公开(公告)号：US10290569B2

公开(公告)日：2019-05-14

申请号：US15721707

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Venkata Suresh R. Guthikonda ,  Patrick Nardi ,  Santosh Sankarasubramanian ,  Kevin Y. Lin ,  Leigh M. Tribolet ,  John L. Harper ,  Pramod Malatkar

IPC: H01L23/49 ,  H01L23/498 ,  H01L23/367 ,  H01L21/50 ,  H05K1/02 ,  H01L23/00 ,  H01L23/52

Abstract: An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.

公开(公告)号：US09418912B2

公开(公告)日：2016-08-16

申请号：US14952651

申请日：2015-11-25

Applicant: Intel Corporation

Inventor： Patrick Nardi ,  Kelly P. Lofgreen

IPC: H01L23/10 ,  H01L21/00 ,  H01L23/367 ,  G06F1/20 ,  H01L23/495 ,  F28F3/02

CPC classification number: H01L23/3672 ,  F28F3/025 ,  G06F1/20 ,  H01L23/49568 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/0002 ,  H01L2924/16152 ,  H01L2924/00

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments.

公开(公告)号：US20160079141A1

公开(公告)日：2016-03-17

申请号：US14952651

申请日：2015-11-25

Applicant: Intel Corporation

Inventor： Patrick Nardi ,  Kelly P. Lofgreen

IPC: H01L23/367 ,  H01L27/108 ,  H01L23/373

CPC classification number: H01L23/3672 ,  F28F3/025 ,  G06F1/20 ,  H01L23/49568 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/0002 ,  H01L2924/16152 ,  H01L2924/00

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 那些方法可以包括形成热界面材料，该热界面材料包括位于第一和第二界面材料之间的导热蛇形箔。 在实施例中，蛇形箔可以处于平行位置或旋转位置。