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11.发明申请公开(公告)号：US20150249078A1
公开(公告)日：2015-09-03
申请号：US14628823
申请日：2015-02-23
Applicant: Infineon Technologies AG
Inventor： Yiqun Cao , Ulrich Glaser , Magnus-Maria Hell , Julien Lebon , Michael Mayerhofer , Andreas Meiser , Matthias Stecher , Joost Willemen
IPC: H01L27/02
CPC classification number: H01L27/0255 , H01L27/0292 , H02H9/046
Abstract: An integrated circuit having an ESD protection structure is described. One embodiment includes a circuit section interconnected with a first terminal and with a second terminal and being operable at voltage differences between the first terminal and second terminal of greater than +10 V and less than −10 V. The integrated circuit additionally includes an ESD protection structure operable to protect the circuit section against electrostatic discharge between the first terminal and the second terminal. The ESD protection structure is operable with voltage differences between the first and second terminals of greater than +10 V and less than −10 V without triggering. The ESD protection structure is electrically and optically coupled to a photon source such that photons emitted by the photon source upon ESD pulse loading are absorbable in the ESD protection structure and an avalanche breakdown is initiatable by electron-hole pairs generated by the absorbed photons.
Abstract translation: 描述具有ESD保护结构的集成电路。 一个实施例包括与第一端子和第二端子互连的电路部分，并且可在第一端子和第二端子之间的电压差大于+ 10V且小于-10V的情况下工作。集成电路还包括ESD保护 结构可操作以保护电路部分免受第一端子和第二端子之间的静电放电。 ESD保护结构可以在第一和第二端子之间的电压差大于+10V且小于-10V而不触发。 ESD保护结构电光学耦合到光子源，使得在ESD脉冲负载时由光子源发射的光子在ESD保护结构中是可吸收的，并且雪崩击穿可由吸收的光子产生的电子 - 空穴对引发。
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公开(公告)号：US11754640B2
公开(公告)日：2023-09-12
申请号：US17219059
申请日：2021-03-31
Applicant: Infineon Technologies AG
Inventor： Matthias Stecher , Hermann Gruber , Thorsten Hinderer
Abstract: A device including a first voltage domain and a second voltage domain is provided, the voltage domains being separated by an isolation barrier. In addition, the device includes a scratch detection circuit including a first and a second electrode at a distance of less than 2 μm.
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公开(公告)号：US20210318392A1
公开(公告)日：2021-10-14
申请号：US17219059
申请日：2021-03-31
Applicant: Infineon Technologies AG
Inventor： Matthias Stecher , Hermann Gruber , Thorsten Hinderer
Abstract: A device including a first voltage domain and a second voltage domain is provided, the voltage domains being separated by an isolation barrier. In addition, the device includes a scratch detection circuit including a first and a second electrode at a distance of less than 2 μm.
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公开(公告)号：US09466677B2
公开(公告)日：2016-10-11
申请号：US14700203
申请日：2015-04-30
Applicant: Infineon Technologies AG
Inventor： Martin Kerber , Matthias Stecher
IPC: H01L29/40 , H01L23/58 , H01L23/522 , H01F27/28 , H01L23/00
CPC classification number: H01L29/402 , H01F27/2804 , H01L23/5227 , H01L23/585 , H01L24/05 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/48463 , H01L2224/48465 , H01L2924/3025 , H01L2924/00
Abstract: One or more embodiments relate to a semiconductor structure, comprising: a conductive feature; an outer guard ring; and an inner guard ring between the outer guard ring and the conductive feature, the inner guard ring being electrically coupled to the conductive feature.
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公开(公告)号：US20160284661A1
公开(公告)日：2016-09-29
申请号：US15181740
申请日：2016-06-14
Applicant: Infineon Technologies AG
Inventor： Khalil Hosseini , Matthias Stecher
CPC classification number: H01L24/48 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/81 , H01L24/85 , H01L2224/0347 , H01L2224/04042 , H01L2224/05082 , H01L2224/05083 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/73257 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2224/85375 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/0105 , H01L2924/01068 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/20104 , H01L2924/20105 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2224/05164 , H01L2924/00 , H01L2924/013 , H01L2924/2075 , H01L2924/00012 , H01L2924/01006
Abstract: An electronic device and method for production is disclosed. One embodiment provides an integrated component having a first layer which is composed of copper or a copper alloy or which contains copper or a copper alloy, and having an electrically conductive second layer, whose material differs from the material of the first layer, and a connection apparatus which is arranged on the first layer and on the second layer.
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Patent Agency Ranking
公开(公告)号：US20160181154A1
公开(公告)日：2016-06-23
申请号：US15054318
申请日：2016-02-26
Applicant: Infineon Technologies AG
Inventor： Matthias Stecher
IPC: H01L21/768 , H01L23/528 , H01L23/522 , H01L23/532
CPC classification number: H01L23/5283 , H01L21/2885 , H01L21/32051 , H01L21/76807 , H01L21/76838 , H01L21/7685 , H01L21/76852 , H01L21/76871 , H01L21/76873 , H01L21/76879 , H01L21/76885 , H01L23/5226 , H01L23/53223 , H01L23/53238 , H01L23/53252 , H01L2924/0002 , H01L2924/00
Abstract: One or more embodiments are related to a semiconductor device, comprising: a metallization layer comprising a plurality of portions, each of the portions having a different thickness. The metallization layer may be a final metal layer.
