公开(公告)号：US20100090324A1

公开(公告)日：2010-04-15

申请号：US12474429

申请日：2009-05-29

Applicant: Hye-Jin KIM

Inventor： Hye-Jin KIM

IPC: H01L23/52 ,  H01L23/48 ,  H01L23/488

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package having a solder ball having a double connection structure which reduces a total height of a package on package (POP). The semiconductor package includes a first semiconductor package in which a semiconductor device is mounted on a lower surface of a first substrate, and a through hole is formed in a solder ball pad region of the first substrate, a second semiconductor package in which a semiconductor device is mounted on an upper surface of a second substrate, and a solder ball pad of the second substrate is formed to correspond to the through hole of the first substrate and is mounted on the first substrate, and a common solder ball that is disposed below the first substrate and is connected to the solder ball pad of the second substrate through the through hole.

Abstract translation: 一种具有双重连接结构的焊球的半导体封装，其减少了封装（POP）上的封装的总高度。 半导体封装包括第一半导体封装，其中半导体器件安装在第一衬底的下表面上，并且通孔形成在第一衬底的焊球焊盘区域中;第二半导体封装，其中半导体器件 安装在第二基板的上表面上，并且形成第二基板的焊球垫，以对应于第一基板的通孔，并且安装在第一基板上，并且配置公共焊球， 并且通过通孔与第二基板的焊球焊盘连接。