公开(公告)号：US20230016098A1

公开(公告)日：2023-01-19

申请号：US17957698

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Navneeth Jayaraj ,  Prabhakar Subrahmanyam ,  Nagaraj K ,  Gopinath K ,  Paniraj Gururaja ,  Mahammad Yaseen Mulla ,  Nitesh Gupta ,  Ying-Feng Pang

IPC: G06F1/20 ,  H05K7/20

Abstract: Example field replaceable fan assemblies for peripheral processing units and related systems and methods are disclosed. An example apparatus includes a temperature sensor; a fan having a base; at least one memory; machine readable instructions; and processor circuitry to execute operations corresponding to the machine readable instructions to determine a first temperature based on an output of the temperature sensor; and cause the base of the fan to move based on the first temperature.

公开(公告)号：US12169180B2

公开(公告)日：2024-12-17

申请号：US17133563

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Ying-Feng Pang ,  Yi Xia ,  Mark Bianco ,  Victor Polyanko

IPC: G01N21/952 ,  H05K1/02 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.

公开(公告)号：US20230345677A1

公开(公告)日：2023-10-26

申请号：US18344620

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Shaorong Zhou ,  Prabhakar Subrahmanyam ,  Guocheng Zhang ,  Tejas Shah ,  Dongrui Xue

IPC: H05K7/20 ,  F28F9/007

CPC classification number: H05K7/20709 ,  F28F9/007

Abstract: Compact rear mounted modular heat exchangers and related methods are disclosed herein. An example apparatus disclosed herein includes a heat exchanger having an air flow inlet and an air flow outlet, a holder frame to receive a component of a server chassis, and a bracket coupled to the holder frame, the bracket to retain the heat exchanger adjacent a rear of the server chassis.

公开(公告)号：US11439037B2

公开(公告)日：2022-09-06

申请号：US15986657

申请日：2018-05-22

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Arun Krishnamoorthy

IPC: H05K7/20 ,  H05K1/02

Abstract: Disclosed herein are integrated circuit (IC) packages with a heat generating electronic component and a fluid impingement cooling apparatus having a plurality of rotatable nozzles, as well as related devices and methods. In some embodiments, an IC device assembly may include a plurality of rotatable nozzles disposed in a nozzle plate, wherein the plurality of rotatable nozzles are rotatable individually; a microcontroller to identify a hotspot on a target surface of an IC device, wherein the hotspot has a temperature that is greater than a threshold temperature; and a motor coupled to the plurality of rotatable nozzles, wherein the motor causes one or more of the rotatable nozzles to rotate to impinge fluid on the hotspot.

公开(公告)号：US20210307199A1

公开(公告)日：2021-09-30

申请号：US17342481

申请日：2021-06-08

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam

IPC: H05K7/20 ,  G06F1/20

Abstract: Techniques for heat exchanger networks are disclosed. In the illustrative embodiment, several heat exchangers and several components to be cooled are connected together in a network. The flow of liquid coolant to each component and heat exchanger can be individually controlled. If a particular component needs more or less cooling, the flow rate of coolant through that component can be controlled. If a first component needs more cooling and a second component can operate with less cooling, coolant may be rerouted from the first component to the second component. Thus, target temperature load balancing can be achieved for all the components of the system. If a heat exchanger is faulty, it can be isolated, and a backup heat exchanger can be brought online, making the system self-healing and fault-tolerant. The faulty heat exchanger can then be repaired or replaced while the rest of the system is operational.

公开(公告)号：US10973154B2

公开(公告)日：2021-04-06

申请号：US16336842

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Tong W. Chao ,  Prabhakar Subrahmanyam

IPC: H05K7/20 ,  H02K11/33 ,  H01L23/40 ,  H01L23/473

Abstract: Modular assemblies for thermal management are provided. Modularity permits or facilitates scalable thermal performance with respect to power dissipation demands. Modularity also permits retrofitting a deployed cooling system based at least on a current power dissipation requirement. In some embodiments, a modular assembly can be reversibly reconfigured in order to adjust cooling capacity and fulfill a defined power dissipation target. In some embodiments, a modular assembly can include a liquid-cooled pedestal and multiple liquid-cooled attachment members that can be reversibly coupled to or reversibly decoupled from the liquid-cooled pedestal based at least on a power dissipation condition and/or a change thereof of a dissipative electronic component. The reversible coupling and reversible decoupling of the attachment members can permit or otherwise facilitate reversibly adjusting the heat transfer between the modular assembly and the dissipative electronic component. Scalability of thermal performance of the modular assembly can be achieved, at least in part, by the addition of liquid-cooled attachment members.