公开(公告)号：US20220416428A1

公开(公告)日：2022-12-29

申请号：US17357658

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Tae Young Yang ,  Shuhei Yamada ,  Tolga Acikalin ,  Johanny Escobar Pelaez ,  Kenneth Foust ,  Jason Mix ,  Renzhi Liu

IPC: H01Q9/04 ,  H01Q1/22

Abstract: Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.

公开(公告)号：US11043743B2

公开(公告)日：2021-06-22

申请号：US16399451

申请日：2019-04-30

Applicant: Intel Corporation

Inventor： Tae Young Yang ,  Zhen Zhou ,  Bradley Jackson ,  Shengbo Xu ,  Cheng-Yuan Chin ,  Debabani Choudhury ,  Ali Sadri

IPC: H01Q3/44 ,  H01Q19/06 ,  H01Q21/06

Abstract: A lens antenna system is disclosed. The lens antenna system comprises a hybrid focal source antenna circuit configured to generate a source antenna beam for integration with different lens structures. In some embodiments, the hybrid focal source antenna circuit comprises a set of antenna elements coupled to one another. In some embodiments, the set of antenna elements comprises a first antenna element configured to be excited in a first spherical mode; and a second antenna element configured to be excited in a second, different, spherical mode. In some embodiments, the first spherical mode and the second spherical mode are co-polarized. In some embodiments, the lens antenna system further comprises a lens configured to shape the source antenna beam associated with the hybrid focal source antenna circuit, in order to provide an output antenna beam.

公开(公告)号：US20200313725A1

公开(公告)日：2020-10-01

申请号：US16367743

申请日：2019-03-28

Applicant: Intel Corporation

Inventor： Mustapha Amadu Abdulai ,  Kevin B. Redmond ,  Ronald M. Kirby ,  Tae Young Yang ,  Arnaud Amadjikpe

IPC: H04B5/00 ,  H04B17/10 ,  G01R29/10 ,  G01R29/08

Abstract: Devices and methods for testing microelectronic assemblies including wireless communications are disclosed herein. For example, in some embodiments, a wireless testing system may include a radio frequency (RF) shielded chamber; a device under test (DUT) in the RF shielded chamber, wherein the DUT includes an array of first antenna elements; a testing apparatus in the RF shielded chamber including an array of second antenna elements at a first surface of a substrate to receive a test signal from the DUT, wherein a distance between individual second antenna elements and an adjacent second antenna element is at least half of a wavelength of the test signal, and wherein a distance between the first antenna elements and the second antenna elements is within a near-field region; and an array of electrical switches, wherein an individual electrical switch is coupled to a respective individual second antenna element.

公开(公告)号：US10148014B2

公开(公告)日：2018-12-04

申请号：US15275290

申请日：2016-09-23

Applicant: Intel Corporation

Inventor： Seong-Youp John Suh ,  Tae Young Yang ,  Jose R. Camacho Perez

IPC: H01Q1/24 ,  H01Q9/26 ,  H01Q1/36 ,  H01Q1/48 ,  H01Q13/10 ,  H01Q1/52 ,  H01Q9/42

Abstract: Described herein are technologies that facilitate wireless communication with highly-isolated, dual-port antenna system. More particularly, an example antenna system that implements the technology includes a complementary pair of physically co-located antennas for signal transmission and/or reception. More particularly still, an example implementation of the disclosed technology is an antenna system that utilizes a monopole antenna symmetrically and physically co-located with a slot antenna in a shared antenna plane with a simple feed structure.

公开(公告)号：US20170090098A1

公开(公告)日：2017-03-30

申请号：US14863742

申请日：2015-09-24

Applicant: INTEL CORPORATION

Inventor： Mei Chai ,  Soji Sajuyigbe ,  Bryce D. Horine ,  Tae Young Yang ,  Kwan Ho Lee ,  Harry G. Skinner ,  Anand S. Konanur

IPC: F21V8/00

CPC classification number: G02B6/0041 ,  G02B6/0055 ,  G02B6/0073 ,  H01Q1/44

Abstract: A display having an integrated antenna with a substantially uniform transparency and/or light across the display. The display may have a uniformity layer that is an optical balance of the antenna, wherein the uniformity layer and the antenna have respective optical transparencies that provide a substantially uniform transparency across the display. The display may also have a backlight that has a surface brightness intensity corresponding to an optical inverse of the antenna, and is configured to provide a substantially uniform light across the display.

