ELECTRONIC DEVICE
    12.
    发明申请

    公开(公告)号:US20220165726A1

    公开(公告)日:2022-05-26

    申请号:US17513865

    申请日:2021-10-28

    Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

    Display device, tiling electronic device and method for repairing a display device

    公开(公告)号:US11049439B2

    公开(公告)日:2021-06-29

    申请号:US16355961

    申请日:2019-03-18

    Abstract: A display device includes a pixel array, multiple data lines and multiple gate lines. The pixel array includes multiple pixels. At least one of the pixels includes a first sub-pixel and a second sub-pixel. The first sub-pixel includes a pixel circuit, which includes a first light-emitting element and a first driving circuit. The first driving circuit is coupled to and configured to control the first light-emitting element. The first driving circuit includes multiple TFTs. The second sub-pixel includes a pixel circuit, which includes a second light-emitting element and a second driving circuit. The second driving circuit is coupled to and configured to control the second light-emitting element. The second driving circuit includes multiple TFTs. The number of TFTs of the first driving circuit and the number of TFTs of the second driving circuit are different.

    ELECTRONIC DEVICE
    15.
    发明申请

    公开(公告)号:US20250063801A1

    公开(公告)日:2025-02-20

    申请号:US18934223

    申请日:2024-10-31

    Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

    Foldable display device
    18.
    发明授权

    公开(公告)号:US11341873B2

    公开(公告)日:2022-05-24

    申请号:US16920767

    申请日:2020-07-06

    Abstract: A foldable display device includes a first panel having a first flat portion and a first bending portion at one side of the first flat portion. The first bending portion has a first bending axis around which the first bending portion rotates. The foldable display device also includes a second panel having a second flat portion and a second bending portion at one side of the second flat portion. The second bending portion has a second bending axis around which the second bending portion rotates. The first bending portion and the second bending portion are arranged adjacent to each other.

    Array substrates and optoelectronic devices
    20.
    发明授权
    Array substrates and optoelectronic devices 有权
    阵列基板和光电器件

    公开(公告)号:US09466621B2

    公开(公告)日:2016-10-11

    申请号:US14166257

    申请日:2014-01-28

    Inventor: Cheng-Hsu Chou

    CPC classification number: H01L27/124 G02F1/136286 H01L27/1255 H01L27/1288

    Abstract: Disclosed is a method of forming array substrates having a peripheral wiring area and a display area. The method is processed by only three lithography processes with two multi-tone photomasks and one general photomask. In the peripheral wiring area, the top conductive line directly contacts the bottom conductive line without any other conductive layer. The conventional lift-off process is eliminated, thereby preventing a material (not dissolved by a stripper) from suspending in the stripper or remaining on the array substrate surface.

    Abstract translation: 公开了一种形成具有外围布线区域和显示区域的阵列基板的方法。 该方法仅通过三个光刻工艺与两个多色光掩模和一个一般的光掩模进行处理。 在外围布线区域中,顶部导电线直接接触底部导电线而没有任何其它导电层。 消除传统的剥离过程,从而防止材料(不被汽提器溶解)悬浮在汽提器中或残留在阵列基板表面上。

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