公开(公告)号：US11612932B2

公开(公告)日：2023-03-28

申请号：US17058585

申请日：2018-11-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： David Champion ,  Richard Seaver ,  Pavan Suri

IPC: B22F3/10 ,  B33Y40/20 ,  B22F10/64 ,  B22F3/00 ,  F27D19/00 ,  B33Y10/00 ,  B33Y50/02 ,  B22F10/85 ,  G01N9/00 ,  B22F10/14 ,  B22F3/22

Abstract: In an example implementation, a method of operating a sintering furnace includes receiving information about a green object load to be sintered in a sintering furnace, determining a sintering profile based on the information, and performing a sintering process according to the sintering profile. During the sintering process, a sensor reading that indicates a degree of densification of a green object in the load is accessed from a densification sensor. The method includes initiating a cool down phase of the sintering process if the sensor reading has reached a target sensor reading.

公开(公告)号：US20220227131A1

公开(公告)日：2022-07-21

申请号：US17713200

申请日：2022-04-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Galen Cook ,  Garrett E. Clark ,  Michael W. Cumbie ,  James R. Przybyla ,  Richard Seaver ,  Frank D. Derryberry ,  Si-Iam J. Choy

IPC: B41J2/145 ,  B41J2/14

Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.

公开(公告)号：US11305537B2

公开(公告)日：2022-04-19

申请号：US16607204

申请日：2018-03-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Galen Cook ,  Garrett E Clark ,  Michael W Cumbie ,  James R Przybyla ,  Richard Seaver ,  Frank D Derryberry ,  Si-Iam J Choy

IPC: B41J2/145 ,  B41J2/14

Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.