公开(公告)号：US20210150947A1

公开(公告)日：2021-05-20

申请号：US17161617

申请日：2021-01-28

Applicant: InnoLux Corporation

Inventor： Chin-Lung Ting ,  Chung-Kuang Wei ,  Li-Wei Mao ,  Chi-Liang Chang ,  Chia-Hui Lin

IPC: G09F9/302 ,  G09G3/32

Abstract: An electronic device is disclosed and includes a base substrate, a first circuit layer and a plurality of light-emitting elements. The base substrate has a first surface and a second surface opposite to each other. The first circuit layer includes a first portion and a second portion. The first portion is disposed on the first surface of the base substrate, and the second portion is disposed on the second surface of the base substrate. The light-emitting elements are disposed on the first portion of the first circuit layer. At least one of the second surface of the base substrate and the first portion of the first circuit layer includes at least one microstructure.

公开(公告)号：US20190325789A1

公开(公告)日：2019-10-24

申请号：US16362676

申请日：2019-03-24

Applicant: InnoLux Corporation

Inventor： Chin-Lung Ting ,  Chung-Kuang Wei ,  Li-Wei Mao ,  Chi-Liang Chang ,  Chia-Hui Lin

IPC: G09F9/302 ,  G09G3/32

Abstract: An electronic device and a tiling electronic apparatus are disclosed and include a base substrate, a first circuit layer and a plurality of light-emitting elements. The base substrate has a first surface and a second surface opposite to each other. The first circuit layer includes a first portion and a second portion. The first portion is disposed on the first surface of the base substrate, and the second portion is disposed on the second surface of the base substrate. The light-emitting elements are disposed on the first portion of the first circuit layer. At least one of the second surface of the base substrate and the first portion of the first circuit layer includes at least one microstructure.

公开(公告)号：US20240312375A1

公开(公告)日：2024-09-19

申请号：US18671953

申请日：2024-05-22

Applicant: InnoLux Corporation

Inventor： Chin-Lung Ting ,  Chung-Kuang Wei ,  Li-Wei Mao ,  Chi-Liang Chang ,  Chia-Hui Lin

IPC: G09F9/302 ,  G09G3/32

CPC classification number: G09F9/3026 ,  G09G3/32 ,  G09G2300/026

Abstract: The present disclosure provides an electronic device including a substrate, a plurality of bumps, a plurality of diodes, and a shielding layer. The substrate has a plurality of first through holes. The bumps are disposed on the substrate. The diodes are disposed on the substrate. The shielding layer is disposed on the substrate. One of the bumps is located between two adjacent ones of the diodes in a cross-sectional view, and the shielding layer overlaps at least a portion of the bumps and at least a portion of the first through holes.