公开(公告)号：US10784570B2

公开(公告)日：2020-09-22

申请号：US15989533

申请日：2018-05-25

Applicant: InnoLux Corporation

Inventor： Yan-Zheng Wu ,  I-Yin Li ,  Kuang-Chiang Huang ,  Chien-Hung Chan ,  Huang-Chi Chao ,  Chih-Yung Hsieh

IPC: H01Q1/38 ,  H01Q21/00

Abstract: A liquid-crystal antenna device includes a signal source, a driving module, a correction module, and a plurality of radiation units. The signal source provides an input electromagnetic wave. The driving module outputs a plurality of initial voltage signals according to a radiation address. The correction module receives the initial voltage signals and outputs a plurality of corrected voltage signals according to a lookup table. The radiation units respectively receive the corrected voltage signals and are coupled to the input electromagnetic wave to generate an output electromagnetic wave.

公开(公告)号：US12015027B2

公开(公告)日：2024-06-18

申请号：US17851047

申请日：2022-06-28

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L29/93 ,  H01L23/538

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electromagnetic wave adjustment apparatus includes a control circuit, a transistor circuit die and an electronic assembly. The transistor circuit die receives a control signal from the control circuit and drives the electronic assembly.

公开(公告)号：US20220181257A1

公开(公告)日：2022-06-09

申请号：US17678040

申请日：2022-02-23

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US20210050657A1

公开(公告)日：2021-02-18

申请号：US16932862

申请日：2020-07-20

Applicant: Innolux Corporation

Inventor： Yi Hung Lin ,  Chung-Kuang Wei ,  Tang Chin Hung ,  I-Yin Li ,  Chia-Chi Ho

IPC: H01Q1/38 ,  H01Q1/40

Abstract: An antenna device is provided, including a first substrate, a first conductive element, a second substrate, a second conductive element, and an insulating layer. The first conductive element is disposed on the first substrate to define, on the first substrate, a recessed region adjacent to the first conductive element. The second substrate faces the first substrate. The second conductive element is disposed on the second substrate and located between the first substrate and the second substrate. The insulating layer is disposed between the first substrate and the second substrate. In a top view of the antenna device, the second conductive element overlaps the first conductive element and the recessed region, and the insulating layer at least partially overlaps the recessed region.

公开(公告)号：US10709012B2

公开(公告)日：2020-07-07

申请号：US15858004

申请日：2017-12-29

Applicant: Innolux Corporation

Inventor： Yan-Syun Wang ,  Chi-Che Tsai ,  Wei-Yen Wu ,  I-Yin Li

IPC: H05K1/02 ,  H05K3/10 ,  H01P3/08 ,  H05K3/22

Abstract: A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.

公开(公告)号：US10707152B2

公开(公告)日：2020-07-07

申请号：US15844907

申请日：2017-12-18

Applicant: InnoLux Corporation

Inventor： Ming-Yen Weng ,  Ker-Yih Kao ,  Chia-Chi Ho ,  Tsutomu Shinozaki ,  Cheng-Chi Wang ,  I-Yin Li

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/485 ,  H01L21/311 ,  H01L25/065 ,  H01Q1/38

Abstract: A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 μm to 10 μm. A high-frequency device is also provided.

公开(公告)号：US10461412B2

公开(公告)日：2019-10-29

申请号：US15906126

申请日：2018-02-27

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Yi-Hung Lin ,  Chia-Chi Ho ,  Li-Wei Sung ,  Ming-Yen Weng ,  Hung-I Tseng ,  Kuo-Chun Lo ,  Charlene Su ,  Ker-Yih Kao

IPC: H01Q1/00 ,  H01Q1/40 ,  H01Q3/44 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q1/22 ,  H01Q1/24 ,  G02F1/13

Abstract: A microwave modulation device includes a first radiator, a second radiator and a modulation structure. The first radiator includes a substrate; a metal layer disposed on the substrate; a protective layer disposed on at least a portion of the metal layer and including a through hole overlapping with at least a portion of the metal layer; and an etch stop layer disposed between the metal layer and the protective layer. The second radiator disposed corresponding to the first radiator. The modulation structure is disposed between the first radiator and the second radiator.

公开(公告)号：US20240297168A1

公开(公告)日：2024-09-05

申请号：US18663100

申请日：2024-05-14

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/538 ,  H01L29/93

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes an insulator, a driving unit, an electronic unit, and a circuit unit. The driving unit is overlapped with the insulator. The electronic unit is overlapped with the insulator. The circuit unit is electrically connected to the driving unit. The driving unit receives a signal from the circuit unit and drives the electronic unit.

公开(公告)号：US12074365B2

公开(公告)日：2024-08-27

申请号：US17462516

申请日：2021-08-31

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Yi-Hung Lin ,  Chin-Lung Ting ,  Tang-Chin Hung ,  Jeng-Nan Lin

IPC: H01Q1/00 ,  H01Q1/36 ,  H01Q3/44 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q21/00 ,  G02F1/1339

CPC classification number: H01Q1/36 ,  H01Q3/44 ,  H01Q9/0407 ,  H01Q13/106 ,  H01Q21/0006 ,  G02F1/1339

Abstract: An antenna device is provided, which includes a first substrate, and a second substrate facing and spaced with the first substrate in a distance. At least one working element disposed between the first substrate and the second substrate, wherein the at least one working element is filled with a modulation material. At least one buffer element is connected with the at least one working element for adjusting the amount of the modulation material in the at least one working element.

公开(公告)号：US20220328405A1

公开(公告)日：2022-10-13

申请号：US17851046

申请日：2022-06-28

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.