公开(公告)号：US09433097B2

公开(公告)日：2016-08-30

申请号：US14791735

申请日：2015-07-06

Applicant: IBIDEN CO., LTD.

Inventor： Mitsuhiro Tomikawa ,  Koji Asano

IPC: H05K1/18 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/183 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/4046 ,  H05K3/4084 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/10416 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers and laminated on first and second sides of the core substrate such that the insulating layers are covering the cavity, and a filling resin filling gap formed between the cavity and metal blocks in the cavity. The cavity is penetrating through the core substrate, the core substrate has an intracavity projection structure projecting from one or more side surfaces of the cavity such that the projection structure is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity, the first build-up layer has first conductors connected to the metal blocks such that each first conductor conducts electricity or heat, and the second build-up layer has second conductors connected to the metal blocks such that each second conductor conducts electricity or heat.

Abstract translation: 电路基板包括具有空腔的芯基板，空腔中的金属块，第一和第二堆积层包括绝缘层，并且层叠在芯基板的第一和第二侧上，使得绝缘层覆盖空腔，并且填充 空腔中的空腔和金属块之间形成树脂填充间隙。 空腔穿透芯基板，芯基板具有从空腔的一个或多个侧表面突出的腔内投影结构，使得突出结构位于金属块之间并且分离金属块以在空腔中彼此接触 第一累积层具有连接到金属块的第一导体，使得每个第一导体传导电或热，并且第二堆积层具有连接到金属块的第二导体，使得每个第二导体导电或加热。

公开(公告)号：US09204552B2

公开(公告)日：2015-12-01

申请号：US13685777

申请日：2012-11-27

Applicant: IBIDEN Co., Ltd.

Inventor： Toshiki Furutani ,  Yukinobu Mikado ,  Mitsuhiro Tomikawa

IPC: H05K1/16 ,  H05K1/18 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/181 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/09527 ,  H05K2201/096

Abstract: A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup structure formed on surface of the substrate and including an interlayer insulation layer, and a second buildup structure formed on the opposing surface of the substrate and including an interlayer insulation layer. The substrate includes a core material portion including multiple resin layers, a first conductive layer formed on first surface of the core portion and a second conductive layer formed on second surface of the core portion, the core portion has opening through the resin layers and accommodating the component, the insulation layer of the first structure is positioned such that the opening of the core portion is covered on the first surface, and the insulation layer of the second structure is positioned such that the opening of the core portion is covered on the second surface.

Abstract translation: 印刷电路板包括芯基板，容纳在基板中的电子部件，形成在基板的表面上并且包括层间绝缘层的第一累积结构和形成在基板的相对表面上的第二累积结构， 层间绝缘层。 基板包括具有多个树脂层的芯材部分，形成在芯部的第一表面上的第一导电层和形成在芯部的第二表面上的第二导电层，芯部具有通过树脂层的开口并容纳 第一结构的绝缘层被定位成使得芯部的开口被覆盖在第一表面上，并且第二结构的绝缘层被定位成使得芯部的开口被覆盖在第二表面上 。

公开(公告)号：US20130256007A1

公开(公告)日：2013-10-03

申请号：US13729998

申请日：2012-12-28

Applicant: IBIDEN CO., LTD.

Inventor： Toshiki Furutani ,  Yukinobu Mikado ,  Mitsuhiro Tomikawa ,  Yuki Tanaka

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/15153 ,  H01L2924/3511 ,  H05K3/306 ,  H05K3/4652 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A wiring board includes a substrate having a cavity, an electronic component positioned in the cavity and having a first-side electrode on one side of the electronic component and a second-side electrode on the opposite side of the electronic component, an insulation layer formed on a surface of the substrate and the electronic component such that the insulation layer covers the electronic component positioned in the substrate, and a conductive layer formed on the surface of the substrate and including linear conductive patterns surrounding an opening of the cavity on the surface of the substrate. The linear conductive patterns include a first linear conductive pattern positioned adjacent to the first-side electrode and a second linear conductive pattern positioned adjacent to the second-side electrode such that the first linear conductive pattern and the second linear conductive pattern are insulated from each other.

Abstract translation: 布线板包括具有空腔的基板，位于空腔中的电子部件，并且在电子部件的一侧具有第一侧电极，在电子部件的相对侧具有第二侧电极，形成绝缘层 在基板和电子部件的表面上，使得绝缘层覆盖位于基板中的电子部件，以及形成在基板的表面上的导电层，并且包括在该表面上的空腔的开口周围的线性导电图案 底物。 线性导电图案包括与第一侧电极相邻定位的第一线性导电图案和邻近第二侧电极定位的第二线性导电图案，使得第一线性导电图案和第二线性导电图案彼此绝缘 。