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公开(公告)号：US11807005B2
公开(公告)日：2023-11-07
申请号：US18127619
申请日：2023-03-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Galen Cook , Garrett E. Clark , Michael W. Cumbie , James R. Przybyla , Richard Seaver , Frank D. Derryberry , Si-Lam J. Choy
CPC classification number: B41J2/145 , B41J2/14 , B41J2002/14459 , B41J2202/12 , B41J2202/20
Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
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公开(公告)号：US11034151B2
公开(公告)日：2021-06-15
申请号：US16605961
申请日：2018-03-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Galen Cook , Garrett E Clark , Michael W Cumbie , James R Przybyla , Richard Seaver , Frank D Derryberry , Si-lam J Choy
Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.
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公开(公告)号：US11958293B2
公开(公告)日：2024-04-16
申请号：US17303656
申请日：2021-06-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Galen Cook , Garrett E Clark , Michael W Cumbie , James R Przybyla , Richard Seaver , Frank D Derryberry , Si-lam J Choy
CPC classification number: B41J2/145 , B41J2/14 , B41J2002/14459 , B41J2202/12 , B41J2202/20
Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
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公开(公告)号：US11806788B2
公开(公告)日：2023-11-07
申请号：US17059072
申请日：2018-11-26
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： David Champion , Pavan Suri , John Liebeskind , Richard Seaver
CPC classification number: B22F3/1007 , F27D7/02 , B22F2998/10 , F27D2019/0006 , F27D2019/0028
Abstract: In an example implementation, a sintering system includes a detection gas line to enable gas to flow into a sintering furnace from an external gas supply. The system includes a detection gas port inside the furnace through which gas from the detection gas line is to flow into the furnace, and a registration feature inside the furnace to enable positioning of a token green object proximate the gas detection port. The system includes a gas flow monitor to detect changes in gas flow through the detection gas line when the token green object shrinks during a sintering process in the furnace.
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公开(公告)号：US20210291520A1
公开(公告)日：2021-09-23
申请号：US17303656
申请日：2021-06-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Galen Cook , Garrett E Clark , Michael W Cumbie , James R Przybyla , Richard Seaver , Frank D Derryberry , Si-lam J Choy
Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
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Patent Agency Ranking
公开(公告)号：US20210213525A1
公开(公告)日：2021-07-15
申请号：US17059072
申请日：2018-11-26
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： David Champion , Pavan Suri , John Liebeskind , Richard Seaver
Abstract: In an example implementation, a sintering system includes a detection gas line to enable gas to flow into a sintering furnace from an external gas supply. The system includes a detection gas port inside the furnace through which gas from the detection gas line is to flow into the furnace, and a registration feature inside the furnace to enable positioning of a token green object proximate the gas detection port. The system includes a gas flow monitor to detect changes in gas flow through the detection gas line when the token green object shrinks during a sintering process in the furnace.
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公开(公告)号：US11247470B2
公开(公告)日：2022-02-15
申请号：US16608271
申请日：2018-03-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Galen Cook , Garrett E Clark , Michael W Cumbie , James R Przybyla , Richard Seaver , Frank D Derryberry , Si-lam J Choy
Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.
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公开(公告)号：US20210121954A1
公开(公告)日：2021-04-29
申请号：US17058585
申请日：2018-11-26
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： David Champion , Richard Seaver , Pavan Suri
Abstract: In an example implementation, a method of operating a sintering furnace includes receiving information about a green object load to be sintered in a sintering furnace, determining a sintering profile based on the information, and performing a sintering process according to the sintering profile. During the sintering process, a sensor reading that indicates a degree of densification of a green object in the load is accessed from a densification sensor. The method includes initiating a cool down phase of the sintering process if the sensor reading has reached a target sensor reading.
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公开(公告)号：US11712896B2
公开(公告)日：2023-08-01
申请号：US17713200
申请日：2022-04-04
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Galen Cook , Garrett E. Clark , Michael W. Cumbie , James R. Przybyla , Richard Seaver , Frank D. Derryberry , Si-Iam J. Choy
CPC classification number: B41J2/145 , B41J2/14427 , B41J2/14145 , B41J2002/14459 , B41J2202/12 , B41J2202/20
Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.
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公开(公告)号：US20230234355A1
公开(公告)日：2023-07-27
申请号：US18127619
申请日：2023-03-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Galen Cook , Garrett E. Clark , Michael W. Cumbie , James R. Przybyla , Richard Seaver , Frank D. Derryberry , Si-lam J. Choy
CPC classification number: B41J2/145 , B41J2/14 , B41J2002/14459 , B41J2202/12 , B41J2202/20
Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
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