公开(公告)号：US20230016098A1

公开(公告)日：2023-01-19

申请号：US17957698

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Navneeth Jayaraj ,  Prabhakar Subrahmanyam ,  Nagaraj K ,  Gopinath K ,  Paniraj Gururaja ,  Mahammad Yaseen Mulla ,  Nitesh Gupta ,  Ying-Feng Pang

IPC: G06F1/20 ,  H05K7/20

Abstract: Example field replaceable fan assemblies for peripheral processing units and related systems and methods are disclosed. An example apparatus includes a temperature sensor; a fan having a base; at least one memory; machine readable instructions; and processor circuitry to execute operations corresponding to the machine readable instructions to determine a first temperature based on an output of the temperature sensor; and cause the base of the fan to move based on the first temperature.

公开(公告)号：US20190324496A1

公开(公告)日：2019-10-24

申请号：US16457046

申请日：2019-06-28

Applicant: Intel Corporation

Inventor： Sumod Cherukkate ,  Gopinath K ,  Prakash Kurma Raju ,  Ajesh K K

IPC: G06F1/16 ,  H04R1/08 ,  H05K1/18 ,  H05K1/11 ,  H05K7/04

Abstract: Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.

公开(公告)号：US11119532B2

公开(公告)日：2021-09-14

申请号：US16457046

申请日：2019-06-28

Applicant: Intel Corporation

Inventor： Sumod Cherukkate ,  Gopinath K ,  Prakash Kurma Raju ,  Ajesh K K

IPC: H05K1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/04 ,  H04R1/00 ,  H04R1/02 ,  H04R1/08 ,  H04R1/10 ,  H04R1/20 ,  H04R1/32 ,  H04R3/00 ,  H04R11/04 ,  H04R19/00 ,  H04M1/00 ,  H04M1/03 ,  G06F1/18 ,  B81B3/00 ,  B81C1/00 ,  G06F1/16 ,  H05K1/11 ,  H05K1/18

Abstract: Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.