公开(公告)号：US20250105120A1

公开(公告)日：2025-03-27

申请号：US18813059

申请日：2024-08-23

Applicant: Innolux Corporation

Inventor： Po-Yun Hsu ,  Ker-Yih Kao

IPC: H01L23/498 ,  H01L21/48

Abstract: A manufacturing method of an electronic device having a through-hole substrate includes: irradiating a partial region on two opposite surfaces of a substrate with a laser; and performing a through-hole formation step on the partial region of the substrate. The through-hole formation step includes: performing an etching step to form opposite etching profiles in the partial region on the two opposite surfaces of the substrate; performing a buffer layer coating step to form a buffer layer on the two opposite surfaces of the substrate and the opposite etching profiles; and repeating the etching step and the buffer layer coating step until the opposite etching profiles form a through hole. An electronic device is also provided.

公开(公告)号：US20240297168A1

公开(公告)日：2024-09-05

申请号：US18663100

申请日：2024-05-14

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/538 ,  H01L29/93

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes an insulator, a driving unit, an electronic unit, and a circuit unit. The driving unit is overlapped with the insulator. The electronic unit is overlapped with the insulator. The circuit unit is electrically connected to the driving unit. The driving unit receives a signal from the circuit unit and drives the electronic unit.

公开(公告)号：US12063832B2

公开(公告)日：2024-08-13

申请号：US18193003

申请日：2023-03-30

Applicant: InnoLux Corporation

Inventor： Shun-Yuan Hu ,  Chin-Lung Ting ,  Li-Wei Mao ,  Ming-Chun Tseng ,  Kung-Chen Kuo ,  M-Hua Hsu ,  Ker-Yih Kao

IPC: H10K59/18 ,  G09F9/302 ,  G09G3/00 ,  H01L23/00 ,  H01L25/16 ,  H01L27/12 ,  H10K50/86 ,  H10K59/131 ,  H10K77/10 ,  H01L21/66

CPC classification number: H10K59/18 ,  G09F9/3026 ,  G09G3/006 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/162 ,  H01L25/167 ,  H01L27/124 ,  H10K50/865 ,  H10K59/131 ,  H10K77/111 ,  H01L22/14 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.

公开(公告)号：US12039919B2

公开(公告)日：2024-07-16

申请号：US18131135

申请日：2023-04-05

Applicant: InnoLux Corporation

Inventor： Yi-Hua Hsu ,  Ker-Yih Kao ,  Ming-Chun Tseng ,  Mu-Fan Chang ,  Wen-Lin Huang

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/026 ,  G09G2300/0408 ,  G09G2300/0426

Abstract: An electronic device includes: a circuit board; a plurality of diodes disposed on a first surface of the circuit board; a plurality of first driving circuits disposed on the first surface of the circuit board and electrically connected to the plurality of diodes; and a plurality of second driving circuits electrically connected to the plurality of first driving circuits, wherein a part of the plurality of second driving circuits are disposed on a first substrate, and another part of the second driving circuits are disposed on a second substrate.

公开(公告)号：US20240162241A1

公开(公告)日：2024-05-16

申请号：US18420794

申请日：2024-01-24

Applicant: InnoLux Corporation

Inventor： Chi-Lun Kao ,  Ker-Yih Kao ,  Ming-Chun Tseng ,  Kung-Chen Kuo

IPC: H01L27/12 ,  H01L23/60 ,  H01L25/16 ,  H01L27/02

CPC classification number: H01L27/124 ,  H01L23/60 ,  H01L25/167 ,  H01L27/0292

Abstract: The present disclosure provides an electronic device including a substrate, a semiconductor disposed on the substrate, and a conductive layer disposed on the semiconductor. The conductive layer has a first electrode and a second electrode, in which the first electrode is electrically connected to the semiconductor, and the second electrode surrounds the first electrode in a top view direction of the electronic device.

公开(公告)号：US20240079348A1

公开(公告)日：2024-03-07

申请号：US18231245

申请日：2023-08-07

Applicant: InnoLux Corporation

Inventor： Ker-Yih Kao ,  Cheng-Chi Wang ,  Yen-Fu Liu ,  Ju-Li Wang ,  Jui-Jen Yueh

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L29/786

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/08 ,  H01L29/78603 ,  H01L2224/08225

Abstract: An electronic device includes a chip and a circuit structure layer overlapped with the chip. The circuit structure layer includes a redistribution structure layer and an element structure layer, and the redistribution structure layer and the element structure layer are electrically connected to the chip. At least one of the redistribution structure layer and the element structure layer includes at least one opening, and in a normal direction of the electronic device, the at least one opening is overlapped with aside of the chip.

公开(公告)号：US20230129218A1

公开(公告)日：2023-04-27

申请号：US17746987

申请日：2022-05-18

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Ker-Yih Kao ,  Cheng-Chi Wang ,  Kuang-Ming Fan ,  Chun-Hung Chen ,  Wen-Hsiang Liao ,  Ming-Hsien Shih

IPC: H01L23/00

Abstract: An electronic device including a connection element is provided. The connection element includes a first insulation layer and a second insulation layer. The first insulation layer has a first opening. A sidewall of the first insulation layer at the first opening has roughness different from roughness of a top surface of the first insulation layer. The second insulation layer is disposed on the first insulation layer, and the second insulation layer has a second opening. The sidewall of the first insulation layer at the first opening is exposed by the second opening. A method of fabricating an electronic device is also provided.

公开(公告)号：US20220328405A1

公开(公告)日：2022-10-13

申请号：US17851046

申请日：2022-06-28

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.

公开(公告)号：US11469491B2

公开(公告)日：2022-10-11

申请号：US16732701

申请日：2020-01-02

Applicant: InnoLux Corporation

Inventor： Chia-Ping Tseng ,  Ker-Yih Kao ,  Chia-Chi Ho ,  Ming-Yen Weng ,  Hung-I Tseng ,  Shu-Ling Wu ,  Huei-Ying Chen

IPC: H01Q1/38 ,  H01Q3/44 ,  H01Q9/04 ,  H01L27/12 ,  H01L21/04 ,  H01Q3/34 ,  G02F1/1343 ,  G02F1/1333

Abstract: An antenna device is provided. The antenna device includes a first substrate, a multilayer electrode, a second substrate, and a liquid-crystal layer. The multilayer electrode is disposed on the first substrate, and the multilayer electrode includes a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is disposed on the first conductive layer. The third conductive layer is disposed on the second conductive layer. The liquid-crystal layer is disposed between the first substrate and the second substrate. In addition, the third conductive layer includes a first portion that extends beyond the second conductive layer.

公开(公告)号：US11417573B2

公开(公告)日：2022-08-16

申请号：US17034965

申请日：2020-09-28

Applicant: InnoLux Corporation

Inventor： Ker-Yih Kao ,  Liang-Lu Chen ,  Chin-Lung Ting

IPC: H01L21/66 ,  H01L25/075 ,  H01L33/62 ,  H01L27/12

Abstract: An electronic device is provided. The electronic device includes a substrate and an electronic unit disposed on the substrate. The electronic unit includes a light-emitting diode, a conductive structure, a first driving circuit, and a second driving circuit. The conductive structure is disposed between the light-emitting diode and the substrate. The first driving circuit includes a first output wire. The second driving circuit includes a second output wire. The first driving circuit is electrically connected to the light-emitting diode by the conductive structure. The second driving circuit is electrically insulated from the light-emitting diode. In addition, the conductive structure at least partially overlaps the first output wire and the second output wire in a normal direction of the substrate.