公开(公告)号：US20250024608A1

公开(公告)日：2025-01-16

申请号：US18902957

申请日：2024-10-01

Applicant: Innolux Corporation

Inventor： Yi Hung Lin ,  Li-Wei Sung

IPC: H05K3/34 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00

Abstract: A circuit structure is provided. The circuit structure includes an insulating layer, a conductive pad and a solder pad. The insulating layer has a first surface and a second surface opposite to the first surface. The conductive pad is disposed on the first surface of the insulating layer. The solder pad is disposed on the second surface of the insulating layer. The solder pad is coupled to the conductive pad. The insulating layer has a recess region on the second surface.

公开(公告)号：US20240297168A1

公开(公告)日：2024-09-05

申请号：US18663100

申请日：2024-05-14

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/538 ,  H01L29/93

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes an insulator, a driving unit, an electronic unit, and a circuit unit. The driving unit is overlapped with the insulator. The electronic unit is overlapped with the insulator. The circuit unit is electrically connected to the driving unit. The driving unit receives a signal from the circuit unit and drives the electronic unit.

公开(公告)号：US20220328405A1

公开(公告)日：2022-10-13

申请号：US17851046

申请日：2022-06-28

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.

公开(公告)号：US11302635B2

公开(公告)日：2022-04-12

申请号：US16920448

申请日：2020-07-03

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93 ,  H01L23/538 ,  H01L21/60

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US12133337B2

公开(公告)日：2024-10-29

申请号：US17096968

申请日：2020-11-13

Applicant: Innolux Corporation

Inventor： Yi Hung Lin ,  Li-Wei Sung

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K3/3436 ,  H05K1/0268 ,  H05K1/113 ,  H05K1/186 ,  H05K3/0017

Abstract: A circuit structure and a fabrication method thereof are provided. The fabrication method of the circuit structure includes the following steps: providing a substrate; fabricating a test circuit component on the substrate; fabricating a solder pad on the test circuit component; fabricating an insulating layer; and fabricating a conductive pad on the insulating layer. A second surface of the insulating layer covers the test circuit component and the solder pad. The conductive pad is coupled to the solder pad. Through the fabrication method of the circuit structure provided by the disclosure, circuit quality of the circuit structure may be monitored, and that reliability of the circuit structure provided by the disclosure is improved.

公开(公告)号：US12034002B2

公开(公告)日：2024-07-09

申请号：US17678040

申请日：2022-02-23

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L29/93 ,  H01L23/538

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US11353735B2

公开(公告)日：2022-06-07

申请号：US16939064

申请日：2020-07-27

Applicant: Innolux Corporation

Inventor： Yi Hung Lin ,  I-Yin Li ,  Chia-Chi Ho ,  Hsiuyi Tsai

IPC: G02F1/1333 ,  G02F1/1339

Abstract: An electronic device including a pair of substrates, a sealant, and a heating unit is provided. Each of the pair of substrates includes a peripheral area and an active area, and each of the peripheral areas are adjacent to an edge of a corresponding one of the pair of substrates. The sealant is disposed between the pair of substrates. The heating unit is disposed on one of the pair of substrates and comprising a first portion disposed in the peripheral area of the one of the pair of substrates and adjacent to an edge of the one of the pair of substrates, a third portion disposed in the active area, and a second portion connecting the first portion and the third portion. The resistance of the first portion is less than a resistance of the third portion. Therefore, the electronic device may have improved heating efficiency.

公开(公告)号：US11342657B2

公开(公告)日：2022-05-24

申请号：US16932862

申请日：2020-07-20

Applicant: Innolux Corporation

Inventor： Yi Hung Lin ,  Chung-Kuang Wei ,  Tang Chin Hung ,  I-Yin Li ,  Chia-Chi Ho

IPC: H01Q1/38 ,  H01Q1/40

Abstract: An antenna device is provided, including a first substrate, a first conductive element, a second substrate, a second conductive element, and an insulating layer. The first conductive element is disposed on the first substrate to define, on the first substrate, a recessed region adjacent to the first conductive element. The second substrate faces the first substrate. The second conductive element is disposed on the second substrate and located between the first substrate and the second substrate. The insulating layer is disposed between the first substrate and the second substrate. In a top view of the antenna device, the second conductive element overlaps the first conductive element and the recessed region, and the insulating layer at least partially overlaps the recessed region.

公开(公告)号：US11201404B2

公开(公告)日：2021-12-14

申请号：US17035725

申请日：2020-09-29

Applicant: Innolux Corporation

Inventor： Hsiuyi Tsai ,  Yi Hung Lin ,  Chia-Chi Ho ,  Yan-Zheng Wu

IPC: H01Q3/44 ,  G02F1/13 ,  H01Q15/00 ,  H01Q1/36 ,  H01Q21/06 ,  H01Q21/24

Abstract: An electromagnetic wave adjusting device includes a first substrate, a first conductive element, a first insulation layer, a second substrate, a second conductive element, a dielectric layer, and a conductive layer. The first conductive element is disposed on the first substrate. The first insulation layer is disposed on the first conductive element. The second conductive element is disposed on the second substrate. The dielectric layer is disposed between the first substrate and the second substrate. The first conductive layer is disposed on the first insulation layer and electrically connected to the first conductive element. The electromagnetic wave adjusting device includes an overlap area and a capacitance adjustable area. An overlap portion of the first conductive element and the second conductive element constitutes the overlap area, the capacitance adjustable area includes the overlap area, and at least part of the first conductive layer is disposed in the capacitance adjustable area.