ELECTRONIC DEVICE
    1.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240021113A1

    公开(公告)日:2024-01-18

    申请号:US18372709

    申请日:2023-09-26

    CPC classification number: G09F9/3026 G09G3/32 G09G2300/026

    Abstract: The present disclosure provides an electronic device including a substrate, a first circuit layer, and a plurality of diodes. The substrate has a plurality of first through holes. The first circuit layer is disposed on the substrate and has a plurality of light through holes. The diodes disposed on the first circuit layer. One of the light through holes is located between two adjacent ones of the diodes, and the light through holes overlap a portion of the plurality of first through holes and do not overlap another portion of the plurality of first through holes in a normal direction of the substrate.

    Electronic device
    2.
    发明授权

    公开(公告)号:US11250738B2

    公开(公告)日:2022-02-15

    申请号:US17161617

    申请日:2021-01-28

    Abstract: An electronic device is disclosed and includes a base substrate, a first circuit layer and a plurality of light-emitting elements. The base substrate has a first surface and a second surface opposite to each other. The first circuit layer includes a first portion and a second portion. The first portion is disposed on the first surface of the base substrate, and the second portion is disposed on the second surface of the base substrate. The light-emitting elements are disposed on the first portion of the first circuit layer. At least one of the second surface of the base substrate and the first portion of the first circuit layer includes at least one microstructure.

    Tiling electronic apparatus
    3.
    发明授权

    公开(公告)号:US10957226B2

    公开(公告)日:2021-03-23

    申请号:US16362676

    申请日:2019-03-24

    Abstract: An electronic device and a tiling electronic apparatus are disclosed and include a base substrate, a first circuit layer and a plurality of light-emitting elements. The base substrate has a first surface and a second surface opposite to each other. The first circuit layer includes a first portion and a second portion. The first portion is disposed on the first surface of the base substrate, and the second portion is disposed on the second surface of the base substrate. The light-emitting elements are disposed on the first portion of the first circuit layer. At least one of the second surface of the base substrate and the first portion of the first circuit layer includes at least one microstructure.

    Electronic device
    4.
    发明授权

    公开(公告)号:US12020602B2

    公开(公告)日:2024-06-25

    申请号:US18372709

    申请日:2023-09-26

    CPC classification number: G09F9/3026 G09G3/32 G09G2300/026

    Abstract: The present disclosure provides an electronic device including a substrate, a first circuit layer, and a plurality of diodes. The substrate has a plurality of first through holes. The first circuit layer is disposed on the substrate and has a plurality of light through holes. The diodes disposed on the first circuit layer. One of the light through holes is located between two adjacent ones of the diodes, and the light through holes overlap a portion of the plurality of first through holes and do not overlap another portion of the plurality of first through holes in a normal direction of the substrate.

    ELECTRONIC DEVICE
    5.
    发明申请

    公开(公告)号:US20230102366A1

    公开(公告)日:2023-03-30

    申请号:US18075434

    申请日:2022-12-06

    Abstract: An electronic device is disclosed and includes a substrate, a circuit layer, and a plurality of diodes. The substrate has a plurality of structures. The circuit layer is disposed on the substrate. The diodes are disposed on the circuit layer, wherein a first spacing is defined as a distance between a center point of a first one of the structures and a center point of a second one of the structures, a second spacing is defined as a distance between a center point of a third one of the structures and a center point of a fourth one of the structures, and an absolute value of a difference between the first spacing and the second spacing is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.

    ELECTRONIC DEVICE
    6.
    发明申请

    公开(公告)号:US20250118230A1

    公开(公告)日:2025-04-10

    申请号:US18983393

    申请日:2024-12-17

    Abstract: An electronic device is provided and includes a substrate, a first bump, a second bump, and an electronic element. The substrate includes a first through hole and a second through hole disposed adjacent to the first through hole along a direction. The first bump and the second bump are overlapped with the substrate, wherein the first bump is adjacent to the second bump along the direction. The electronic element is overlapped with the substrate and electrically connected to the first bump, wherein the substrate is disposed between the first bump and the electronic element. A distance between the first through hole and the second through hole of the substrate along the direction is different from a distance between the first bump and the second bump along the direction.

    Electronic device
    7.
    发明授权

    公开(公告)号:US11551587B2

    公开(公告)日:2023-01-10

    申请号:US17567176

    申请日:2022-01-03

    Abstract: An electronic device is disclosed and includes a base substrate, a circuit layer, and a plurality of light-emitting elements. The base substrate has a plurality of through holes, the circuit layer is disposed on the base substrate, and the light-emitting elements are disposed on the first circuit layer. An absolute value of a difference between two adjacent spacings of the plurality of through holes of the base substrate is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.

    ELECTRONIC DEVICE
    8.
    发明申请

    公开(公告)号:US20220122492A1

    公开(公告)日:2022-04-21

    申请号:US17567176

    申请日:2022-01-03

    Abstract: An electronic device is disclosed and includes a base substrate, a circuit layer, and a plurality of light-emitting elements. The base substrate has a plurality of through holes, the circuit layer is disposed on the base substrate, and the light-emitting elements are disposed on the first circuit layer. An absolute value of a difference between two adjacent spacings of the plurality of through holes of the base substrate is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.

    Electronic device
    9.
    发明授权

    公开(公告)号:US12205501B2

    公开(公告)日:2025-01-21

    申请号:US18671953

    申请日:2024-05-22

    Abstract: The present disclosure provides an electronic device including a substrate, a plurality of bumps, a plurality of diodes, and a shielding layer. The substrate has a plurality of first through holes. The bumps are disposed on the substrate. The diodes are disposed on the substrate. The shielding layer is disposed on the substrate. One of the bumps is located between two adjacent ones of the diodes in a cross-sectional view, and the shielding layer overlaps at least a portion of the bumps and at least a portion of the first through holes.

    Electronic device
    10.
    发明授权

    公开(公告)号:US11810485B2

    公开(公告)日:2023-11-07

    申请号:US18075434

    申请日:2022-12-06

    CPC classification number: G09F9/3026 G09G3/32 G09G2300/026

    Abstract: An electronic device is disclosed and includes a substrate, a circuit layer, and a plurality of diodes. The substrate has a plurality of structures. The circuit layer is disposed on the substrate. The diodes are disposed on the circuit layer, wherein a first spacing is defined as a distance between a center point of a first one of the structures and a center point of a second one of the structures, a second spacing is defined as a distance between a center point of a third one of the structures and a center point of a fourth one of the structures, and an absolute value of a difference between the first spacing and the second spacing is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.

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