公开(公告)号：US10060819B2

公开(公告)日：2018-08-28

申请号：US14945661

申请日：2015-11-19

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Matthias Boehm ,  Steven Gross ,  Markus Loehndorf ,  Stephan Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L7/00 ,  G01L9/12 ,  G01L19/00 ,  G01L19/14

CPC classification number: G01L19/0084 ,  G01L19/147 ,  G01L19/148

Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.