公开(公告)号：US08969731B2

公开(公告)日：2015-03-03

申请号：US14299924

申请日：2014-06-09

Applicant: Innova Dynamics, Inc.

Inventor： Arjun Srinivas ,  Matthew R. Robinson ,  Alexander Chow Mittal ,  Michael Eugene Young ,  David Buchanan ,  Joseph George ,  Yuka Yoshioka

IPC: H05K1/00 ,  B32B5/16 ,  H05K1/03 ,  H05K1/02 ,  G06F3/041 ,  H05K1/09 ,  B82Y30/00

CPC classification number: H05K1/0274 ,  B82Y30/00 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/0091 ,  H05K3/027 ,  Y10S977/932 ,  Y10T428/25 ,  Y10T428/254

Abstract: A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.

Abstract translation: 图案化的透明导体包括基材和至少部分地嵌入基材的至少一个表面中并且根据图案邻近表面定位的添加剂，以形成更高的片状导电部分。 较高的片材导电部分与下片材导电部分横向相邻。

公开(公告)号：US20140299359A1

公开(公告)日：2014-10-09

申请号：US14247033

申请日：2014-04-07

Applicant: Innova Dynamics, Inc.

Inventor： Alexander Chow Mittal ,  Arjun Daniel Srinivas ,  Matthew R. Robinson ,  Michael Eugene Young

IPC: H05K1/09 ,  B05D3/00 ,  H05K1/02 ,  B05D1/00

CPC classification number: H01B1/22 ,  B05D1/005 ,  B05D3/007 ,  H01L23/373 ,  H01L31/022466 ,  H01L31/035209 ,  H01L31/1884 ,  H01L51/442 ,  H01L51/5206 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/097 ,  Y02E10/50 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/249921 ,  Y10T428/25 ,  H01L2924/00

Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract translation: 导电或半导体添加剂被嵌入主体材料的表面以用于各种应用和装置中。 所得的表面嵌入结构表现出改善的性能，以及由其组成和制造工艺产生的成本优势。