Abstract translation: 一个或多个实施例涉及半导体器件，包括：包括多个部分的金属化层，每个部分具有不同的厚度。 金属化层可以是最终的金属层。
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公开(公告)号：US20150069424A1
公开(公告)日：2015-03-12
申请号：US14020391
申请日：2013-09-06
Applicant: Infineon Technologies AG
Inventor： Joost Willemen , Michael Mayerhofer , Ulrich Glaser , Yiqun Cao , Andreas Meiser , Magnus-Maria Hell , Matthias Stecher , Julien Lebon
IPC: H01L31/173 , H01L27/02
CPC classification number: H01L31/173 , H01L27/0255 , H01L27/0629 , H01L27/15 , H01L29/808 , H02H3/20
Abstract: A semiconductor component includes an auxiliary semiconductor device configured to emit radiation. The semiconductor component further includes a semiconductor device. An electrical coupling and an optical coupling between the auxiliary semiconductor device and the semiconductor device are configured to trigger emission of radiation by the auxiliary semiconductor device and to trigger avalanche breakdown in the semiconductor device by absorption of the radiation in the semiconductor device. The semiconductor device includes a pn junction between a first layer of a first conductivity type buried below a surface of a semiconductor body and a doped semiconductor region of a second conductivity type disposed between the surface and the first layer.
Abstract translation: 半导体部件包括被配置为发射辐射的辅助半导体器件。 半导体部件还包括半导体器件。 辅助半导体器件和半导体器件之间的电耦合和光耦合被配置为触发辅助半导体器件的辐射发射，并通过吸收半导体器件中的辐射来触发半导体器件中的雪崩击穿。 半导体器件包括埋在半导体主体的表面下方的第一导电类型的第一层和布置在表面和第一层之间的第二导电类型的掺杂半导体区域之间的pn结。
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公开(公告)号：US09754912B2
公开(公告)日：2017-09-05
申请号：US15181740
申请日：2016-06-14
Applicant: Infineon Technologies AG
Inventor： Khalil Hosseini , Matthias Stecher
IPC: H01L21/44 , H01L23/00 , H01L23/532 , H01L21/56
CPC classification number: H01L24/48 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/81 , H01L24/85 , H01L2224/0347 , H01L2224/04042 , H01L2224/05082 , H01L2224/05083 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/73257 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2224/85375 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/0105 , H01L2924/01068 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/20104 , H01L2924/20105 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2224/05164 , H01L2924/00 , H01L2924/013 , H01L2924/2075 , H01L2924/00012 , H01L2924/01006
Abstract: An electronic device and method for production is disclosed. One embodiment provides an integrated component having a first layer which is composed of copper or a copper alloy or which contains copper or a copper alloy, and having an electrically conductive second layer, whose material differs from the material of the first layer, and a connection apparatus which is arranged on the first layer and on the second layer.
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公开(公告)号：US09705026B2
公开(公告)日：2017-07-11
申请号：US15009271
申请日：2016-01-28
Applicant: Infineon Technologies AG
Inventor： Joost Willemen , Michael Mayerhofer , Ulrich Glaser , Yiqun Cao , Andreas Meiser , Magnus-Maria Hell , Matthias Stecher , Julien Lebon
IPC: H01L21/00 , H01L31/173 , H01L27/02 , H01L27/06 , H01L27/15 , H01L29/808 , H02H3/20
CPC classification number: H01L31/173 , H01L27/0255 , H01L27/0629 , H01L27/15 , H01L29/808 , H02H3/20
Abstract: A method of triggering avalanche breakdown in a semiconductor device includes providing an electrical coupling and an optical coupling between an auxiliary semiconductor device configured to emit radiation and the semiconductor device including a pn junction between a first layer of a first conductivity type buried below a surface of a semiconductor body and a doped semiconductor region of a second conductivity type disposed between the surface and the first layer. The electrical and optical coupling includes triggering emission of radiation by the auxiliary semiconductor device and triggering avalanche breakdown in the semiconductor device by absorption of the radiation in the semiconductor device.
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公开(公告)号：US20160225932A1
公开(公告)日：2016-08-04
申请号：US15009271
申请日：2016-01-28
Applicant: Infineon Technologies AG
Inventor： Joost Willemen , Michael Mayerhofer , Ulrich Glaser , Yiqun Cao , Andreas Meiser , Magnus-Maria Hell , Matthias Stecher , Julien Lebon
IPC: H01L31/173 , H01L27/15 , H01L27/06 , H01L29/808 , H02H3/20 , H01L27/02
CPC classification number: H01L31/173 , H01L27/0255 , H01L27/0629 , H01L27/15 , H01L29/808 , H02H3/20
Abstract: A method of triggering avalanche breakdown in a semiconductor device includes providing an electrical coupling and an optical coupling between an auxiliary semiconductor device configured to emit radiation and the semiconductor device including a pn junction between a first layer of a first conductivity type buried below a surface of a semiconductor body and a doped semiconductor region of a second conductivity type disposed between the surface and the first layer. The electrical and optical coupling includes triggering emission of radiation by the auxiliary semiconductor device and triggering avalanche breakdown in the semiconductor device by absorption of the radiation in the semiconductor device.
Abstract translation: 一种触发半导体器件中的雪崩击穿的方法包括提供电耦合和配置成发射辐射的辅助半导体器件之间的光耦合，该半导体器件包括埋在第一导电类型的第一层之下的pn结， 设置在表面和第一层之间的半导体本体和第二导电类型的掺杂半导体区域。 电耦合和光耦合包括触发由辅助半导体器件发射的辐射，并通过吸收半导体器件中的辐射来触发半导体器件中的雪崩击穿。
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