公开(公告)号：US20190033576A1

公开(公告)日：2019-01-31

申请号：US16072161

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. OSTER ,  Feras EID ,  Johanna M. SWAN ,  Thomas L. SOUNART ,  Aleksandar ALEKSOV ,  Shawna M. LIFF ,  Baris BICEN ,  Valluri R. RAO

IPC: G02B26/08 ,  H01L41/09 ,  H01L41/253

Abstract: Embodiments of the invention include a display formed on an organic substrate and methods of forming such a device. According to an embodiment, an array of pixel mirrors may be formed on the organic substrate. For example, each of the pixel mirrors is actuatable about one or more axes out of the plane of the organic substrate. Additionally, embodiments of the invention may include an array of routing mirrors formed on the organic substrate. According to an embodiment, each of the routing mirrors is actuatable about two axes out of the plane of the organic substrate. In embodiments of the invention, a light source may be used for emitting light towards the array of routing mirrors. For example, light emitted from the light source may be reflected to one or more of the pixel mirrors by one of the routing mirrors.

公开(公告)号：US20190033575A1

公开(公告)日：2019-01-31

申请号：US16072157

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. OSTER ,  Feras EID ,  Johanna M. SWAN ,  Shawna M. LIFF ,  Aleksandar ALEKSOV ,  Thomas L. SOUNART ,  Baris BICEN ,  Valluri R. RAO

IPC: G02B26/08 ,  H01L41/047 ,  H01L41/27 ,  H01L41/332 ,  H01L41/314

Abstract: Embodiments of the invention include a piezo-electric mirror in an microelectronic package and methods of forming the package. According to an embodiment the microelectronic package may include an organic substrate with a cavity formed in the organic substrate. In some embodiments, an actuator is anchored to the organic substrate and extends over the cavity. For example, the actuator may include a first electrode and a piezo-electric layer formed on the first electrode. A second electrode may be formed on the piezo-electric layer. Additionally, a mirror may be formed on the actuator. Embodiments allow for the piezo-electric layer to be formed on an organic package substrate by using low temperature crystallization processes. For example, the piezo-electric layer may be deposited in an amorphous state. Thereafter, a laser annealing process that includes a pulsed laser may be used to crystallize the piezo-electric layer.

公开(公告)号：US20190032272A1

公开(公告)日：2019-01-31

申请号：US16072165

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Feras EID ,  Aleksandar ALEKSOV ,  Sasha N. OSTER ,  Baris BICEN ,  Thomas L. SOUNART ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: D06M10/06 ,  D06M11/46 ,  D06M11/47 ,  H01L41/29 ,  H01L41/316 ,  H01L41/187 ,  H01L41/047

Abstract: Embodiments of the invention include an active fiber with a piezoelectric layer that has a crystallization temperature that is greater than a melt or draw temperature of the fiber and methods of forming such active fibers. According to an embodiment, a first electrode is formed over an outer surface of a fiber. Embodiments may then include depositing a first amorphous piezoelectric layer over the first electrode. Thereafter, the first amorphous piezoelectric layer may be crystallized with a pulsed laser annealing process to form a first crystallized piezoelectric layer. In an embodiment, the pulsed laser annealing process may include exposing the first amorphous piezoelectric layer to radiation from an excimer laser with an energy density between approximately 10 and 100 mJ/cm2 and pulse width between approximately 10 and 50 nanoseconds. Embodiments may also include forming a second electrode over an outer surface of the crystallized piezoelectric layer.