goertek.Inc

    Inventor： Zhe Wang ,  Quanbo Zou ,  Jifang Tao

    IPC: H04R1/08 ,  H04R19/04 ,  H04R19/01

    CPC classification number: H04R1/083 ,  H04R1/023 ,  H04R3/007 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R2201/003

    Abstract: The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.

    Repairing method, manufacturing method, device and electronics apparatus of micro-LED
    4.
    发明授权
    Repairing method, manufacturing method, device and electronics apparatus of micro-LED 有权

    公开(公告)号：US10170665B2

    公开(公告)日：2019-01-01

    申请号：US15559778

    申请日：2015-09-09

    Applicant: Goertek.Inc

    Inventor： Quanbo Zou ,  Zhe Wang

    IPC: H01L21/00 ,  H01L33/00 ,  H01L33/62 ,  H01L23/00 ,  H01L25/13 ,  H01L33/48 ,  H01L25/075

    Abstract: The present invention discloses a repairing method, manufacturing method, device and electronics apparatus of micro-LED. The method for repairing a micro-LED comprises: bringing a known-good micro-LED on a conductive pick-up head into contact with a first pad on an defective position of a receiving substrate, wherein the conductive pick-up head and the known-good micro-LED are bonded via a conductive adhesive; locally joule heating a first bonding layer through the conductive pick-up head, to melt the first bonding layer, wherein the first bonding layer is provided between the known-good micro-LED and the first pad; and lifting up the conductive pick-up head after the first bonding layer is cooled, leaving the known-good micro-LED on the receiving substrate.

    REPAIRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED
    6.
    发明申请
    REPAIRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED 有权

    公开(公告)号：US20170263811A1

    公开(公告)日：2017-09-14

    申请号：US15529602

    申请日：2015-08-18

    Applicant: Goertek.Inc

    Inventor： Quanbo Zou ,  Zhe Wang

    IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

    CPC classification number: H01L33/0095 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/62 ,  H01L2933/0066

    Abstract: A repairing method, manufacturing method, device and electronic apparatus of micro-LED are disclosed. The method for repairing micro-LED defects comprises: obtaining a micro-LED defect pattern on a receiving substrate; forming micro-LEDs (703b) corresponding to the defect pattern on a laser-transparent repair carrier substrate (707); aligning the micro-LEDs (703b) on the repair carrier substrate (707) with defect positions on the receiving substrate, and bringing the micro-LEDs (703b) into contact with pads at the defect positions; and irradiating the repair carrier substrate with a laser from the repair carrier substrate side, to lift-off the micro-LEDs from the repair carrier substrate (707).

    MEMS device with a valve mechanism
    9.
    发明授权
    MEMS device with a valve mechanism 有权

    公开(公告)号：US10212501B2

    公开(公告)日：2019-02-19

    申请号：US15505001

    申请日：2014-08-27

    Applicant: Goertek.Inc

    Inventor： Zhe Wang ,  Quanbo Zou ,  Jifang Tao

    IPC: H04R25/00 ,  H04R1/08 ,  H04R19/01 ,  H04R19/00 ,  H04R1/02 ,  H04R19/04 ,  H04R3/00

    Abstract: The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.

Patent Agency Ranking