公开(公告)号：US20210013123A1

公开(公告)日：2021-01-14

申请号：US16505052

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Taylor William Gaines ,  Ken Hackenberg ,  Elah Bozorg-Grayeli

IPC: H01L23/40 ,  H01L23/367 ,  H01L21/48 ,  F28F3/10

Abstract: Embodiments may relate to a microelectronic package that includes an integrated heat spreader (IHS) coupled with a package substrate. The microelectronic package may further include a sealant material between the package substrate and the IHS. The sealant material may be formed of a material that cures when exposed to ultraviolet (UV) wavelengths. Other embodiments may be described or claimed.

公开(公告)号：US20200006192A1

公开(公告)日：2020-01-02

申请号：US16019899

申请日：2018-06-27

Applicant: Intel Corporation

Inventor： Peng Li ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal ,  Ken Hackenberg

IPC: H01L23/42 ,  H01L23/373 ,  H01L23/367

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.