公开(公告)号：US11127727B2

公开(公告)日：2021-09-21

申请号：US16433756

申请日：2019-06-06

Applicant: Intel Corporation

Inventor： Robert L. Sankman ,  Pooya Tadayon ,  Weihua Tang ,  Chandra M. Jha ,  Zhimin Wan

IPC: H01L25/18 ,  H01L23/48 ,  H01L23/42 ,  H01L23/00

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a plurality of dies, a logic die coupled to the plurality of dies, and a dummy die thereon. In selected examples, the dummy die is located between the logic die and the plurality of silicon dies. In selected examples, the dummy die is attached to the logic die.

公开(公告)号：US10461011B2

公开(公告)日：2019-10-29

申请号：US15855971

申请日：2017-12-27

Applicant: Intel Corporation

Inventor： Nicholas Neal ,  David W. Mendel ,  Chandra M. Jha ,  Kelly P. Lofgreen

IPC: H01L23/48 ,  H01L23/367 ,  H01L21/48 ,  H01L23/373 ,  H01L25/065 ,  H01L25/00

Abstract: Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a first die, a second die, and an integrated heat spreader. The integrated heat spreader may include a first surface. The first surface may define a first indentation located in between the first die and the second die.

公开(公告)号：US10290561B2

公开(公告)日：2019-05-14

申请号：US15279222

申请日：2016-09-28

Applicant: Intel Corporation

Inventor： Edvin Cetegen ,  Omkar G. Karhade ,  Kedar Dhane ,  Chandra M. Jha

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/427 ,  H01L23/433

Abstract: A thermal interface may include a wired network made of a first TIM, and a second TIM surrounding the wired network. A heat spreader lid may include a wired network attached to an inner surface of the heat spreader lid. An IC package may include a heat spreader lid placed over a first electronic component and a second electronic component. A first thermal interface may be formed between the first electronic component and the inner surface of the heat spreader lid, and a second thermal interface may be formed between the second electronic component and the inner surface of the heat spreader lid. The first thermal interface may include a wired network of a first TIM surrounded by a second TIM, while the second thermal interface may include the second TIM, without a wired network of the first TIM. Other embodiments may be described and/or claimed.

公开(公告)号：US20170133296A1

公开(公告)日：2017-05-11

申请号：US15410625

申请日：2017-01-19

Applicant: Intel Corporation

Inventor： Chandra M. Jha ,  Feras EID ,  Johanna M. SWAN ,  Ashish GUPTA

IPC: H01L23/373 ,  H01L23/00

CPC classification number: H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1133 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11826 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13147 ,  H01L2224/13193 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2745 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/3511 ,  Y10T428/249921 ,  Y10T428/26 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.