公开(公告)号：US20240421062A1

公开(公告)日：2024-12-19

申请号：US18334188

申请日：2023-06-13

Applicant: Intel Corporation

Inventor： Tolga Acikalin ,  Shuhei Yamada ,  Telesphor Kamgaing ,  Tae Young Yang

IPC: H01L23/498 ,  H01L21/3205 ,  H01L23/00 ,  H01L23/15 ,  H01L23/49 ,  H01L23/538 ,  H01L23/544 ,  H01L25/065

Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die and a substrate including a glass core. The apparatus also includes a pluggable interconnect including a portion of the glass core. The pluggable interconnect includes a transmission line extending along the portion of the glass core.

公开(公告)号：US20240405433A1

公开(公告)日：2024-12-05

申请号：US18328107

申请日：2023-06-02

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georg Seidemann ,  Harald Gossner ,  Thomas Wagner ,  Bernd Waidhas ,  Tae Young Yang

IPC: H01Q9/04 ,  H01Q1/22

Abstract: Disclosed herein are antenna modules, electronic assemblies, and communication devices. An example antenna module includes an IC component, an antenna patch support over a face of the IC component, and a stack of antenna patches vertically arranged at least partially above one another, where a first antenna patch of the stack is an antenna patch closest to the IC component, and a second antenna patch of the stack is an antenna patch closest to the first antenna patch. The first antenna patch is on the face of the IC component while the second and further antenna patches of the stack are on or in the antenna patch support and are electrically isolated from all electrically conductive material pathways in the antenna patch support and in the IC component.

公开(公告)号：US12123937B2

公开(公告)日：2024-10-22

申请号：US17369994

申请日：2021-07-08

Applicant: Intel Corporation

Inventor： Arnaud Amadjikpe ,  Timo Sakari Huusari ,  Tae Young Yang ,  Hossein Alavi

IPC: G01S13/42 ,  G01S7/35 ,  G01S13/89

CPC classification number: G01S13/426 ,  G01S13/89 ,  G01S7/35

Abstract: A radar device may include a digital to analog converter (DAC) stage. The DAC stage may generate a plurality of analog signals. The DAC stage may generate a different analog signal for each transmitter chain of a plurality of transmitter chains. Each analog signal of the plurality of analog signals may represent a single digital signal. Each transmitter chain of the plurality of transmitter chains may include a transmit chain portion and switched analog beamforming network (BFN). The transmit chain portion may generate a plurality of intermediate analog signals representative of the corresponding analog signal. The switched analog BFN may generate a plurality of analog transmit signals for an intermediate analog signal of the plurality of intermediate analog signals. The plurality of analog transmit signals may include a beam formed in accordance with a state of the switched analog BFN.

公开(公告)号：US20230187839A1

公开(公告)日：2023-06-15

申请号：US17547858

申请日：2021-12-10

Applicant: Intel Corporation

Inventor： Seong-Youp John Suh ,  Tae Young Yang ,  Kwan Ho Lee ,  Dong-Ho Han

IPC: H01Q13/18 ,  H01Q9/04 ,  H01P3/12

CPC classification number: H01Q13/18 ,  H01Q9/0407 ,  H01P3/121

Abstract: A substrate integrated waveguide (SIW) cavity antenna is described that enables dual frequency and broadband operation, as well as enhanced protection from radio frequency interference (RFI) that may be present within an electronic device environment. The SIW cavity antenna includes a capacitively-coupled feed that is disposed within the volume of the SIW cavity antenna, which is enclosed on four sides via a set of electrically-conductive plates. The SIW cavity antenna radiates using the remaining two open sides as apertures. The SIW cavity antenna may include a meander line radiator to facilitate the operation of a second frequency band, as well as the use of a tuning stub to further enhance the impedance bandwidth.

公开(公告)号：US11598842B2

公开(公告)日：2023-03-07

申请号：US16831924

申请日：2020-03-27

Applicant: INTEL CORPORATION

Inventor： Arnaud Lucres Amadjikpe ,  Tae Young Yang ,  Ofer Markish

IPC: H01Q1/32 ,  H01Q15/00 ,  H04B7/02 ,  G01S7/02 ,  G01S7/03 ,  H04B7/0456 ,  H05K1/02 ,  H01Q1/42

Abstract: For example, an apparatus may include a Printed Circuit Board (PCB); a Multiple-Input-Multiple-Output (MIMO) radar antenna on the PCB, the MIMO radar antenna comprising a plurality of Transmit (Tx) antenna elements configured to transmit Tx radar signals, and a plurality of receive (Rx) antenna elements configured to receive Rx radar signals based on the Tx radar signals; and a surface wave mitigator connected to the PCB, the surface wave mitigator configured to mitigate an impact of surface waves via the PCB on a radiation pattern of the MIMO radar antenna.