公开(公告)号：US20130256007A1

公开(公告)日：2013-10-03

申请号：US13729998

申请日：2012-12-28

Applicant: IBIDEN CO., LTD.

Inventor： Toshiki Furutani ,  Yukinobu Mikado ,  Mitsuhiro Tomikawa ,  Yuki Tanaka

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/15153 ,  H01L2924/3511 ,  H05K3/306 ,  H05K3/4652 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A wiring board includes a substrate having a cavity, an electronic component positioned in the cavity and having a first-side electrode on one side of the electronic component and a second-side electrode on the opposite side of the electronic component, an insulation layer formed on a surface of the substrate and the electronic component such that the insulation layer covers the electronic component positioned in the substrate, and a conductive layer formed on the surface of the substrate and including linear conductive patterns surrounding an opening of the cavity on the surface of the substrate. The linear conductive patterns include a first linear conductive pattern positioned adjacent to the first-side electrode and a second linear conductive pattern positioned adjacent to the second-side electrode such that the first linear conductive pattern and the second linear conductive pattern are insulated from each other.

Abstract translation: 布线板包括具有空腔的基板，位于空腔中的电子部件，并且在电子部件的一侧具有第一侧电极，在电子部件的相对侧具有第二侧电极，形成绝缘层 在基板和电子部件的表面上，使得绝缘层覆盖位于基板中的电子部件，以及形成在基板的表面上的导电层，并且包括在该表面上的空腔的开口周围的线性导电图案 底物。 线性导电图案包括与第一侧电极相邻定位的第一线性导电图案和邻近第二侧电极定位的第二线性导电图案，使得第一线性导电图案和第二线性导电图案彼此绝缘 。

公开(公告)号：US09044830B2

公开(公告)日：2015-06-02

申请号：US14141800

申请日：2013-12-27

Applicant: IBIDEN CO., LTD.

Inventor： Yukinobu Mikado ,  Yuki Tanaka

IPC: H05K1/11 ,  B23K26/00 ,  B23K26/38 ,  H05K3/46 ,  B23K26/08 ,  H05K3/00 ,  H05K1/18

CPC classification number: B23K26/383 ,  B23K26/08 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/10636 ,  H05K2203/107 ,  Y02P70/611 ,  Y10T29/49135

Abstract: A method for forming cavity in substrate includes setting start position on closed loop line having circumference L for substrate, consecutively irradiating laser from laser device upon board for the substrate such that holes are formed, and moving the device in loop from the start position along the line such that penetrating hole is formed through the board. The start position of first loop is set as base position, the moving includes shifting the start position by distance d after each loop and controlling such that the moving satisfies p=Σdi, m≅L/p and M=m×n, where i=1 to n, n represents number of loops, p represents pitch of the holes, m represents number of the holes in loop, Σdi is distance from the base position for the start position after i-th loop, and M is number of the holes by the loops.

Abstract translation: 在衬底中形成空腔的方法包括：在具有用于衬底的圆周L的闭环线上设置开始位置，从基板上的激光装置连续照射激光，使得形成孔，并且沿着沿着衬底的起始位置循环移动装置 使得穿过该板形成穿透孔。 将第一循环的起始位置设定为基准位置，移动包括在每个回路之后移动开始位置距离d，并且控制使移动满足p =＆Sgr; di，m≅L/ p和M = m×n， 其中i = 1至n，n表示环数，p表示孔的间距，m表示环中的孔数，＆lt; di是与第i个回路之后的起始位置的基准位置的距离，M 是环的数目。

公开(公告)号：US20140182917A1

公开(公告)日：2014-07-03

申请号：US14141800

申请日：2013-12-27

Applicant: IBIDEN CO., LTD.

Inventor： Yukinobu MIKADO ,  Yuki Tanaka

IPC: B23K26/38 ,  H05K1/11 ,  H05K3/00

CPC classification number: B23K26/383 ,  B23K26/08 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/10636 ,  H05K2203/107 ,  Y02P70/611 ,  Y10T29/49135

Abstract: A method for forming cavity in substrate includes setting start position on closed loop line having circumference L for substrate, consecutively irradiating laser from laser device upon board for the substrate such that holes are formed, and moving the device in loop from the start position along the line such that penetrating hole is formed through the board. The start position of first loop is set as base position, the moving includes shifting the start position by distance d after each loop and controlling such that the moving satisfies p=Σdi, m≅L/p and M=m×n, where i=1 to n, n represents number of loops, p represents pitch of the holes, m represents number of the holes in loop, Σdi is distance from the base position for the start position after i-th loop, and M is number of the holes by the loops.

Abstract translation: 在衬底中形成空腔的方法包括：在具有用于衬底的圆周L的闭环线上设置开始位置，从基板上的激光装置连续照射激光，使得形成孔，并且沿着沿着衬底的起始位置循环移动装置 使得穿过该板形成穿透孔。 将第一循环的起始位置设定为基准位置，移动包括在每个回路之后移动开始位置距离d，并且控制使移动满足p =＆Sgr; di，m≅L/ p和M = m×n， 其中i = 1至n，n表示环数，p表示孔的间距，m表示环中的孔数，＆lt; di是与第i个回路之后的起始位置的基准位置的距离，M 是环的数目。